Method and apparatus for the curing of composite material by control over rate limiting steps in water removal
The invention encompasses equipment used to condition a recirculating gas stream in order to cure a CO 2 Composite Material (CCM) and processes that use such equipment to cure the CCM. The gas conditioning equipment allows for a process that controls, reduces or eliminates the rate-limiting steps associated with water removal during the curing of a composite material. The equipment may include, but will not be limited to, control over the temperature, relative humidity, flow rate, pressure, and carbon dioxide concentration within the system; which includes the conditioning equipment, any vessel containing the CCM, and the material itself. Flow rate control can be used as a means to achieve uniformity in both gas velocity and composition.
1. A controller, comprising:
a microprocessor configured to operate under control of a set of instructions recorded on a first machine-readable medium, said microprocessor when operating under said set of instructions performing:
controlling operation of at least one of a source of carbon dioxide, a gas flow subsystem, a temperature control subsystem, and a humidity control subsystem;
flowing a process gas containing carbon dioxide so as to contact a material to be cured by reaction with said carbon dioxide in said process gas, and curing the material by the reaction with carbon dioxide;
monitoring at least one parameter selected from a group of monitored parameters consisting of an elapsed time from said instituting of said flow, a carbon dioxide concentration, a relative humidity, a flow rate, a temperature, and a pressure of said process gas as said process gas is being provided; and
performing at least one of: recording said at least one parameter, transmitting said at least one parameter to a data handling system, or to displaying said at least one parameter to a user.
2. The controller of claim 1 , wherein said microprocessor when operating under said set of instructions receives a start command from an external source.
3. The controller of claim 1 , wherein said microprocessor when operating under said set of instructions determines a state of cure of said material to be cured by reaction with said carbon dioxide.
4. The controller of claim 1 , wherein said microprocessor when operating under said set of instructions monitors at least one parameter selected from the group of parameters consisting of a carbon dioxide concentration, a relative humidity, a flow rate, a temperature, a pressure, and a flow duration of said process gas as said process gas is removed from contact with said material to be cured by reaction with said carbon dioxide.
5. The controller of claim 1 , wherein said microprocessor when operating under said set of instructions monitors at least one parameter selected from the group of parameters consisting of a carbon dioxide concentration, a relative humidity, a flow rate, a temperature, and a pressure at one or more locations within a curing chamber.
6. The controller of claim 1 , wherein said gas flow subsystem comprises:
at least one of a valve, a flow regulator, a mass flow controller, a blower, and a gas delivery structure;
said gas flow subsystem configured to provide a process gas comprising carbon dioxide as a reagent in fluid contact with a material to be cured by reaction with said carbon dioxide.
7. The controller of claim 1 , wherein said gas flow subsystem is compatible with water vapor in addition to said process gas comprising carbon dioxide as a reagent.
8. The controller of claim 1 , wherein said gas delivery structure is a gas permeable layer placed adjacent the material to be cured by reaction with said carbon dioxide.
9. The controller of claim 1 , wherein said temperature control subsystem comprises:
at least a selected one of a heater and a cooler, said temperature control subsystem configured to control a temperature of a process gas containing carbon dioxide so as to cause said process gas to attain a desired temperature prior to coming into contact with a material to be cured by reaction with said carbon dioxide in said process gas.
10. The controller of claim 1 , wherein said humidity control subsystem comprises:
at least a selected one of a water vapor source and a water vapor removal apparatus, said humidity control subsystem configured to control a humidity of a process gas containing carbon dioxide so as to cause said process gas to attain a desired humidity prior to coming into contact with a material to be cured by reaction with said carbon dioxide in said process gas.