IP Library Patent Application 16207738
Patent Application
App. No. 16/207,738

MODULE STRUCTURES WITH COMPONENT ON SUBSTRATE POST

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Quick Facts
Patent No.
US None
App. No.
16/207,738
Abstract

A module structure comprises a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post. The component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.

Claims (29)

1 . A module structure, comprising:

a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface; and

a component disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post, the component extending over at least one edge of the substrate post; and

one or more component electrodes disposed on the component.

2 . The module structure of claim 1 , wherein the one or more component electrodes comprise (i) a component top electrode disposed on the component top side, (ii) a component bottom electrode disposed on the component bottom side, or (iii) both (i) and (ii).

3 . The module structure of claim 1 , comprising a cavity formed or disposed in or on the patterned substrate, the cavity having a cavity floor and one or more cavity walls, and wherein the substrate post is disposed on the cavity floor.

4 . The module structure of claim 3 , wherein the one or more cavity walls are formed on the patterned substrate.

5 . The module structure of claim 3 , comprising a cap disposed over the cavity.

6 . The module structure of claim 5 , wherein the cavity walls are formed on the patterned substrate and adhered to the cap with adhesive.

7 . The module structure of claim 5 , wherein the cap comprises a broken or separated cap tether.

8 . The module structure of claim 3 , comprising two or more substrate posts disposed within the cavity.

9 . The module structure of claim 3 , comprising two or more components disposed within the cavity.

10 . The module structure of claim 9 , wherein the one or more component electrodes of each of the two or more components disposed within the cavity are electrically connected.

11 . The module structure of claim 1 , comprising a cap comprising cavity walls, the cap adhered to the cavity floor with adhesive and defining a cavity around the component.

12 . The module structure of claim 11 , wherein the cap comprises a broken or separated cap tether.

13 . The module structure of claim 11 , comprising two or more substrate posts disposed within the cavity.

14 . The module structure of claim 11 , comprising two or more components disposed within the cavity.

15 . The module structure of claim 14 , wherein the one or more component electrodes of each of the two or more components disposed within the cavity are electrically connected.

16 . The module structure of claim 1 , wherein the component comprises a broken or separated component tether.

17 . The module structure of claim 1 , wherein the component is adhered or attached to the substrate or substrate post only on the component bottom side.

18 . (canceled)

19 . The module structure of claim 1 , wherein the component comprises a piezo-electric material.

20 . (canceled)

21 . The module structure of claim 19 , wherein the one or more component electrodes comprises a top component electrode disposed on the component top side and a bottom component electrode disposed on the component bottom side.

22 . (canceled)

23 . The module structure of claim 1 , wherein the component comprises a component material different from a substrate post material.

24 - 27 . (canceled)

28 . The module structure of claim 1 , comprising a broken or separated module tether connected to the patterned substrate.

29 . The module structure of claim 1 , wherein the component comprises electrically conductive connection posts.

Assignments (3)
CHANGE OF NAME Recorded Sep 16, 2021
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 057500/0658 →
CHANGE OF NAME Recorded May 11, 2020
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 052631/0800 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2019
From: ROTZOLL, ROBERT R.; TRINDADE, ANTÓNIO JOSÉ MARQUES; GUL, RAJA FAZAN; CHIKHAOUI, ALEXANDRE; GOMEZ, DAVID; COK, RONALD S.
To: X-CELEPRINT LIMITED
Reel/Frame 048347/0739 →