Systems and methods for single magnetron sputtering
A system and method for single magnetron sputtering are described. One example includes a system having a power supply, a plasma chamber enclosing a substrate, an anode, and a target for depositing a thin film material on the substrate. This example also has a datastore with uncoated anode characterization data and an anode sputtering adjustment system including an anode analysis component to generate a first health value. The first health value is indicative of whether the anode is coated with a dielectric material. This example also has an anode power controller to receive the first health value and provide an anode-energy-control signal to the pulse controller of the pulsed DC power supply to adjust a second anode sputtering energy relative to a first anode sputtering energy to eject at least a portion of the dielectric material from the anode.
1. A power supply system for a single magnetron sputtering system, the power supply system comprising:
a target lead to couple to a target and an anode lead to couple to an anode;
a pulsed DC power supply coupled to the target lead and the anode lead, the pulsed DC power supply is configured to generate and apply an alternating sputtering voltage at the target lead relative to the anode lead that alternates between a positive portion during an anode sputtering pulse and a negative portion during a target sputtering pulse,
a pulse controller configured to control when the alternating sputtering voltage at the target lead alternates from the positive portion to the negative portion, and the pulse controller is configured to control an anode sputtering energy applied by the pulsed DC power supply during the anode sputtering pulse responsive to an anode-energy-control signal;
an anode monitor system comprising a voltage monitor coupled to the anode lead and the target lead to measure the alternating sputtering voltage; and
an anode sputtering adjustment system comprising:
a processor;
a non-transitory tangible processor-readable medium encoded with processor readable instructions, that when executed on the processor, cause the processor to:
receive the measurements of the alternating sputtering voltage during multiple target sputtering pulses;
determine when the negative portion of the alternating sputtering voltage increases more than the threshold deviation to maintain target sputtering power during the multiple target sputtering pulses; and
provide the anode-energy-control signal to the pulse controller with a value to prompt the pulse controller to increase the anode sputtering energy to eject material from the anode when the negative portion of the alternating sputtering voltage increases more than the threshold deviation.
2. A power supply system for a single magnetron sputtering system, the power supply system comprising:
a target lead to couple to a target and an anode lead to couple to an anode;
a pulsed DC power supply coupled to the target lead and the anode lead, the pulsed DC power supply is configured to generate and apply an alternating sputtering voltage at the target lead relative to the anode lead that alternates between a positive portion during an anode sputtering pulse and a negative portion during a target sputtering pulse,
a pulse controller configured to control when the alternating sputtering voltage at the target lead alternates from the positive portion to the negative portion, and the pulse controller is configured to control an anode sputtering energy applied by the pulsed DC power supply during the anode sputtering pulse responsive to an anode-energy-control signal;
an anode monitor system comprising a voltage monitor coupled to the anode lead and the target lead to measure the alternating sputtering voltage; and
an anode sputtering adjustment system comprising:
a field programmable gate array coupled to the voltage monitor; and
a non-transitory tangible medium comprising instructions that, when used to configure the field programmable gate array, cause the field programmable gate array to:
receive the measurements of the alternating sputtering voltage during multiple target sputtering pulses;
determine when the negative portion of the alternating sputtering voltage increases more than the threshold deviation to maintain target sputtering power during the multiple target sputtering pulses; and
provide the anode-energy-control signal to the pulse controller with a value to prompt the pulse controller to increase the anode sputtering energy to eject material from the anode when the negative portion of the alternating sputtering voltage increases more than the threshold deviation.