Transfer stamps with multiple separate pedestals
A stamp for micro-transfer printing comprises a rigid support having a support coefficient of thermal expansion (support CTE). Pedestals are disposed on (e.g., directly on and in contact with) the rigid support. Each of the pedestals is spatially separated from any other of the pedestals. The pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE. Posts are disposed on (e.g., directly on and in contact with) each of the pedestals. Each post has a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.
1. A stamp for micro-transfer printing, comprising:
a rigid support having a support coefficient of thermal expansion (support CTE);
pedestals disposed on the rigid support, each of the pedestals spatially separated from any other of the pedestals, wherein the pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE; and
posts disposed directly on and in contact with each of the pedestals, each post having a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.
2. The stamp of claim 1 , wherein the pedestals are disposed directly on and in contact with the rigid support.
3. The stamp of claim 1 , wherein the posts and the pedestal comprise a same material.
4. The stamp of claim 1 , wherein the post CTE is greater than the pedestal CTE.
5. The stamp of claim 1 , wherein the pedestals are disposed in a regular array.
6. The stamp of claim 1 , wherein the posts disposed on each of the pedestals comprises four or more posts disposed in a regular array on the pedestal.
7. The stamp of claim 1 , wherein the posts disposed directly on and in contact with the pedestals are collectively disposed in a regular array over the rigid support.
8. The stamp of claim 1 , wherein the stamp comprises a viscoelastic stamp material.
9. The stamp of claim 1 , wherein the rigid support has a dimension no less than 25 mm.
10. The stamp of claim 1 , wherein the posts have a length no greater than 200 μm.
11. The stamp of claim 1 , wherein the pedestals each comprise polydimethylsiloxane formed from a mixture having a ratio of elastomer to curing agent in a range of 2:1 to 7:1 and the posts each comprise polydimethylsiloxane formed from a mixture having a ratio of elastomer to curing agent in a range of 7:1 to 14:1.
12. The stamp of claim 1 , wherein the pedestals are spaced such that a maximum spacing between adjacent ones of the pedestals is less than a minimum extent of any of the pedestals over the rigid support.
13. The stamp of claim 12 , wherein each of the pedestals has an extent over the rigid support that is no more than 25% larger than the area defined by a convex hull enclosing the posts disposed directly on and in contact with the pedestal.
14. The stamp of claim 1 , wherein the pedestals and the posts both have a substantially rectangular or trapezoidal cross section in a direction orthogonal to a surface of the rigid support on which the pedestals are disposed.
15. The stamp of claim 1 , wherein each post is a tiered post having a bottom portion in direct contact with the pedestal and a top portion in direct contact with the bottom portion.
16. The stamp of claim 15 , wherein the top portion has a CTE that is greater than a CTE of the bottom portion.
17. A micro-transfer printing system, comprising:
a stamp comprising
a rigid support having a support coefficient of thermal expansion (support CTE),
pedestals disposed on the rigid support, each of the pedestals spatially separated from any other of the pedestals, wherein the pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE, and
posts disposed directly on and in contact with each of the pedestals, each of the posts having a post coefficient of thermal expansion (post CTE) that is greater than the support CTE;
a source substrate comprising devices disposed in an arrangement corresponding to an arrangement of the posts;
a destination substrate; and
a motion-control platform attached to the stamp for controlling the stamp to contact the posts to the devices, remove the devices from the source substrate, and contact the devices to the destination substrate.
18. The micro-transfer printing system of claim 17 , wherein the pedestals are disposed directly on and in contact with the rigid support.
19. The micro-transfer printing system of claim 17 , comprising an adhesive layer disposed on the destination substrate.
20. The micro-transfer printing system of claim 17 , wherein the stamp comprises stamp material that has a cure temperature and the motion-control platform has an operating temperature that is lower than the cure temperature.