Print-ready wafers with bottom-anchored components
A printable-component structure includes a carrier substrate, a bonding layer disposed on the carrier substrate, a solid weak-adhesion layer disposed on at least a portion of the bonding layer, at least a portion of a component disposed directly on and in contact with at least a portion of the weak-adhesion layer, and a release layer disposed in contact with at least a portion of the component. The component is adhered to the weak-adhesion layer with a force that is less than the adhesion between the component and a stamp, such as a PDMS stamp. The component can include a protruding post in sole contact with the weak-adhesion layer.
1 . A printable-component structure, comprising:
a carrier substrate;
a bonding layer disposed on the carrier substrate;
a solid weak-adhesion layer disposed on the bonding layer;
a component disposed directly on and in contact with the weak-adhesion layer; and
a sacrificial release layer disposed in contact with the component.
2 . The printable-component structure of claim 1 , wherein the release layer is in direct contact with the bonding layer.
3 . The printable-component structure of claim 1 , wherein the release layer is in contact with the weak-adhesion layer.
4 . The printable-component structure of claim 1 , wherein the release layer is disposed between the component and the bonding layer.
5 . The printable-component structure of claim 1 , wherein the component comprises one or more posts that protrude from the component and are directly on and in contact with the weak-adhesion layer.
6 . The printable-component structure of claim 5 , wherein the post(s) extend through the release layer to the weak-adhesion layer.
7 . The printable-component structure of claim 5 , wherein each of the post(s) has a distal end and a proximal end, wherein the distal end has a smaller area than the proximal end.
8 . The printable-component structure of claim 5 , wherein (i) the post(s) comprise gold, (ii) the weak-adhesion layer comprises silicon dioxide, or (iii) both (i) and (ii).
9 . The printable-component structure of claim 5 , comprising a component circuit disposed in the component and wherein the post(s) are electrically conductive and electrically connected to the component circuit.
10 . A printable-component structure, comprising:
a carrier substrate;
a solid bonding-and-weak-adhesion layer disposed on the carrier substrate;
a component disposed directly on and in contact with the bonding-and-weak-adhesion layer;
a stamp in contact with the component; and
a sacrificial release layer disposed in contact with the component,
wherein (i) the component is adhered more strongly to the stamp than to the solid bonding-and-weak-adhesion layer and (ii) the solid bonding-and-weak-adhesion layer is adhered more strongly to the carrier substrate than to the component.
11 . The printable-component structure of claim 10 , wherein the component comprises one or more posts that penetrate or are at least partially embedded in the solid bonding-and-weak-adhesion layer.
12 . A printable-component structure, comprising:
a carrier substrate;
a solid bonding-and-weak-adhesion layer disposed on the carrier substrate;
a component disposed directly on and in contact with the solid bonding-and-weak-adhesion layer; and
a sacrificial release layer disposed in contact with the component,
wherein the component comprises one or more posts that penetrate or are at least partially embedded in the solid bonding-and-weak-adhesion layer.
13 . The printable-component structure of claim 12 , wherein only the one or more posts of the component penetrate or are at least partially embedded in the solid bonding-and-weak-adhesion layer.
14 . A printable-component structure, comprising:
a carrier substrate;
a bonding layer disposed on the carrier substrate;
a solid weak-adhesion layer disposed on the bonding layer; and
a component comprising one or more posts protruding from a first side of the component, wherein the one or more posts are disposed in contact with the weak-adhesion layer such that no other portion of the component is in contact with the weak-adhesion layer other than the one or more posts.
15 . A printable-component structure, comprising:
a carrier substrate;
a bonding layer disposed on the carrier substrate;
a solid weak-adhesion layer disposed on the bonding layer;
a component disposed directly on and in contact with the weak-adhesion layer; and
a release layer disposed in contact with the component,
wherein the release layer is disposed between the component and the weak-adhesion layer.
16 . A printable-component structure, comprising:
a carrier substrate;
a bonding layer disposed on the carrier substrate;
a solid weak-adhesion layer disposed on the bonding layer;
a component disposed directly on and in contact with the weak-adhesion layer; and
a release layer disposed in contact with the component,
wherein the component comprises one or more posts that protrude from the component and are directly on and in contact with the weak-adhesion layer, and
wherein no portion of the component other than the one or more posts is disposed directly on and in contact with the weak-adhesion layer.
17 . A printable-component structure, comprising:
a carrier substrate;
a bonding layer disposed on the carrier substrate;
a solid weak-adhesion layer disposed on the bonding layer;
a component disposed directly on and in contact with the weak-adhesion layer; and
a release layer disposed in contact with the component,
wherein a side of the component in contact with the weak-adhesion layer comprises a noble metal such that only the noble metal contacts the weak-adhesion layer.
18 . The printable-component structure of claim 17 , wherein the weak-adhesion layer comprises a dielectric such that the component contacts the weak-adhesion layer only by contact between the noble metal and the dielectric.
19 . A printable-component structure, comprising:
a carrier substrate;
a solid bonding-and-weak-adhesion layer disposed on the carrier substrate;
a component disposed directly on and in contact with the solid bonding-and-weak-adhesion layer; and
a release layer disposed in contact with the component,
wherein the component comprises one or more posts that penetrate or are at least partially embedded in the solid bonding-and-weak-adhesion layer,
wherein the release layer is disposed between a portion of the component and a portion of the solid bonding-and-weak-adhesion layer.
20 . A printable-component structure, comprising:
a carrier substrate;
a bonding layer disposed on the carrier substrate;
a solid weak-adhesion layer disposed on the bonding layer; and
a component comprising one or more posts protruding from a first side of the component, wherein the one or more posts are disposed in contact with the weak-adhesion layer such that no other portion of the component is in contact with the weak-adhesion layer other than the one or more posts,
wherein the one or more posts comprise a noble metal such that only the noble metal contacts the weak-adhesion layer.
21 . The printable-component structure of claim 20 , wherein the weak-adhesion layer comprises a dielectric such that only the dielectric contacts the noble metal.
22 . The printable-component structure of claim 21 , wherein the one or more posts is two or more posts and a gap exists between a bottom side of the component and the weak-adhesion layer in a region bounded by the two or more posts.