IP Library Granted Patent US 9,548,450
Granted Patent B2
US 9,548,450 · App. 14/807,030 · Granted Jan 17, 2017

Devices containing metal chalcogenides

Inventors: Sumeet C. Pandey (Boise, ID); Gurtej S. Sandhu (Boise, ID)
Assignee: Micron Technology, Inc.
H01L45/147H01L45/06H01L45/141
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Quick Facts
Patent No.
US 9,548,450
App. No.
14/807,030
Granted
Jan 17, 2017
Kind
B2
Abstract

Some embodiments include a device having a conductive material, a metal chalcogenide-containing material, and a region between the metal chalcogenide-containing material and the conductive material. The region contains a composition having a bandgap of at least about 3.5 electronvolts and a dielectric constant within a range of from about 1.8 to 25. Some embodiments include a device having a first electrode, a second electrode, and a metal chalcogenide-containing material between the first and second electrodes. The device also includes an electric-field-modifying region between the metal chalcogenide-containing material and one of the first and second electrodes. The electric-field-modifying region contains a composition having a bandgap of at least about 3.5 electronvolts having a low dielectric constant and a low conduction band offset relative to a workfunction of metal of the metal chalcogenide-containing material.

Claims (18)

1. A device, comprising:

a first electrode, a second electrode, and a metal chalcogenide-containing material between the first and second electrodes;

an electric-field-modifying region between the metal chalcogenide-containing material and one of the first and second electrodes, the region comprising at least one composition having a bandgap of at least about 3.5 electronvolts; and

wherein the region is a first region and is between the first electrode and the metal chalcogenide-containing material, and further comprising a second region between the metal chalcogenide-containing material and the second electrode with the second region also comprising a composition having a bandgap of at least about 3.5 electronvolts.

2. The device of claim 1 wherein the first and second regions comprise a same composition as one another.

3. The device of claim 1 wherein the first and second regions comprise different compositions relative to one another.

4. A device, comprising:

a first electrode, a second electrode, and a metal chalcogenide-containing material between the first and second electrodes;

an electric-field-modifying region between the metal chalcogenide-containing material and one of the first and second electrodes; the electric-field-modifying region comprising a stack of at least three layers; and

wherein the layers comprise a first layer, a second layer and a third layer; with the first and third layers comprising one or both of gallium oxide and gadolinium oxide, and with the second layer comprising aluminum oxide.

5. The device of claim 4 wherein the first and third layers are a same composition as one another.

6. The device of claim 4 wherein the first and third layers are different compositions relative to one another.

7. A device, comprising:

a first electrode, a second electrode, and a metal chalcogenide-containing material between the first and second electrodes;

an electric-field-modifying region between the metal chalcogenide-containing material and one of the first and second electrodes; the electric-field-modifying region comprising a stack of at least two layers; and

wherein the electric-field-modifying region is first electric-field-modifying region and is between the first electrode and the metal chalcogenide-containing material, and further comprising a second electric-field-modifying region between the second electrode and the chalcogenide.

8. The device of claim 7 wherein the second electric-field-modifying region is identical in composition to the first electric-field-modifying region.

9. The device of claim 7 wherein the second electric-field-modifying region is different in composition from the first electric-field-modifying region.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2015
From: PANDEY, SUMEET C.; SANDHU, GURTEJ S.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 036164/0116 →
Continuity (2)
Provisional Application 62053912 · Sep 23, 2014
Related Publication 20160087204A1 · Mar 24, 2016