Printing component arrays with different orientations
A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.
1. A method of micro-transfer printing, comprising:
providing a component source wafer and components disposed in, on, or over the component source wafer, providing a destination substrate, and providing a stamp for transferring components from the component source wafer to the destination substrate, wherein structure, operation, appearance, or performance of different ones of the components in different locations varies across the component source wafer;
transferring, with the stamp, a first array of components from the component source wafer to the destination substrate with a first orientation of the components on the destination substrate; and
transferring, with the stamp, a second array of components from the component source wafer to the destination substrate with a second orientation of the components on the destination substrate, wherein the second orientation of the components on the destination substrate is different from the first orientation of the components on the destination substrate.
2. The method of claim 1 , wherein the second orientation is rotated relative to the first array to provide different first and second orientations.
3. The method of claim 2 , wherein the second orientation is rotated 90 degrees or 270 degrees with respect to the first orientation.
4. The method of claim 2 , wherein the second orientation is rotated 180 degrees with respect to the first orientation.
5. The method of claim 1 , comprising transferring the second array of components adjacent to the first array of components on the destination substrate.
6. The method of claim 1 , comprising repeatedly transferring arrays of components from the component source wafer to the destination substrate with adjacent arrays on the destination substrate transferred at different orientations.
7. The method of claim 6 , comprising repeatedly transferring arrays of components from the component source wafer to the destination substrate N times in one dimension, where N/2 pairs of adjacent arrays on the destination substrate comprise array i and array (N−1−i) for each i from 0 to (N/2)−1.
8. The method of claim 6 , comprising repeatedly transferring arrays of components from the component source wafer to the destination substrate N×M times in two dimensions, where N/2×M/2 two-by-two adjacent component arrays on the destination substrate comprise array (i, j), array (N−1−i, j), array (i, M−1−j), and array (N−1−i, M−1−j) for each i from 0 to (N/2)−1 and each j from 0 to (M/2)−1.
9. The method of claim 1 , comprising interlacing the second array with respect to the first array in at least one dimension to provide different first and second orientations.
10. The method of claim 9 , wherein the interlacing is in two dimensions.
11. The method of claim 1 , wherein the first array and the second array are each regular spatial arrangements of components in one dimension on the destination substrate.
12. The method of claim 1 , wherein the first array and the second array are each regular spatial arrangements of components in two dimensions on the destination substrate.
13. The method of claim 1 , comprising offsetting the second array with respect to the first array on the destination substrate by an amount that is different from an offset of the first array with respect to the second array on the component source wafer to provide different first and second orientations.
14. The method of claim 13 , wherein the second array is disposed with respect to the first array on the destination substrate in a different direction than the second array is disposed with respect to the first array on the component source wafer.
15. The method of claim 13 , wherein the first array and second array are adjacent on the component source wafer before transferring but are not adjacent on the destination substrate after transferring.
16. The method of claim 1 , comprising:
providing a plurality of component source wafers, wherein the plurality of component source wafers comprises the component source wafer; and
comprising transferring arrays of components from each of the component source wafers onto the destination substrate with two or more different orientations.
17. The method of claim 16 , wherein the plurality of component source wafers comprises a first component source wafer and a second component source wafer different from the first component source wafer, and the method comprises interlacing components from the first component source wafer between components from the second component source wafer.
18. The method of claim 1 , wherein the components are light-emitting components.
19. The method of claim 1 , wherein the components are inorganic light-emitting diodes.
20. A method of micro-transfer printing, comprising:
providing a component source wafer and components disposed in, on, or over the component source wafer, providing a destination substrate, and providing a stamp, wherein a structure, operation, or performance of different ones of the components disposed in different locations in, on, or over the component source wafer varies across the component source wafer;
transferring, with the stamp, a first array of components from the component source wafer to the destination substrate with a first orientation of the components on the destination substrate; and
transferring, with the stamp, a second array of components from the component source wafer to the destination substrate with a second orientation of the components on the destination substrate, wherein the second orientation of the components on the destination substrate is different from the first orientation of the components on the destination substrate.