Printed components on substrate posts
A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.
1. A device structure, comprising:
a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface, the substrate post comprising a substrate post material; and
a component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post and extending over at least one edge of the substrate post, the component comprising a component material different from the substrate post material, and the component comprising a broken or separated component tether.
2. The device structure of claim 1 , wherein the component is a first component and the device structure comprises a second component adhered to the substrate post.
3. The device structure of claim 1 , wherein the substrate post is a ridge with a length greater than a width and wherein the substrate post has a substrate post top side to which the component bottom side is adhered.
4. The device structure of claim 1 , comprising one or more substrate post electrodes on the substrate post top side, the one or more substrate post electrodes electrically connected to the component.
5. The device structure of claim 1 , wherein the substrate post is electrically conductive and is electrically connected to the component.
6. The device structure of claim 1 , comprising one or more component top electrodes disposed on the component top side.
7. The device structure of claim 6 , comprising (i) a wire bond electrically connected to at least one of the one or more component top electrodes, (ii) a substrate post electrode disposed on the substrate post and comprising a wire bond electrically connected to the substrate post electrode, or (iii) both (i) and (ii).
8. The device structure of claim 6 , wherein the substrate post is electrically conductive or comprises one or more substrate post electrodes that are each electrically connected to at least one of the one or more component top electrodes.
9. The device structure of claim 1 , comprising one or more component bottom electrodes disposed on the component bottom side.
10. The device structure of claim 9 , wherein the substrate post is electrically conductive or comprises one or more substrate post electrodes that are each electrically connected to at least one of the one or more component bottom electrodes.
11. The device structure of claim 1 , wherein the component has at least one of a length and a width less than or equal to 200 microns.
12. The device structure of claim 1 , wherein the substrate post is electrically conductive or comprises one or more substrate post electrodes.
13. The device structure of claim 1 , wherein the component material is a semiconductor.
14. The device structure of claim 1 , wherein the substrate post material is a dielectric.
15. The device structure of claim 1 , wherein the substrate post material is an electrical conductor.
16. The device structure of claim 1 , wherein the component extends over at least two sides of the substrate post.
17. The device structure of claim 1 , wherein the component extends over opposing sides of the substrate post.
18. The device structure of claim 1 , wherein the component is rectangular, is plus sign shaped, or is disc shaped.
19. The device structure of claim 1 , wherein the component is adhered or attached to the patterned substrate only by the component bottom side.
20. The device structure of claim 1 , wherein the component is an electronic or an opto-electronic component and comprises an electronic circuit.
21. The device structure of claim 20 , wherein the component is responsive to at least one of electrical energy, optical energy, electromagnetic energy, and mechanical energy.
22. The device structure of claim 1 , wherein the patterned substrate is a semiconductor substrate comprising an electronic circuit.
23. The device structure of claim 1 , wherein the device structure is a printable module and comprises at least a portion of a module tether connected to the patterned substrate.
24. The device structure of claim 1 , wherein the component comprises electrically conductive connection posts.
25. The device structure of claim 1 , wherein the broken or separated component tether is a fractured tether.
26. The device structure of claim 1 , wherein the substrate post is a first substrate post and the patterned substrate comprises a second substrate post, and wherein the component is disposed on both the first substrate post and the second substrate post.
27. The device structure of claim 1 , wherein the substrate post is formed on and protrudes from the substrate surface.