IP Library › Assignment 041932/0462
Patent Assignment
Reel/Frame 041932/0462

Release of Security Interest

Recorded: 2017-04-07 Pages: 10
Assignors
SILICON VALLEY BANK
Executed: 2017-03-30
HORIZON FUNDING TRUST 2013-1
Executed: 2017-03-30
Assignee
SEMPRIUS INC.
4915 PROSPECTUS DRIVE, SUITE C, DURHAM, NORTH CAROLINA, 27713
Covered Properties (28)
Reinforced Composite Stamp for Dry Transfer Printing of Semiconductor Elements
Patent: 7,927,976 →
Application: 12/177,963 →
Publication: US 2010/0018420
Oled Device with Embedded Chip Driving
Patent: 7,999,454 →
Application: 12/191,478 →
Publication: US 2010/0039030
Printable, Flexible and Stretchable Diamond for Thermal Management
Patent: 8,470,701 →
Application: 12/418,071 →
Publication: US 2010/0052112
Vacuum Coupled Tool Apparatus for Dry Transfer Printing Semiconductor Elements
Patent: 8,261,660 →
Application: 12/507,262 →
Publication: US 2011/0018158
Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp Transfer
Patent: 8,506,867 →
Application: 12/621,804 →
Publication: US 2010/0123268
Concentrator-Type Photovoltaic (Cpv) Modules, Receiver and Sub-Receivers and Methods of Forming Same
Application: 12/702,841 →
Publication: US 2010/0236603
Methods of Forming Printable Integrated Circuit Devices by Selective Etching to Suspend the Devices from a Handling Substrate and Devices Formed Thereby
Patent: 8,877,648 →
Application: 12/732,868 →
Publication: US 2010/0248484
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Patent: 9,412,727 →
Application: 13/237,375 →
Publication: US 2013/0069275
Interconnection Structures and Methods for Transfer-Printed Integrated Circuit Elements with Improved Interconnection Alignment Tolerance
Patent: 9,899,329 →
Application: 13/302,497 →
Publication: US 2012/0126229
Laser Assisted Transfer Welding Process
Patent: 9,161,448 →
Application: 13/352,876 →
Publication: US 2012/0115262
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Patent: 9,165,989 →
Application: 13/395,813 →
Publication: US 2012/0228669
Methods for Surface Attachment of Flipped Active Components
Patent: 8,889,485 →
Application: 13/491,196 →
Publication: US 2012/0313241
Substrates with Transferable Chiplets
Patent: 8,934,259 →
Application: 13/491,335 →
Publication: US 2012/0314388
Moisture-Proof Expansion Chamber for Equalizing Pressure in Sealed Concentrator Photovoltaic Solar Modules
Application: 13/520,911 →
Publication: US 2013/0125956
Breathing and Desiccant Regenerating Cycle for Reducing Condensation in Concentrator Photovoltaic Modules
Patent: 8,894,754 →
Application: 13/571,972 →
Publication: US 2013/0036909
Methods of Selectively Transferring Active Components
Patent: 9,496,155 →
Application: 13/638,019 →
Publication: US 2013/0273695
Electrically Bonded Arrays of Transfer Printed Active Components
Patent: 9,049,797 →
Application: 13/638,040 →
Publication: US 2013/0153277
Photovoltaic Devices with Off-Axis Image Display
Application: 13/700,411 →
Publication: US 2013/0153934
High Concentration Photovoltaic Modules and Methods of Fabricating the Same
Application: 13/705,980 →
Publication: US 2013/0146120
Apparatus and Process for Producing Plano-Convex Silicone-On-Glass Lens Array
Application: 61/367,491 →
Structures and Methods for Testing Printable Integrated Circuits
Application: 61/377,131 →
Surface-Mountable Lens Cradles and Interconnection Structures for Concentrator-Type Photovoltaic Devices
Application: 61/677,892 →
Surface Mountable Solar Receiver with Integrated Through Substrate Interconnect and Optical Element Cradle
Application: 61/683,958 →
Indirect Temperature Measurements of Direct Bandgap (Multijunction) Solar Cells Using Wavelength Shifts of Sub-Junction Luminescence Emission Peaks
Application: 61/704,889 →
Power Augmentation in Concentrator Photovoltaic Modules by Collection of Diffuse Light
Application: 61/782,622 →
High Efficiency Solar Receivers Including Stacked Solar Cells for Concentrator Photovoltaics
Application: 61/782,983 →
Through-Silicon Vias And Interposers Formed By Metal-Catalyzed Wet Etching
Application: 61/788,452 →
Engineered Substrates for Semiconductor Epitaxy
Application: 61/788,526 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 14, 2008
From: WINTERS, DUSTIN L.; HAMER, JOHN W.; PARRETT, GARY; BOWER, CHRISTOPHER
To: EASTMAN KODAK COMPANY; SEMPRIUS, INC.
