Ceramic electronic component and manufacturing method therefor
A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes that are provided on the surface of the ceramic element. The coating film is selectively formed on the surface of the ceramic element by applying, to the ceramic electronic component, a resin-containing solution containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid.
1. A ceramic electronic component comprising:
a ceramic element with internal electrodes that have extensions thereof exposed from the ceramic element;
a coating film on a surface of the ceramic element; and
an electrode on the surface of the ceramic element,
wherein the coating film includes a resin containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphonic acid, and a hydrofluoric acid,
wherein the coating film does not cover the extensions of the internal electrodes exposed from the ceramic element,
wherein the coating film is located on at least a portion of the surface of the ceramic element not covered by the electrode, and
at least a part of the coating film is exposed at the surface of the ceramic electronic component.
2. The ceramic electronic component according to claim 1 , wherein the resin has a thermal decomposition temperature of 240° C. or higher.
3. The ceramic electronic component according to claim 1 , wherein the resin comprises at least one of an epoxy resin, a polyimide resin, a silicone resin, a polyamideimide resin, a polyetheretherketone resin, and a fluorine-containing resin.
4. A ceramic electronic component comprising:
a ceramic element;
a coating film on a surface of the ceramic element; and
an electrode on the surface of the ceramic element,
wherein the coating film includes a resin containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphonic acid, and a hydrofluoric acid, and
wherein the coating film contains cross-linked resin components.
5. The ceramic electronic component according to claim 1 , further comprising a plated film on the electrode.
6. The ceramic electronic component according to claim 1 , wherein the coating film is formed on the surface of the ceramic element by applying, to the surface of the ceramic element, a resin-containing solution containing the at least one anion of the sulfuric acid, the sulfonic acid, the carboxylic acid, the phosphoric acid, the phosphonic acid, and the hydrofluoric acid.
7. The ceramic electronic component according to claim 4 , wherein the resin has a thermal decomposition temperature of 240° C. or higher.
8. The ceramic electronic component according to claim 4 , wherein the resin comprises at least one of an epoxy resin, a polyimide resin, a silicone resin, a polyamideimide resin, a polyetheretherketone resin, and a fluorine-containing resin.
9. The ceramic electronic component according to claim 4 , further comprising a plated film on the electrode.
10. The ceramic electronic component according to claim 4 , wherein the coating film is formed on the surface of the ceramic element by applying, to the surface of the ceramic element, a resin-containing solution containing the at least one anion of the sulfuric acid, the sulfonic acid, the carboxylic acid, the phosphoric acid, the phosphonic acid, and the hydrofluoric acid.