Printing components to substrate posts
A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
1. A printed structure, comprising:
a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface, the substrate post comprising a substrate post material that is a dielectric adhesive; and
a printed component having a component top side and a component bottom side opposite the component top side that is non-native to the substrate post,
wherein the component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post so that (i) the substrate post contacts only a portion of a bottom surface of the component, (ii) the component contacts only the substrate post, and (iii) a component center of the component is disposed directly over the substrate post.
2. The printed structure of claim 1 , wherein the dielectric adhesive is a cured dielectric adhesive.
3. The printed structure of claim 1 , wherein the dielectric adhesive is an uncured dielectric adhesive.
4. The printed structure of claim 1 , wherein the dielectric adhesive comprises an organic material, a polymer, a resin, or an epoxy.
5. The printed structure of claim 1 , wherein the patterned substrate comprises a plurality of substrate posts disposed as a dielectric adhesive layer defining a pattern of the patterned substrate.
6. The printed structure of claim 1 , wherein the component comprises a broken or separated component tether.
7. The printed structure of claim 1 , wherein the dielectric adhesive comprises photoresist.
8. The printed structure of claim 1 , wherein the substrate post forms a ridge that extends in one direction beyond the component disposed on the substrate post in a direction parallel to the substrate surface, and wherein the component extends over two opposite sides of the substrate post.
9. The printed structure of claim 8 , comprising two or more components disposed on the ridge.
10. The printed structure of claim 1 , wherein, the substrate post is disposed directly between a center of the component and the substrate surface.
11. The printed structure of claim 1 , wherein the component is adhered to the substrate post.
12. The printed structure of claim 1 , comprising (i) a wire bonded to a component electrode disposed on the component, (ii) a wire bonded to a substrate post electrode on the substrate post, or (iii) both (i) and (ii).
13. The printed structure of claim 1 , wherein the printed structure is a printable module comprising at least a portion of a module tether connected to the patterned substrate.
14. The printed structure of claim 1 , wherein the component comprises a piezoelectric material.
15. The printed structure of claim 1 , wherein
(i) the component extends over an edge of the substrate post in two dimensions;
(ii) the component extends over two or more sides of the post; or
(iii) the component extends over an edge of substrate post in one dimension or direction and does not extend over an edge of substrate post in a dimension or direction orthogonal to the one dimension or direction.
16. A printed structure, comprising:
a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface, the substrate post comprising a substrate post material that is a dielectric adhesive; and
a printed component having a component top side and a component bottom side opposite the component top side and non-native to the substrate post,
wherein the component bottom side is disposed on the substrate post and extending over at least one edge of the substrate post so that the substrate post contacts only a portion of a bottom surface of the component and the component only contacts the substrate post,
wherein
(i) the component extends over an edge of the substrate post in two dimensions;
(ii) the component extends over two or more sides of the post; or
(iii) the component extends over an edge of substrate post in one dimension or direction and does not extend over an edge of substrate post in a dimension or direction orthogonal to the one dimension or direction.