COMPOSITION HAVING ALKALINE PH AND PROCESS FOR FORMING SUPERCONFORMATION THEREWITH

1 . A composition comprising:

a solvent;

a metal ion disposed in the solvent;

an accelerator disposed in the solvent; and

a suppressor disposed in the solvent,

a pH of the composition being alkaline and effective to form a superconformation comprising a damascene deposit that comprises an electrochemically reduced form of the metal ion.

2 . The composition of claim 1 , wherein the metal ion comprises a transition metal.

3 . The composition of claim 2 , wherein the transition metal comprises copper, cobalt, manganese, silver, gold, or a combination comprising at least one of the foregoing transitions metals.

4 . The composition of claim 1 , wherein the accelerator comprises an anion.

5 . The composition of claim 4 , wherein the anion comprises sulfur, selenium, tellurium, oxygen, or a combination comprising at least one of the foregoing atoms.

6 . The composition of claim 5 , wherein the anion comprises SeCN − .

7 . The composition of claim 1 , wherein the suppressor comprises a polymer, a ligand, a halide, or a combination comprising at least one of the foregoing suppressors.

8 . The composition of claim 7 , wherein the polymer comprises a functional group comprising a hydroxyl, sulfhydryl, carbonyl, amine, imine, amide, carboxyl, phosphate, sulfate, phenyl, halo, aldehyde, haloformyl, cyanate, nitrate, nitro, borono, or a combination comprising at least one of the foregoing functional groups.

9 . The composition of claim 7 , wherein the ligand comprises a halide, an amide, an η 2 -alkene, CO, CS, CO2, CN, an amine, a nitrile, an isocyanide, a phosphane, an alkylidene, an alkyldiide, a nitrene, an imide, an oxide, an alkylidyne, an alkyltriide, an η 3 -allyl, an η 3 -enyl, an η 3 -cyclopropenyl, NO, an η 4 -diene, an θ 4 -cyclobutadiene, an η 5 -cyclopentadienyl, an η 6 -arene, an η 6 -triene, an Θ 7 -tropylium, an η 7 -cycloheptatrienyl, an η 8 -cyclooctatetraene, or a combination comprising at least one of the foregoing ligands.

10 . The composition of claim 9 , wherein the ligand comprises a functional group that comprises hydrogen, alkyl, alkoxy, fluoroalkyl, cycloalkyl, heterocycloalkyl, cycloalkyloxy, aryl, aralkyl, aryloxy, aralkyloxy, heteroaryl, heteroaralkyl, alkenyl, alkynyl, NH 2 , amine, alkyleneamine, aryleneamine, alkenyleneamine, and hydroxyl.

11 . The composition of claim 10 , wherein the ligand comprises an aminocarboxylic acid, a lactate, a malate, a citrate, or a combination comprising at least one of the foregoing.

12 . The composition of claim 7 , wherein the halide comprises iodide, chloride, or a combination comprising lease one the foregoing halides.

13 . The composition of claim 1 , wherein the pH is greater than or equal to 12.

14 . The composition of claim 1 , wherein the metal ion is complexed to a ligand.

15 . A process for forming a composition, the process comprising:

disposing a metal ion in a solvent;

disposing an accelerator in the solvent;

disposing a suppressor in the solvent; and

adjusting a pH of the composition to be alkaline and effective to form a superconformation comprising a damascene deposit that comprises an electrochemically reduced form of the metal ion.

16 . The process of claim 15 , wherein the pH is greater than or equal to 12 after adjusting the pH.

17 . A process for forming a superconformation, the process comprising:

contacting a substrate with a composition, the composition comprising:

a solvent;

a metal ion disposed in the solvent;

an accelerator disposed in the solvent; and

a suppressor disposed in the solvent;

controlling a pH of the composition to be alkaline; and

producing a damascene deposit on the substrate to form the superconformation, the damascene deposit comprising an electrochemically reduced form of the metal ion.

18 . The process of claim 17 , further comprising disposing an electrode in the composition.

19 . The process of claim 18 , further comprising:

subjecting the substrate to a first potential; and

subjecting the electrode to a second potential.

20 . The process of claim 19 , further comprising controlling a potential difference between the first potential and the second potential.

21 . The process of claim 19 , further comprising controlling a current between the substrate and the electrode.

22 . The process of claim 19 , further comprising controlling a current density on the substrate.

23 . The process of claim 19 , further comprising controlling a deposition rate of the electrochemically reduced form of the metal ion on the substrate.

24 . The process of claim 19 , further comprising rotating the substrate relative to the composition at a rate of rotation.

25 . The process of claim 24 , further comprising controlling the rate of rotation from 0 revolutions per minute (rpm) to 500 rpm.

26 . The process of claim 19 , further comprising oscillating the substrate relative to the composition at a rate of oscillation.

27 . The process of claim 26 , further comprising controlling the rate of oscillation from 0 millimeters per second (mps) to 50 mps.

28 . The process of claim 27 , wherein oscillating comprises linearly oscillating the substrate relative to the composition.

29 . The process of claim 17 , wherein the substrate comprises a trench.

30 . The process of claim 29 , wherein the trench comprises a sub-micrometer width.

31 . The process of claim 17 , wherein the metal ion is complexed to a ligand in the composition.