Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition

1. A gas delivery system for a substrate processing system, comprising:

a first valve including an inlet and an outlet, wherein the inlet is in fluid communication with a first gas source;

a second valve including a first inlet, a second inlet and an outlet, wherein the first inlet is in fluid communication with the outlet of the first valve and the second inlet is in fluid communication with a second gas source;

a third valve including an inlet and an outlet, wherein the inlet is in fluid communication with a third gas source; and

a connector comprising:

a first gas channel;

a cylinder defining a second gas channel having a first end and a second end,

wherein the cylinder is at least partially disposed within the first gas channel such that the cylinder and the first gas channel collectively define a flow channel between an outer surface of the cylinder and an inner surface of the first gas channel,

wherein the flow channel is in fluid communication with the outlet of the third valve and the first end of the second gas channel; and

a third gas channel in fluid communication with the second end of the second gas channel, with the outlet of the second valve and with a gas distribution device of a processing chamber,

wherein the first end of the second gas channel is in fluid communication with an inlet of the first gas channel such that gas provided to an inlet in the second end of the second gas channel flows through the second channel from the second end to the first end, into the inlet of the first gas channel, and through the first gas channel into the third gas channel.

2. The gas delivery system of claim 1 , wherein the first gas source includes a purge gas source.

3. The gas delivery system of claim 1 , wherein the second gas source includes a precursor gas source.

4. The gas delivery system of claim 1 , further comprising a fourth valve including an inlet and an outlet, wherein the inlet is in fluid communication with a fourth gas source, and wherein the outlet is in fluid communication with the flow channel.

5. The gas delivery system of claim 4 , wherein the fourth gas source includes a cleaning gas source.

6. The gas delivery system of claim 5 , wherein the cleaning gas source includes remote plasma clean (RPC) gas.

7. The gas delivery system of claim 1 , wherein the third gas source includes an oxidizing gas source.

8. The gas delivery system of claim 1 , wherein the substrate processing system performs atomic layer deposition.

9. The gas delivery system of claim 1 , further comprising a controller configured to control the first valve, the second valve and the third valve.

10. The gas delivery system of claim 9 , wherein the controller is configured to:

supply precursor gas from the second gas source during a first predetermined period using the first valve and the second valve;

supply purge gas from the first gas source during a second predetermined period using the first valve and the second valve; and

supply an oxidizing gas from the third gas source during a third predetermined period using the third valve.

11. The gas delivery system of claim 10 , wherein:

the first predetermined period corresponds to a dose stage of an atomic layer deposition (ALD) process;

the second predetermined period corresponds to a burst purge stage of the ALD process; and

the third predetermined period corresponds to a dose purge stage, a radio frequency (RF) stage and an RF purge stage of the ALD process.

12. The gas delivery system of claim 4 , wherein a distance between the fourth valve and the connector is between 10″ and 40″.

13. The gas delivery system of claim 4 , wherein a distance between the fourth valve and the connector is less than 5″.