Methods of fabricating diodes with multiple junctions
An embodiment of a method of fabricating a diode having a plurality of regions of a first conductivity type and a buried region of a second conductivity type includes performing a first dopant implantation procedure to form the buried region, performing a second dopant implantation procedure to form an intermediate region of the plurality of regions, and performing a third dopant implantation procedure to form a contact region of the plurality of regions. The second and third dopant implantation procedures are configured such that the intermediate region is electrically connected with the contact region. The first, second, and third dopant implantation procedures are configured such that the buried region extends laterally across the contact region and the intermediate region to establish first and second junctions of the diode, respectively, and such that the first junction has a lower breakdown voltage than the second junction.
1. A method of fabricating a diode comprising a plurality of regions of a first conductivity type in a semiconductor substrate, the method comprising:
forming a buried region of a second conductivity type in the semiconductor substrate;
performing a first dopant implantation procedure to form an intermediate region of the plurality of regions; and
performing a second dopant implantation procedure in addition to the first dopant implantation procedure to form a contact region of the plurality of regions;
wherein the first and second dopant implantation procedures are configured such that the intermediate region is electrically connected with the contact region;
wherein the first and second dopant implantation procedures are configured such that the buried region extends laterally across the contact region and the intermediate region to establish first and second junctions of the diode, respectively, and such that the first junction has a lower breakdown voltage than the second junction.
2. The method of claim 1 , wherein forming the buried region comprises implementing a power field-effect transistor (FET) well implantation procedure.
3. The method of claim 2 , wherein forming the buried region further comprises implementing a logic field-effect transistor (FET) well implantation procedure.
4. The method of claim 1 , further comprising depositing a silicide block on the surface of the substrate over the intermediate region.
5. The method of claim 1 , wherein the first implantation procedure comprises a power field-effect transistor (FET) terminal extension implantation procedure.
6. The method of claim 1 , further comprising performing a third dopant implantation procedure to form a further buried region in the semiconductor substrate of the second conductivity type, wherein the second and third dopant implantation procedures are configured such that:
the further buried region is disposed adjacent the contact region to establish a third junction; and
the third junction has a lower breakdown voltage than the first and second junctions.
7. The method of claim 6 , wherein the first and third dopant implantation procedures are configured such that the further buried region is laterally spaced from the intermediate region such that the first and second junctions are disposed between the third junction and the second contact region.
8. The method of claim 6 , wherein the third dopant implantation procedure is configured such that the buried region and the further buried region have dopant concentration levels on a same order of magnitude.
9. The method of claim 6 , wherein the second and third dopant implantation procedures are configured such that the further buried region is disposed on the buried region between the contact region and the buried region.
10. The method of claim 1 , further comprising forming an isolation region at a surface of the substrate such that the intermediate region is disposed between the isolation region and the contact region.
11. A method of fabricating a diode comprising a plurality of regions of a first conductivity type in a semiconductor substrate, the method comprising:
forming an isolation region at a surface of the semiconductor substrate;
forming a buried region of a second conductivity type in the semiconductor substrate;
performing a first dopant implantation procedure to form an intermediate region of the plurality of regions, the intermediate region being adjacent to the isolation region; and
performing a second dopant implantation procedure in addition to the first dopant implantation procedure to form a contact region of the plurality of regions, the intermediate region being disposed between the isolation region and the contact region;
wherein the first and second dopant implantation procedures are configured such that the intermediate region is electrically connected with the contact region;
wherein the first and second dopant implantation procedures are configured such that the buried region extends laterally across the contact region and the intermediate region to establish first and second junctions of the diode, respectively, and such that the first junction has a lower breakdown voltage than the second junction.
12. The method of claim 11 , wherein forming the buried region comprises implementing a power field-effect transistor (FET) well implantation procedure.
13. The method of claim 11 , wherein the first implantation procedure comprises a power field-effect transistor (FET) terminal extension implantation procedure.
14. The method of claim 11 , further comprising performing a third dopant implantation procedure to form a further buried region in the semiconductor substrate of the second conductivity type, wherein the second and third dopant implantation procedures are configured such that:
the further buried region is disposed adjacent the contact region to establish a third junction; and
the third junction has a lower breakdown voltage than the first and second junctions, and
wherein the third dopant implantation comprises a further power FET terminal extension implantation procedure.
15. A method of fabricating a diode comprising a plurality of regions of a first conductivity type in a semiconductor substrate and a buried region of a second conductivity type in the semiconductor substrate, the method comprising:
performing a first dopant implantation procedure to form the buried region;
performing a second dopant implantation procedure to form an intermediate region of the plurality of regions;
performing a third dopant implantation procedure to form a contact region of the plurality of regions;
wherein the second and third dopant implantation procedures are configured such that the intermediate region is electrically connected with the contact region;
wherein the first, second, and third dopant implantation procedures are configured such that the buried region extends laterally across the contact region and the intermediate region to establish first and second junctions of the diode, respectively, and such that the first junction has a lower breakdown voltage than the second junction.
16. The method of claim 15 , further comprising performing a fourth dopant implantation procedure to form a further buried region in the semiconductor substrate of the second conductivity type, wherein the third and fourth dopant implantation procedures are configured such that:
the further buried region is disposed adjacent the contact region to establish a third junction; and
the third junction has a lower breakdown voltage than the first and second junctions.
17. The method of claim 15 , wherein performing the first implantation procedure comprises implementing a first power field-effect transistor (FET) well implantation procedure, the method further comprising implementing a second power FET well implantation procedure to implant further dopant of the second conductivity type to form the buried region.
18. The method of claim 15 , further comprising depositing a silicide block on the surface of the substrate over the intermediate region.
19. The method of claim 15 , wherein the first implantation procedure comprises a logic field-effect transistor (FET) well implantation procedure.
20. The method of claim 15 , wherein the second implantation procedure comprises a power field-effect transistor (FET) terminal extension implantation procedure.