Chiplets with connection posts
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
1. A method of making a printable component, comprising:
providing a forming substrate having two or more forms in a surface of the substrate;
disposing a patterned layer of conductive material at least in the forms to make connection posts;
disposing a first dielectric layer over the patterned layer of conductive material and the forming substrate;
disposing a chiplet having chiplet contact pads on the first dielectric layer;
forming conductors electrically connecting the connection posts to the chiplet contact pads; and
defining the printable component to form a release layer and anchors in the forming substrate connected by tethers to the printable component.
2. The method of claim 1 , comprising:
providing a destination substrate having two or more backplane contact pads; and
micro transfer printing the printable component to the destination substrate so that each connection post is in contact with, extends into, or extends through a backplane contact pad of the destination substrate to electrically connect the backplane contact pads to the connection posts and the chiplet contact pads.
3. The method of claim 1 , comprising:
disposing a patterned second dielectric layer over the first dielectric layer, the conductors, and the chiplet.
4. The method of claim 1 , wherein the printable component has at least one of a width, length, and height from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, or 20 to 50 μm.
5. The method of claim 1 , wherein the printable component is a light-emitting diode, photo-diode, or transistor.
6. The method of claim 2 , wherein the backplane contact pad is a non-planar contact with a perimeter portion surrounding a recessed central portion and the connection post is inserted into the non-planar contact.
7. The method of claim 6 , wherein the connection post (i) has a sharp point or is substantially pyramidal and (ii) has planar sides, and wherein the connection post has a height, length, or width less than 50 microns.
8. The method of claim 6 , wherein the non-planar contact is sized and shaped to accept the connection post.
9. The method of claim 6 , wherein the non-planar contact has a first shape and the connection post has a second shape different from the first shape.
10. The method of claim 6 , wherein the non-planar contact has planar sides.
11. The method of claim 6 , wherein the non-planar contact has sides that come to a sharp point or the non-planar contact is substantially pyramidal.
12. The method of claim 1 , wherein the conductive material is a metal.
13. The method of claim 1 , wherein the dielectric material is silicon dioxide, silicon nitride, a resin, a polymer, or a cured resin.
14. The method of claim 1 , comprising etching the forming substrate to form connection posts and a release layer and anchors in the forming substrate connected by tethers to the chiplet or dielectric layer.
15. A method of making a printed structure, comprising:
providing a source substrate comprising a sacrificial portion and an anchor;
providing a chiplet disposed entirely over the sacrificial portion and attached to the anchor with a tether, wherein the chiplet comprises a chiplet substrate and a connection post protruding from the chiplet substrate;
providing a destination substrate comprising a non-planar contact, wherein the non-planar contact is shaped to accept the connection post;
printing the chiplet from the source substrate to the destination substrate by contacting the chiplet with a stamp, breaking the tether, removing the chiplet from the source substrate, disposing the chiplet on the destination substrate with the connection post in the non-planar contact, and removing the stamp.
16. The method of claim 15 , wherein the connection post extends into the sacrificial portion prior to the printing.
17. The method of claim 15 , comprising disposing an adhesive on the non-planar contact before printing the chiplet.
18. The method of claim 15 , wherein the sacrificial portion is differentially etchable from the connection post, the chiplet substrate, or both the connection post and the chiplet substrate.
19. The method of claim 15 , wherein the non-planar contact has a perimeter portion surrounding a recessed central portion sized and shaped to accept the connection post, and
wherein the connection post is inserted into the non-planar contact,
wherein the connection post (i) has a sharp point or is substantially pyramidal and (ii) has planar sides, and
wherein the connection post has a height, length, or width less than 50 microns.
20. The method of claim 19 , wherein the non-planar contact has planar sides.
21. The method of claim 19 , wherein the non-planar contact has sides that come to a sharp point or the non-planar contact is substantially pyramidal.