Planarization method and planarization apparatus
View Patent ↗According to one embodiment, a planarization method and a planarization apparatus are provided. In the planarization method, a work surface of a work piece is planarized by bringing the work surface of the work piece containing a silicon oxide film and a surface of a solid plate onto which hydrogen ions are adsorbed, into contact or extremely close proximity with one another in a state in which a process liquid containing fluorine ions is supplied to the surface of the solid plate.
1. A planarization apparatus comprising:
a solid plate containing a solid acidic catalyst which is an acidic cation exchanger having a functioning group with an acid dissociation constant of 1.0×10 −3 or less;
a process liquid supply unit which is configured to supply a process liquid; and
a maintaining portion which is configured to hold a work piece and is configured to bring a work surface of the work piece and a surface of the solid plate into contact or extremely close proximity with one another in the process liquid.
2. The planarization apparatus according to claim 1 , further comprising:
a heat source connecting to the solid plate to adjust a temperature of the work piece.
3. The planarization apparatus according to claim 1 , wherein
the solid plate is configured to be rotatable or slidable.
4. The planarization apparatus according to claim 1 , wherein
the maintaining portion is configured to be rotatable or slidable.
5. The planarization apparatus according to claim 1 , wherein
the work piece contains a silicon oxide film, wherein the process liquid contains fluorine ions, and wherein the fluorine ions react with the work piece in accordance with a chemical equation of SiO 2 +6F − +6H + →SiF6 2− +2H + +2H 2 O.
6. The planarization apparatus according to claim 5 , wherein
the process liquid is a sodium fluoride aqueous solution, a potassium fluoride aqueous solution, an ammonium fluoride aqueous solution, or a mixed solution of the above and a hydrogen fluoride aqueous solution.
7. A planarization apparatus comprising:
a rotatable solid plate containing a solid acidic catalyst which is an acidic cation exchanger having a functioning group with an acid dissociation constant of 1.0×10 −3 or less;
a process liquid supply unit which is configured to supply a process liquid onto the rotatable solid plate; and
a maintaining portion which is configured to hold a work piece and is configured to bring a work surface of the work piece and a surface of the solid plate into contact or extremely close proximity with one another where the process liquid is supplied to an upper stream side of the rotatable solid plate to flow to the work piece.
8. The planarization apparatus according to claim 7 , further comprising:
a heat source connecting to the solid plate to adjust a temperature of the work piece.
9. The planarization apparatus according to claim 7 , wherein
the process liquid supply unit has a port such that the process liquid is supplied onto the solid plate through the port.
10. The planarization apparatus according to claim 7 , wherein
the process liquid supply unit has a plurality of ports such that the process liquid is supplied onto the solid plate through the plurality of the ports.
11. The planarization apparatus according to claim 7 , wherein
a diameter of the solid plate is at least twice or more than a diameter of the work piece.
12. The planarization apparatus according to claim 7 , wherein
the work piece contains a silicon oxide film, wherein the process liquid contains fluorine ions, and wherein the fluorine ions react with the work piece in accordance with a chemical equation of SiO 2 +6F − +6H + →SiF6 2− +2H + +2H 2 O.
13. The planarization apparatus according to claim 12 , wherein
the process liquid is a sodium fluoride aqueous solution, a potassium fluoride aqueous solution, an ammonium fluoride aqueous solution, or a mixed solution of the above and a hydrogen fluoride aqueous solution.