Reel/Frame 021389/0879 →
Assignment of Assignor's Interest Sep 22, 2008
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 021564/0278 →
Assignment of Assignor's Interest Sep 10, 2009
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023211/0629 →
Assignment of Assignor's Interest Dec 7, 2009
From: ROGERS, JOHN A.; KIM, TAE HO; CHOI, WON MOOK; KIM, DAE HYEONG
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 023615/0876 →
Assignment of Assignor's Interest Dec 8, 2009
From: MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 023621/0400 →
Assignment of Assignor's Interest Jan 15, 2010
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023795/0173 →
Assignment of Assignor's Interest Mar 11, 2010
From: EASTMAN KODAK COMPANY
To: GLOBAL OLED TECHNOLOGY LLC
Reel/Frame 024068/0468 →
Assignment of Assignor's Interest Mar 26, 2010
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 024147/0249 →
Assignment of Assignor's Interest Jun 9, 2010
From: MENARD, ETIENNE; BOWER, CHRISTOPHER; BURROUGHS, SCOTT; CARR, JOE
To: SEMPRIUS, INC.
Reel/Frame 024508/0626 →
Assignment of Assignor's Interest Nov 22, 2011
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 027268/0179 →
Assignment of Assignor's Interest Dec 6, 2011
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 027339/0120 →
Assignment of Assignor's Interest Dec 6, 2011
From: ROGERS, JOHN A.; KIM, SEOK; CARLSON, ANDREW
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 027338/0080 →
Assignment of Assignor's Interest Dec 22, 2011
From: CARLISLE, JOHN
To: ADVANCED DIAMOND TECHNOLOGIES, INC.
Reel/Frame 027435/0323 →
Assignment of Assignor's Interest Jan 18, 2012
From: ROGERS, JOHN A.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 027553/0989 →
Assignment of Assignor's Interest Jan 18, 2012
From: MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 027553/0892 →
Assignment of Assignor's Interest May 30, 2012
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; HAMER, JOHN; COK, RONALD S.
To: SEMPRIUS, INC.
Reel/Frame 028288/0001 →
Assignment of Assignor's Interest Jun 7, 2012
From: BOWER, CHRISTOPHER; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 028338/0230 →
Assignment of Assignor's Interest Jun 7, 2012
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 028337/0872 →
Assignment of Assignor's Interest Aug 21, 2012
From: MENARD, ETIENNE; BURROUGHS, SCOTT
To: SEMPRIUS, INC.
Reel/Frame 028821/0974 →
Assignment of Assignor's Interest Dec 3, 2012
From: MENARD, ETIENNE; BOWER, CHRISTOPHER; MEITL, MATTHEW; GARROU, PHILIP
To: SEMPRIUS, INC.
Reel/Frame 029393/0807 →
Assignment of Assignor's Interest Dec 11, 2012
From: MENARD, ETIENNE; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 029447/0370 →
Assignment of Assignor's Interest Feb 6, 2013
From: FURMAN, BRUCE; MENARD, ETIENNE; BUKOVNIK, RUDY; BURROUGHS, SCOTT
To: SEMPRIUS, INC.
Reel/Frame 029767/0378 →
Security Agreement Oct 30, 2014
From: SEMPRIUS INC.
To: SILICON VALLEY BANK; HORIZON TECHNOLOGY FINANCE CORPORATION, AS COLLATERAL AGENT; HORIZON FUNDING TRUST 2013-1
Reel/Frame 034098/0475 →
Assignment of Assignor's Interest Apr 11, 2017
From: SEMPRIUS, INC.
To: SEMPRIUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 042231/0140 →
Assignment of Assignor's Interest Apr 13, 2017
From: SEMPRIUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: X-CELEPRINT LIMITED
Reel/Frame 042244/0531 →