Semiconductor Package with Integrated Heat Spreader
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the semiconductor package to a mounting surface. The semiconductor package also includes a control FET of a power converter switching stage having a control drain attached to the die side of the control conductive carrier. The control conductive carrier is configured to sink heat produced by the control FET into the mounting surface. The semiconductor package includes a sync conductive carrier having another die side and another opposite I/O side connecting the semiconductor package to the mounting surface, and a sync FET of the power converter switching stage having a sync source attached to the die side of the sync conductive carrier.
1 - 20 . (canceled)
21 . A semiconductor package comprising:
a control conductive carrier connecting said semiconductor package to a mounting surface;
a control FET having a control drain attached to said control conductive carrier;
said control conductive carrier configured to sink heat produced by said control FET into said mounting surface.
22 . The semiconductor package of claim 21 , further comprising a sync conductive carrier connecting said semiconductor package to said mounting surface, and a sync FET having a sync source attached to said sync conductive carrier.
23 . The semiconductor package of claim 21 , wherein said control conductive carrier comprises a portion of a lead frame
24 . The semiconductor package of claim 21 , wherein said control FET comprises a silicon FET.
25 . The semiconductor package of claim 21 , wherein said control FET comprises a III-Nitride FET.
26 . The semiconductor package of claim 21 , further comprising a driver integrated circuit (IC) for driving said control FET.
27 . The semiconductor package of claim 21 , wherein said control FET is part of a power converter switching stage.
28 . The semiconductor package of claim 27 , wherein said power converter switching stage is part of a buck converter.
29 . A semiconductor package comprising:
a sync conductive carrier connecting said semiconductor package to a mounting surface;
a sync FET having a sync source attached to said sync conductive carrier;
said sync conductive carrier configured to sink heat produced by said sync FET into said mounting surface.
30 . The semiconductor package of claim 29 , further comprising a control conductive carrier connecting said semiconductor package to said mounting surface, and a control FET having a control drain attached to said control conductive carrier.
31 . The semiconductor package of claim 29 , wherein said sync conductive carrier comprises a portion of a lead frame
32 . The semiconductor package of claim 29 , wherein said sync FET comprises a silicon FET.
33 . The semiconductor package of claim 29 , wherein said sync FET comprises a III-Nitride FET.
34 . The semiconductor package of claim 29 , further comprising a driver integrated circuit (IC) for driving said sync FET.
35 . The semiconductor package of claim 29 , wherein said sync FET is part of a power converter switching stage.
36 . The semiconductor package of claim 35 , wherein said power converter switching stage is part of a buck converter.