Semiconductor device and method for fabricating the same
View Patent ↗A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a first region, a second region, and a third region; forming a plurality of spacers on the first region, the second region, and the third region; forming a first patterned mask to cover the spacers on the first region and the second region; and removing the spacers on the third region.
1. A semiconductor device, comprising:
a substrate having a first region, a second region, and a third region;
a first base on the first region and a second base on the second region;
a plurality of first fin-shaped structures on the first base;
a single second fin-shaped structure on the second base, wherein a sidewall of the single second fin-shaped structure is aligned with a sidewall of the second base;
a first shallow trench isolation (STI) between the first fin-shaped structures and the second fin-shaped structure;
a second STI adjacent to the second fin-shaped structure; and
a third base on the third region, wherein a top surface of the third base is higher than the top surfaces of the first base and the second base.
2. The semiconductor device of claim 1 , wherein the substrate, the first base, the second base, the third base, the first fin-shaped structures, and the second fin-shaped structure comprise same material.
3. The semiconductor device of claim 1 , wherein the first STI and the second STI comprise different depths.
4. The semiconductor device of claim 1 , further comprising a third STI between the first base and the third base.
5. The semiconductor device of claim 4 , wherein the top surfaces of the first STI, the second STI, and the third STI are coplanar.
6. The semiconductor device of claim 1 , wherein a first sidewall of the second base is aligned with a second sidewall of the second fin-shaped structure and a third sidewall of the second base is not aligned with a fourth sidewall of the second fin-shaped structure.