Devices with a single metal layer
A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.
1. A micro-transfer printable circuit, comprising:
a pixel substrate; and
a pixel circuit comprising a light-emitting diode and three or more external electrical connections, the pixel circuit disposed on or in the pixel substrate, wherein at least two of the external electrical connections are directly electrically connected to form an electrical jumper that comprises a wire and wherein at least two of the external electrical connections cause the pixel circuit to emit light from the light-emitting diode when provided with electrical signals.
2. The micro-transfer printable circuit of claim 1 , comprising a tether.
3. The micro-transfer printable circuit of claim 2 , wherein the tether is a broken tether.
4. The micro-transfer printable circuit of claim 1 , wherein the pixel circuit comprises a sensor.
5. The micro-transfer printable circuit of claim 4 , comprising a sensor substrate, wherein the pixel substrate is disposed on the sensor substrate.
6. The micro-transfer printable circuit of claim 1 , wherein one of the at least two of the external electrical connections that cause the light-emitting diode to emit light is also one of the at least two external electrical connections that are directly electrically connected to form the electrical jumper.
7. The micro-transfer printable circuit of claim 1 , wherein each of the three or more external electrical connections comprises a connection post protruding from the pixel substrate on a side of the pixel substrate opposite the light-emitting diode.
8. The micro-transfer printable circuit of claim 1 , wherein the pixel circuit comprises one or more inorganic light-emitting diodes.
9. The micro-transfer printable circuit of claim 1 , wherein the pixel circuit comprises one or more organic light-emitting diodes.
10. The micro-transfer printable circuit of claim 1 , wherein the pixel circuit comprises two or more light emitters that each emit a different color of light.
11. The micro-transfer printable circuit of claim 1 , wherein (i) the pixel circuit is a passive circuit.
12. The micro-transfer printable circuit of claim 1 , wherein (i) the pixel circuit is an active circuit that comprises at least one transistor.
13. The micro-transfer printable circuit of claim 1 , comprising a display substrate comprising first and second column line segments, wherein the electrical jumper comprises at least first and second connection posts protruding from the pixel substrate such that (i) the at least two of the external electrical connections comprises the first and second connection posts, (ii) the first connection post in electrical contact with the first column line segment, and (iii) the second connection post in electrical contact with the second column line segment.
14. The micro-transfer printable circuit of claim 1 , wherein the pixel circuit comprises one or more light emitters that are disposed on the pixel substrate.
15. The micro-transfer printable circuit of claim 1 , wherein the pixel substrate is a semiconductor substrate, the pixel circuit comprises a control circuit, and the control circuit is native to the semiconductor substrate.
16. The micro-transfer printable circuit of claim 1 , wherein the pixel circuit comprises at least first and second wires formed on or in the pixel substrate, the pixel circuit comprises a semiconductor substrate that comprises at least first and second connection posts, the first connection post is in electrical contact with the first wire, and the second connection post is in electrical contact with the second wire.
17. The micro-transfer printable circuit of claim 1 , wherein:
the pixel circuit comprises a semiconductor substrate;
the pixel circuit comprises a control circuit native to the semiconductor substrate; and
the semiconductor substrate is disposed on the pixel substrate.
18. The micro-transfer printable circuit of claim 1 , wherein:
the three or more external electrical connections comprises a first connection post and a second connection post each protruding from the pixel substrate on a side of the pixel substrate opposite the light-emitting diode,
the pixel circuit comprises at least a first wire and a second wire formed on or in the pixel substrate,
the light-emitting diode comprises a light-emitting structure electrically connected to the first connection post and the second connection post, and
the first connection post is in electrical contact with the first wire, and the second connection post is in electrical contact with the second wire.
19. The micro-transfer printable circuit of claim 1 , comprising a display substrate having a row conductor and a column conductor segment and wherein the pixel substrate comprises at least row and column connection posts, the row connection post is in electrical contact with the row conductor and the column connection post is in contact with the column conductor segment.
20. The micro-transfer printable circuit of claim 1 , comprising a display substrate, wherein the pixel substrate is disposed on the display substrate.
21. The micro-transfer printable circuit of claim 1 , wherein the at least two of the external electrical connections that are directly electrically connected to form the electrical jumper are different from the at least two of the external electrical connections that cause the pixel circuit to emit light from the light-emitting diode.
22. A micro-transfer printable circuit, comprising:
a pixel substrate; and
a pixel circuit with three or more electrical connections, the pixel circuit disposed on or in the pixel substrate, wherein at least two of the electrical connections are directly electrically connected to form an electrical jumper and wherein at least two of the electrical connections cause the pixel circuit to emit light when provided with electrical signals,
wherein the pixel substrate is a semiconductor substrate, the pixel circuit comprises a control circuit, and the control circuit is native to the semiconductor substrate.
23. A micro-transfer printable circuit, comprising:
a pixel substrate; and
a pixel circuit with three or more electrical connections, the pixel circuit disposed on or in the pixel substrate, wherein at least two of the electrical connections are directly electrically connected to form an electrical jumper and wherein at least two of the electrical connections cause the pixel circuit to emit light when provided with electrical signals,
wherein the pixel circuit comprises a semiconductor substrate, the pixel circuit comprises a control circuit native to the semiconductor substrate, and the semiconductor substrate is disposed on the pixel substrate.