Pressure-activated electrical interconnection with additive repair
A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.
1. A repaired electrical connection structure, comprising:
a substrate comprising a first contact pad and a second contact pad;
a first adhesive layer disposed over and in contact with at least a first portion of the substrate, wherein the first portion is adjacent to, on, or adjacent to and on the first contact pad;
a first component disposed in alignment with, and electrically connected to, the first contact pad, wherein the first adhesive layer contacts at least a portion of the first component between the first component and the substrate;
a second adhesive layer disposed over and in contact with at least a second portion of the substrate, wherein the second portion is adjacent to, on, or adjacent to and on the second contact pad; and
a second component disposed in alignment with, and electrically connected to, the second contact pad, wherein the second adhesive layer contacts at least a portion of the second component between the second component and the substrate and the second adhesive layer is disposed at least partially over the first component and not disposed over the second component,
wherein the first component and the second component are designed to be functionally identical and the first component is a faulty component, and
wherein the first component and the second component do not overlap one another in a direction perpendicular to a surface of the substrate on which the first and the second component are disposed.
2. The repaired electrical connection structure of claim 1 , wherein the first adhesive layer and the second adhesive layer each comprise a common material.
3. The repaired electrical connection structure of claim 1 , wherein the first adhesive layer comprises a first material and the second adhesive layer comprises a second material different than the first material.
4. The repaired electrical connection structure of claim 1 , wherein the first contact pad is electrically connected in parallel with the second contact pad.
5. The repaired electrical connection structure of claim 1 , comprising a first wire disposed on, over, or in the substrate and electrically connected to the first contact pad wherein the first wire is cut.
6. The repaired electrical connection structure of claim 1 , wherein the first component is destroyed.
7. The repaired electrical connection structure of claim 1 , wherein the first adhesive layer is not present in the second portion.
8. The repaired electrical connection structure of claim 1 , wherein the first adhesive layer is disposed only between the first component and the substrate.
9. The repaired electrical connection structure of claim 1 , wherein the second adhesive layer is unpatterned.
10. The repaired electrical connection structure of claim 1 , wherein the first adhesive layer is a layer of thermally cured adhesive or radiation cured adhesive.
11. The repaired electrical connection structure of claim 1 , wherein the second adhesive layer is a layer of thermally cured adhesive or radiation cured adhesive.
12. The repaired electrical connection structure of claim 1 , wherein (i) the first component comprises a first connection post, (ii) the second component comprises a second connection post, or (iii) both (i) and (ii).
13. The repaired electrical connection structure of claim 1 , wherein (i) the first component comprises a first connection post and the first connection post is pressed into electrical contact with first contact pad, (ii) the second component comprises a second connection post and the second connection post is pressed into electrical contact with second contact pad, or (iii) both (i) and (ii).
14. The repaired electrical connection structure of claim 1 , wherein (i) the first component is electrically connected to the first contact pad with a first electrode, (ii) the second component is electrically connected to the second contact pad with a second electrode, or (iii) both (i) and (ii).
15. The repaired electrical connection structure of claim 1 , wherein the first component and the second component are each a light-emitting diode.
16. The repaired electrical connection structure of claim 1 , wherein solder is disposed on the first contact pad, solder is disposed on the second contact pad, or solder is disposed on the first contact pad and on the second contact pad.
17. The repaired electrical connection structure of claim 16 , wherein the first adhesive layer comprises a thermally curable resin that cures at a cure temperature greater than or equal to a melting temperature of the solder.
18. The repaired electrical connection structure of claim 1 , wherein the second adhesive layer comprises a thermally curable, or thermally cured, resin.