IP Library › Patent Application 61788452
Patent Application Provisional Small
App. No. 61/788,452 · Confirmation No. 4084

Through-Silicon Vias And Interposers Formed By Metal-Catalyzed Wet Etching

Applicant: X-Celeprint Limited
Provisional Application Expired
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 Code Description Pages PDF
2017-05-30 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-05-30 APP.FILE.REC Filing Receipt 3 View
2017-05-25 PA.. Power of Attorney 3 View
2017-05-25 R3.73 Assignee showing of ownership per 37 CFR 3.73 3 View
2017-05-25 TRAN.LET Transmittal Letter 1 View
2017-05-25 ADS Application Data Sheet 8 View
2017-05-25 N417 Electronic Filing System Acknowledgment Receipt 2 View
2013-04-18 APP.FILE.REC Filing Receipt 3 View
2013-03-15 TR.PROV Provisional Cover Sheet (SB16) 2 View
2013-03-15 SPEC Specification 16 View
2013-03-15 CLM Claims 1 View
2013-03-15 WFEE Fee Worksheet (SB06) 2 View
2013-03-15 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/788,452
Filed
2013-03-15