Chiplets with connection posts
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
1. A micro-transfer-printable component structure, comprising:
a chiplet comprising a semiconductor substrate and one or more chiplet contact pads;
a dielectric layer comprising dielectric material, wherein the chiplet is on a first side of the dielectric layer;
a plurality of electrical connections electrically connected to the one or more chiplet contact pads, wherein
(i) each of the electrical connections comprises an electrically conductive connection post protruding from the dielectric layer on a second side of the dielectric layer opposite the first side,
(ii) the connection post is a multi-layer connection post comprising a portion of the dielectric material that is coated with a conductive material,
(iii) the connection post has a sharp point, and
(iv) the connection post has a base adjacent to the dielectric layer and a peak forming the sharp point; and
a tether connected to the dielectric layer,
wherein the dielectric layer has a thickness less than or equal to 25 microns and the micro-transfer-printable component structure has a width and a length each less than or equal to 200 microns and a thickness of from 2 μm to 50 μm.
2. The component structure of claim 1 , wherein the plurality of electrical connections comprises two or more connection posts that are directly electrically connected to each other.
3. The component structure of claim 2 , wherein the two or more connection posts comprise a first connection post and a second connection post having a different height from the first connection post.
4. The component structure of claim 2 , wherein the connection posts are disposed in groups and a spacing between adjacent connection posts within a given group is less than a spacing between adjacent groups.
5. The component structure of claim 4 , wherein connection posts within the given group are electrically shorted together.
6. The component structure of claim 1 , wherein the chiplet comprises a light-emitting diode, photo-diode, or transistor.
7. The component structure of claim 1 , wherein the connection posts have substantially planar sides or are substantially pyramidal.
8. The component structure of claim 1 , wherein the chiplet is an active component comprising an active element or a passive component comprising a passive element.
9. The component structure of claim 1 , wherein the chiplet has at least one of a width and a length, from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, or 20 to 50 μm.
10. The component structure of claim 1 , wherein the chiplet contact pads are on a common side of the chiplet opposite the dielectric layer and wherein a portion of the chiplet contact pads are connected to the electrically conductive connection post exclusively with a patterned electrical conductor layer.
11. The component structure of claim 1 , wherein the chiplet contact pads are on a common side of the chiplet adjacent to the dielectric layer.
12. The component structure of claim 1 , wherein the peak is centered over the base.
13. The component structure of claim 1 , wherein the chiplet is a compound structure comprising active elements, passive elements, or a combination of one or more active elements and one or more passive elements.
14. The component structure of claim 1 , wherein at least a portion of the second side is exposed.
15. The component structure of claim 1 , wherein the dielectric layer has a thickness less than or equal to 15 microns and the micro-transfer-printable component structure and a thickness of from 2 μm to 20 μm.