Semiconductor structure having sets of III-V compound layers and method of forming the same
A semiconductor structure includes a substrate; and a graded III-V layer over the substrate. The semiconductor structure further includes a p-doped gallium nitride (GaN) layer over the graded III-V layer. The semiconductor structure further includes one or more sets of GaN layers over the p-doped GaN layer. Each set of the one or more sets of GaN layers includes a lower GaN layer, wherein the lower GaN layer is undoped, unintentionally doped having N-type doping, or N-type doped. Each set of the one or more sets of GaN layers includes an upper GaN layer on the lower GaN layer, wherein the upper GaN layer is P-type doped. The semiconductor structure includes a second GaN layer over the one or more sets of GaN layers, the second GaN layer being either undoped or unintentionally doped having the N-type doping. The semiconductor structure includes an active layer over the second GaN layer.
1. A semiconductor structure, comprising:
a substrate;
a graded III-V layer over the substrate;
a p-doped gallium nitride (GaN) layer directly contacting the graded III-V layer;
one or more sets of GaN layers over the p-doped GaN layer, each set of the one or more sets of GaN layers comprising:
a lower GaN layer, wherein the lower GaN layer is undoped, unintentionally doped having N-type doping, or N-type doped, and
an upper GaN layer on the lower GaN layer, wherein the upper GaN layer is P-type doped;
a second GaN layer over the one or more sets of GaN layers, the second GaN layer being either undoped or unintentionally doped having the N-type doping; and
an active layer over the second GaN layer.
2. The semiconductor structure of claim 1 , further comprising a gate dielectric over the active layer.
3. The semiconductor structure of claim 1 , further comprising a nucleation layer between the substrate and the graded III-V layer.
4. The semiconductor structure of claim 1 , wherein a number of sets of the one or more sets of GaN layer ranges from 1 to 200.
5. The semiconductor structure of claim 1 , wherein a two-dimensional electron gas (2-DEG) layer is present in the second GaN layer.
6. The semiconductor structure of claim 1 , further comprising an electrode extending through the active layer to contact the second GaN layer.
7. The semiconductor structure of claim 1 , wherein the graded layer comprising a plurality of sublayers.
8. The semiconductor structure of claim 1 , wherein the graded layer comprises a single layer having a continuous concentration gradient.
9. The semiconductor structure of claim 1 , wherein the graded layer is in direct contact with the substrate.
10. A semiconductor structure, comprising:
a substrate;
a first III-V compound layer over the substrate, wherein the first III-V compound layer includes a first dopant type;
one or more sets of III-V compound layers over the first III-V layer, each set of the one or more sets of III-V compound layers comprising:
a lower III-V compound layer, wherein the lower III-V compound layer is undoped, unintentionally doped having a second dopant type, or doped having the second dopant type, and the second dopant type is opposite the first dopant type, and
an upper III-V compound layer on the lower III-V compound layer, wherein the upper III-V compound layer is doped with the first dopant type, the upper III-V compound layer includes a depletion region, and a thickness of the depletion region is less than a thickness of the upper III-V compound layer;
a second III-V compound layer over the one or more sets of III-V compound layers, the second III-V compound layer being either undoped or unintentionally doped having the second dopant type; and
an active layer over the second III-V compound layer.
11. The semiconductor structure of claim 10 , further comprising a graded layer between the substrate and the first III-V compound layer.
12. The semiconductor structure of claim 10 , further comprising an additional depletion region in the first III-V compound layer, wherein a thickness of the first III-V compound layer is greater than 0.15 microns (μm).
13. The semiconductor structure of claim 10 , further comprising a dielectric layer over the active layer.
14. A semiconductor structure, comprising:
a substrate;
a graded III-V layer over the substrate;
a first gallium nitride (GaN) layer over the graded III-V layer, wherein the first GaN layer includes a first dopant type;
one or more sets of GaN layers over the first GaN layer, each set of the one or more sets of GaN layers comprising:
a lower GaN layer, wherein the lower GaN layer has a second dopant type opposite the first dopant type, and
an upper GaN layer on the lower GaN layer, wherein the upper GaN layer has the first dopant type;
a second GaN layer over the one or more sets of GaN layers, the second GaN layer having the second dopant type; and
an active layer over the second GaN layer.
15. The semiconductor structure of claim 14 , wherein the first dopant type is a p-type dopant.
16. The semiconductor structure of claim 14 , further comprising a source/drain electrode in direct contact with the active layer and the second GaN layer.
17. The semiconductor structure of claim 14 , further comprising a gate electrode directly contacting the active layer.
18. The semiconductor structure of claim 14 , wherein each set of the one or more sets of GaN layer is reverse biased.
19. The semiconductor structure of claim 14 , wherein the lower GaN layer of each set of the one or more sets of GaN layers has a thickness ranging from about 0.05 microns (μm) to about 0.1 μm.
20. The semiconductor structure of claim 14 , wherein a dopant concentration of the lower GaN layer of each set of the one or more sets of GaN layers is different from a dopant concentration of a corresponding upper GaN layer.