IP Library Granted Patent US 9,385,276
Granted Patent B2
US 9,385,276 · App. 14/825,902 · Granted Jul 5, 2016

Epitaxial devices

Inventors: Anton deVilliers (Boise, ID); Erik Byers (Boise, ID); Scott E. Sills (Boise, ID)
Assignee: Micron Technology, Inc.
H01L33/30C30B29/406C30B33/00H01L21/0243H01L21/0254H01L21/02381H01L21/02658H01L21/3086H01L33/0008H01L33/22H01L33/007
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Quick Facts
Patent No.
US 9,385,276
App. No.
14/825,902
Granted
Jul 5, 2016
Kind
B2
Abstract

Epitaxial growth methods and devices are described that include a textured surface on a substrate. Geometry of the textured surface provides a reduced lattice mismatch between an epitaxial material and the substrate. Devices formed by the methods described exhibit better interfacial adhesion and lower defect density than devices formed without texture. Silicon substrates are shown with gallium nitride epitaxial growth and devices such as LEDs are formed within the gallium nitride.

Claims (27)

1. A light emitting diode, comprising:

an epitaxially grown binary gallium compound having a first surface and a second surface that is opposite and substantially parallel to the first surface;

one or more angled features formed in the first surface, wherein the angled features are angled with respect to the second surface; and

a P-N junction located in the epitaxially grown binary gallium compound to provide light as electrons combine with holes across the P-N junction.

2. The light emitting diode of claim 1 , wherein the epitaxially grown binary gallium compound is gallium nitride.

3. The light emitting diode of claim 1 , wherein the epitaxially grown binary gallium compound is gallium arsenide.

4. The light emitting diode of claim 1 , wherein the epitaxially grown binary gallium compound is gallium antimonide.

5. The light emitting diode of claim 1 , wherein the one or more angled features includes an array of angled features.

6. The light emitting diode of claim 5 , wherein the array of angled features are included in an array of pyramid shaped features.

7. The light emitting diode of claim 1 , wherein the one or more angled features are asymmetric.

8. A light emitting diode, comprising:

an epitaxially grown gallium nitride material having a first surface and a second surface that is opposite and substantially parallel to the first surface;

one or more angled features formed in the first surface, wherein the angled features are angled with respect to the second surface; and

a P-N junction located in the epitaxially grown gallium nitride material to provide light as electrons combine with holes across the P-N junction.

9. The light emitting diode of claim 8 , wherein the one or more angled features includes an array of angled features.

10. The light emitting diode of claim 9 , wherein the array of angled features are included in an array of pyramid shaped features.

11. The light emitting diode of claim 9 , wherein the array of angled features are included in an array of conical shaped structures.

12. The light emitting diode of claim 8 , wherein the one or more angled features are asymmetric.

13. The light emitting diode of claim 1 , wherein the one or more angled features are angled between approximately 10 and 15 degrees with respect to the second surface.

14. A light emitting diode, comprising:

an epitaxially grown gallium nitride material having a first surface and a second surface that is opposite and substantially parallel to the first surface;

one or more angled features formed in the first surface, wherein the angled features each have an angled surface defining an angle with respect to the second surface;

wherein a lattice spacing of the gallium nitride material along the angled surface substantially corresponds to a modified lattice spacing of silicon at the angle; and

a P-N junction located in the epitaxially grown gallium nitride material to provide light as electrons combine with holes across the P-N junction.

15. The light emitting diode of claim 14 , wherein the angled surfaces include a number of periodically repeating angled surfaces wherein each angle is between 0 degrees and 90 degrees with respect to the second surface.

16. The light emitting diode of claim 15 , wherein the angled surfaces include a number of periodically repeating angled surfaces wherein each angle is between 10 degrees and 15 degrees with respect to the second surface.

17. The light emitting diode of claim 14 , wherein the one or more angled surfaces are included in a number of linear features.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Continuity (5)
Continuation 14299742 · Jun 9, 2014
Division 13901767 · May 24, 2013
Continuation 13528574 · Jun 20, 2012
Division 12826275 · Jun 29, 2010
Related Publication 20150349204A1 · Dec 3, 2015