Chip antenna for near field communication and method of manufacturing the same

1. A chip antenna for near field communication, the chip antenna comprising:

a substrate;

a first antenna element that has a fish bone structure and is disposed on the substrate; and

a second antenna element disposed on the first antenna element,

wherein the first antenna element comprises a first metal wire, a plurality of second metal wires attached to a side surface of the first metal wire, and a plurality of third metal wires attached to the other side surface of the first metal wire, and

wherein the second and third metal wires are perpendicular to a length direction of the first metal wire.

2. The chip antenna of claim 1 , wherein the substrate, the first antenna element, and the second antenna element are included in a single chip.

3. The chip antenna of claim 1 , wherein the first and second antenna elements are formed on an external surface of the chip.

4. The chip antenna of claim 1 , wherein the substrate is a lower layer including a plurality of devices.

5. The chip antenna of claim 1 , wherein the first antenna element is covered by an insulating layer, and the second antenna element is formed on the insulating layer.

6. The chip antenna of claim 1 , wherein the second antenna element is a dipole antenna.

7. A chip antenna for near field communication, the chip antenna comprising:

a substrate;

a first antenna element that is disposed on the substrate and comprises:

a backbone wire;

a plurality of left-side rib wires that extend from the backbone wire;

a plurality of right-side rib wires that extend from the backbone wire in a direction opposite to the plurality of left-side rib wires;

a plurality of first metal pads respectively disposed on edges of the plurality of left-side rib wires; and

a plurality of second metal pads respectively disposed on edges of the plurality of right-side rib wires; and

a second antenna element that is disposed on the first antenna element.

8. The chip antenna of claim 7 , wherein a capacitance of the first antenna element is controlled by a distance between two adjacent ones of the plurality of left-side rib wires.

9. The chip antenna of claim 7 , wherein a length of the second antenna element is shorter than a length of the backbone wire, and a width of the second antenna element is shorter than a sum of a width of the backbone wire, a width of the left-side rib wires, and a width of the right-side rib wires so that an entire portion of the second antenna element is disposed on the first antenna element.

10. A method of manufacturing a near field communication chip antenna, the method comprising:

forming a first antenna element on a substrate to have a fish bone structure;

forming an insulating layer covering the first antenna element on the substrate; and

forming a second antenna element on the insulating layer,

wherein the forming the first antenna element comprises forming a first metal wire, forming a plurality of second metal wires attached to a side surface of the first metal wire, and forming a plurality of third metal wires attached to the other side surface of the first metal wire, and

wherein the second and third metal wires are perpendicular to a length direction of the first metal wire.

11. The method of claim 10 , wherein the substrate is formed of silicon.

12. The method of claim 10 , wherein the substrate includes a plurality of devices.

13. The method of claim 10 , wherein the forming the first antenna element includes:

forming a metal layer on the substrate; and

forming the fish bone structure by patterning the metal layer.

14. The method of claim 10 , wherein the second antenna element is a dipole antenna.