IP Library Granted Patent US 9,928,317
Granted Patent B2
US 9,928,317 · App. 14/824,370 · Granted Mar 27, 2018

Additive design of heat sinks

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Quick Facts
Patent No.
US 9,928,317
App. No.
14/824,370
Granted
Mar 27, 2018
Kind
B2
Abstract

Techniques for employing an additive design process to design heat sinks are disclosed. A heat sink “grows” through an iteration process. During each iteration step, an object is added to a location determined based on simulation. The criterion for the determination may be being a location having a highest fluid apparent surface temperature value or being a location having a highest bottleneck heat transfer characteristic value. The thermal performance of the newly derived structure is simulated. If a predetermined condition is met, the object is kept. Otherwise, the object is removed and the location is marked so that the same addition may not occur subsequently. The iteration process may be repeated.

Claims (48)

1. A method, executed by at least one processor of a computer, comprising:

A: determining, using the computer, a location on a heat sink base based on a simulation of a structure in a cooling environment and a predetermined criterion, the structure comprising the heat sink base and a heat source;

B: adding, using the computer, an object to the location to form a new structure;

C: simulating, using the computer, the new structure to determine thermal performance of the new structure; and

D: repeating, using the computer, operations B and C until a predetermined condition regarding design space is met, wherein the repeating comprises:

if the thermal performance of the new structure meets a predetermined condition regarding thermal performance, replacing, using the computer, the location with a new location determined for the new structure based on the simulating and the predetermined criterion for operation B; and

if the thermal performance of the new structure does not meet the predetermined condition regarding thermal performance, removing, using the computer, the added object, designating the location as a location not eligible for the adding, and replacing, using the computer, the location with a new location for the structure selected from locations eligible for the adding based on the predetermined criterion for operation B.

2. The method recited in claim 1 , further comprising:

smoothing edges of the new structure derived after the predetermined condition regarding design space is met.

3. The method recited in claim 1 , further comprising:

changing the locations not eligible for the adding to locations eligible for the adding; and

repeating operations A, B, C and D by using the new structure derived after the predetermined condition regarding design space is met as the heat sink base.

4. The method recited in claim 1 , wherein the predetermined criterion is being a location having a highest fluid apparent surface temperature value.

5. The method recited in claim 1 , wherein the predetermined criterion is being a location having a highest bottleneck heat transfer characteristic value or a highest shortcut heat transfer characteristic value.

6. The method recited in claim 1 , wherein the thermal performance is represented by thermal resistance and the predetermined condition regarding thermal performance is improvement in thermal resistance is above a percentage value.

7. The method recited in claim 1 , wherein the predetermined condition regarding design space is there is no location eligible for the adding left in the design space.

8. One or more non-transitory computer-readable media storing computer-executable instructions which when executed on one or more processors perform a method, the method comprising:

A: determining a location on a heat sink base based on a simulation of a structure in a cooling environment and a predetermined criterion, the structure comprising the heat sink base and a heat source;

B: adding an object to the location to form a new structure;

C: simulating the new structure to determine thermal performance of the new structure; and

D: repeating operations B and C until a predetermined condition regarding design space is met, wherein the repeating comprises:

if the thermal performance of the new structure meets a predetermined condition regarding thermal performance, replacing the location with a new location determined for the new structure based on the simulating and the predetermined criterion for operation B; and

if the thermal performance of the new structure does not meet the predetermined condition regarding thermal performance, removing the added object, designating the location as a location not eligible for the adding, and replacing the location with a new location for the structure selected from locations eligible for the adding based on the predetermined criterion for operation B.

9. The one or more non-transitory computer-readable media recited in claim 8 , wherein the method further comprises:

smoothing edges of the new structure derived after the predetermined condition regarding design space is met.

10. The one or more non-transitory computer-readable media recited in claim 8 , wherein the method further comprises:

changing the locations not eligible for the adding to locations eligible for the adding; and

repeating operations A, B, C and D by using the new structure derived after the predetermined condition regarding design space is met as the heat sink base.

11. The one or more non-transitory computer-readable media recited in claim 8 , wherein the predetermined criterion is being a location having a highest fluid apparent surface temperature value.

12. The one or more non-transitory computer-readable media recited in claim 8 , wherein the predetermined criterion is being a location having a highest bottleneck heat transfer characteristic value or a highest shortcut heat transfer characteristic value.

13. The one or more non-transitory computer-readable media recited in claim 8 , wherein the thermal performance is represented by thermal resistance and the predetermined condition regarding thermal performance is improvement in thermal resistance is above a percentage value.

14. The one or more non-transitory computer-readable media recited in claim 8 , wherein the predetermined condition regarding design space is there is no location eligible for the adding left in the design space.

15. A system, comprising:

one or more processors, the one or more processors programmed to perform a method, the method comprising:

A: determining a location on a heat sink base based on a simulation of a structure in a cooling environment and a predetermined criterion, the structure comprising the heat sink base and a heat source;

B: adding an object to the location to form a new structure;

C: simulating the new structure to determine thermal performance of the new structure; and

D: repeating operations B and C until a predetermined condition regarding design space is met, wherein the repeating comprises:

if the thermal performance of the new structure meets a predetermined condition regarding thermal performance, replacing the location with a new location determined for the new structure based on the simulating and the predetermined criterion for operation B; and

if the thermal performance of the new structure does not meet the predetermined condition regarding thermal performance, removing the added object, designating the location as a location not eligible for the adding, and replacing the location with a new location for the structure selected from locations eligible for the adding based on the predetermined criterion for operation B.

16. The system recited in claim 15 , wherein the method further comprises:

smoothing edges of the new structure derived after the predetermined condition regarding design space is met.

17. The system recited in claim 15 , wherein the method further comprises:

changing the locations not eligible for the adding to locations eligible for the adding; and

repeating operations A, B, C and D by using the new structure derived after the predetermined condition regarding design space is met as the heat sink base.

18. The system recited in claim 15 , wherein the predetermined criterion is being a location having a highest fluid apparent surface temperature value.

19. The system recited in claim 15 , wherein the predetermined criterion is being a location having a highest bottleneck heat transfer characteristic value or a highest shortcut heat transfer characteristic value.

20. The system recited in claim 15 , wherein the thermal performance is represented by thermal resistance and the predetermined condition regarding thermal performance is improvement in thermal resistance is above a percentage value.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Jun 24, 2021
From: MENTOR GRAPHICS CORPORATION; SIEMENS INDUSTRY SOFTWARE INC.
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 056675/0285 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2015
From: BORNOFF, ROBIN; PARRY, JOHN
To: MENTOR GRAPHICS CORPORATION
Reel/Frame 036346/0718 →