Structures and methods for electrically connecting printed components
A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.
1. A printed structure, comprising:
a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate;
a component disposed on the surface; and
two or more electrically conductive connection posts, each of the connection posts (i) is formed on and extending from a common side of the component, (ii) being in electrical and physical contact with one of the contact pads, and (iii) is in direct physical contact with and pierces or is embedded in the one of the contact pads,
wherein the component is tilted with respect to the surface of the destination substrate, and
wherein each of the connection posts has a flat distal surface, and
wherein ones of the connection posts extend from different surfaces on the common side, the different surfaces being disposed in different planes with respect to the component.
2. The printed structure of claim 1 , wherein each of the connection posts has one or more sharp edges and at least a portion of the one or more sharp edges is in electrical and physical contact with and pierces or is embedded in the one of the contact pads.
3. The printed structure of claim 1 , wherein each of the connection posts has a post length greater than a post width, the component has a component length greater than a component width, and a direction of the component length is orthogonal to a direction of the post length.
4. The printed structure of claim 1 , wherein the connection posts have a common height.
5. The printed structure of claim 1 , wherein the component comprises a substantially planar side opposite the common side and the substantially planar side is not parallel to the surface of the destination substrate.
6. The printed structure of claim 1 , wherein the component comprises a broken or separated tether.
7. The printed structure of claim 1 , wherein each of the connection posts has an inverted trapezoidal vertical cross section.
8. The printed structure of claim 1 , wherein the connection posts have different heights.
9. The printed structure of claim 1 , wherein the connection posts (i) are tapered, (ii) have a height-to-width aspect ratio of greater than 1:1, or both (i) and (ii).
10. The printed structure of claim 1 , wherein the component has at least one of a width, a length, and a height from 2 to 100 μm.
11. The printed structure of claim 1 , comprising:
a plurality of components disposed on the surface, wherein each component of the plurality of components is tilted with respect to the surface; and
respective connection posts extending from each of the plurality of components, wherein each of the respective connection posts has a flat distal surface and is in electrical and physical contact with one of the contact pads.
12. The printed structure of claim 1 , wherein the component comprises two or more electrical contacts disposed on the common side of the component, wherein the connection posts are each electrically connected to at least one of the electrical contacts.
13. The printed structure of claim 12 , wherein at least one of the connection posts extends from an electrical contact of the two or more electrical contacts.
14. The printed structure of claim 12 , wherein the component comprises an electrically separate electrode electrically connected to at least one of the electrical contacts and at least one of the connection posts extends from the electrode.
15. The printed structure of claim 1 , wherein the component is a completed semiconductor device.
16. The printed structure of claim 1 , wherein each of the connection posts pierces, is embedded in, or both pierces and is embedded in the one of the contact pads.
17. The printed structure of claim 1 , wherein each of the connection posts has a round or rectangular cross section.
18. The printed structure of claim 1 , wherein each of the connection posts has a rectangular cross section with an aspect ratio of at least 2.
19. The printed structure of claim 1 , wherein each of the connection posts has an inverted trapezoidal vertical cross section.
20. The printed structure of claim 1 , wherein the one of the contact pads comprises a contact pad post and each of the connection posts contacts the contact pad post of the one of the contact pads substantially at a point.