SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE
Provided is a solid-state image pickup device in which a first substrate and a second substrate are laminated and electrically connected by connection units. The first substrate includes: a plurality of pixel units which are disposed in a matrix shape and output signals corresponding to amounts of incident light; and first wiring units which connect the pixel units and the connection units. The second substrate includes: column processing circuits which process the signals generated by the pixel units; and second wiring units which connect the connection units and the column processing circuits. Sum of a wiring resistance of a first wiring unit and a wiring resistance of a second wiring unit are almost identical in each column.
1 . A solid-state image pickup device in which a first substrate and a second substrate are laminated and electrically connected by connection units,
wherein the first substrate comprises:
a plurality of pixel units which are disposed in a matrix shape and output signals corresponding to amounts of incident light; and
first wiring units which connect the pixel units and the connection units,
the second substrate comprises:
column processing circuits which process the signals generated by the pixel units; and
second wiring units which connect the connection units and the column processing circuits, and
wherein sum of a wiring resistance of a first wiring unit and a wiring resistance of a second wiring unit are almost identical in each column.
2 . The solid-state image pickup device of claim 1 , wherein sum of a wiring length of a first wiring unit and a wiring length of a second wiring unit are almost identical in each column.
3 . An image pickup device comprising the solid-state image pickup device according to claim 1 .
4 . An image pickup device comprising the solid-state image pickup device according to claim 2 .