Stacked pixel structures
View Patent ↗A micro-transfer printed high-resolution inorganic light-emitting diode (iLED) display includes a display substrate and a plurality of pixels disposed over the display substrate, each pixel including a pixel controller disposed or formed in or on a pixel substrate and controlling one or more iLEDs disposed or formed in or on respective iLED substrates. The one or more iLEDs are disposed above or below the pixel controller in a separate layer from the pixel controller. The display substrate, the iLED substrate(s), and the pixel substrate are all separate, independent and distinct, and the one or more iLEDs and pixel controller are each separate devices.
1. A high-resolution inorganic light-emitting diode (iLED) display, comprising:
a display substrate having a display area; and
a plurality of pixels disposed over the display substrate in the display area, each pixel comprising a pixel control device and one or more inorganic light-emitting diode (iLED) devices electrically connected to and controlled by the pixel control device to emit light, wherein, for each of the pixels:
the pixel control device comprises a pixel controller that is disposed or formed in, on, or in direct contact with a pixel substrate separate, independent, and distinct from the display substrate,
the one or more iLED devices each comprise an iLED that is disposed or formed in, on, or in direct contact with an iLED substrate separate, independent, and distinct from the display substrate and from the pixel substrates,
the one or more iLED devices are disposed in direct contact with the pixel control device and do not extend beyond the pixel controller, and
the pixel controller is disposed in a controller layer over the display substrate and the one or more iLED devices are disposed in an iLED layer different from the controller layer over the display substrate.
2. The high-resolution iLED display of claim 1 , wherein the iLED layer is disposed between the controller layer and the display substrate, the display substrate is at least partly transparent to the light emitted by the iLED, and the iLED is disposed to emit light through the display substrate.
3. The high-resolution iLED display of claim 1 , wherein the controller layer is disposed between the iLED layer and the display substrate and the iLEDs are disposed to emit light in a direction away from the display substrate.
4. The high-resolution iLED display of claim 1 , wherein one or more of the one or more iLED devices, the iLED substrate, the pixel control device, and the pixel substrate comprises a broken or separated tether.
5. The high-resolution iLED display of claim 1 , wherein the iLED substrate comprises a semiconductor iLED substrate or a dielectric iLED substrate.
6. The high-resolution iLED display of claim 5 , wherein the pixel control device comprises connection posts electrically connecting the pixel controller to the display substrate.
7. The high-resolution iLED display of claim 5 , wherein the iLED substrate comprises a broken or separated tether.
8. The high-resolution iLED display of claim 7 , wherein the one or more iLED devices comprises three iLED devices disposed in the iLED layer, wherein each of the iLEDs of the three iLED devices emit light of a different color than the iLED of each other iLED device of the three iLED devices.
9. The high-resolution iLED display of claim 1 , wherein the one or more iLED devices each comprises connection posts electrically connecting the iLED to at least one of (i) the pixel controller of the pixel control device on which the iLED device is disposed and (ii) the display substrate.
10. The high-resolution iLED display of claim 1 , wherein the pixel substrate comprises a semiconductor pixel substrate or a dielectric pixel substrate.
11. The high-resolution iLED display of claim 10 , wherein the pixel substrate comprises a broken or separated tether.
12. A micro-assembled pixel, comprising:
a pixel control device comprising a pixel controller and a pixel substrate, the pixel controller formed or disposed in, on, or in direct contact with the pixel substrate; and
one or more inorganic light-emitting diode (iLED) devices, each comprising an iLED and an iLED substrate separate, independent, and distinct from the pixel substrate, the iLED formed or disposed in, on, or in direct contact with the iLED substrate and electrically connected to and controlled by the pixel controller to emit light, wherein
the one or more iLED devices are disposed in direct contact with the pixel control device and do not extend beyond the pixel controller, and
the pixel controller is disposed in a controller layer and the one or more iLED devices are disposed in an iLED layer different from the controller layer over the pixel controller.
13. The micro-assembled pixel of claim 12 , wherein (i) the one or more iLED devices each comprise a broken or separated tether or (ii) the pixel control device comprises a broken or separated tether, or both (i) and (ii).
14. The micro-assembled pixel of claim 12 , wherein the iLED substrate comprises a semiconductor iLED substrate or a dielectric iLED substrate.
15. The micro-assembled pixel of claim 14 , wherein the pixel control device comprises connection posts electrically connected to the pixel controller.
16. The micro-assembled pixel of claim 14 , wherein the iLED substrate comprises a broken or separated tether.
17. The micro-assembled pixel of claim 12 , wherein the one or more iLED devices each comprises connection posts electrically connecting the iLED to the pixel controller.
18. The micro-assembled pixel of claim 12 , wherein the pixel substrate comprises a semiconductor pixel substrate or a dielectric pixel substrate.
19. The micro-assembled pixel of claim 18 , wherein the pixel substrate comprises a broken or separated tether.