IP Library Granted Patent US 10,418,241
Granted Patent B2
US 10,418,241 · App. 14/831,514 · Granted Sep 17, 2019

Metal chloride gas generator, hydride vapor phase epitaxy growth apparatus, and nitride semiconductor template

Inventors: Taichiroo Konno (Hitachi, JP); Hajime Fujikura (Mito, JP); Michiko Matsuda (Arakawa-ku, JP)
Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
H01L21/0262C30B25/08C30B25/14C30B29/403C30B29/406H01L21/0254H01L21/02576H01L21/02581H01L29/045H01L29/2003H01L29/207H01L29/36
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Quick Facts
Patent No.
US 10,418,241
App. No.
14/831,514
Granted
Sep 17, 2019
Kind
B2
Abstract

A nitride semiconductor template includes a substrate, and a chlorine-containing nitride semiconductor layer. The chlorine-containing nitride semiconductor layer contains an iron concentration of not higher than 1×10 17 cm −3 .

Claims (36)

1. A nitride semiconductor template, comprising:

a substrate;

a buffer layer disposed on the substrate; and

a chlorine-containing nitride semiconductor layer,

wherein the chlorine-containing nitride semiconductor layer contains an Fe concentration of not higher than 9.0×10 15 cm −3 , a Cr concentration of not higher than 8.0×10 14 cm −3 , and a Ni concentration of not higher than 4.0×10 15 cm −3 , and

wherein the buffer layer comprises AlN.

2. The nitride semiconductor template according to claim 1 , wherein the substrate comprises a sapphire substrate.

3. The nitride semiconductor template according to claim 2 , wherein a full width at half maximum of a (0004) plane of X-ray diffraction is not less than 200 seconds and not more than 300 seconds.

4. The nitride semiconductor template according to claim 2 , wherein the chlorine-containing nitride semiconductor layer comprises a Si-doped GaN layer containing a Si concentration of not less than 5×10 18 cm −3 and not more than 5×10 19 cm −3 .

5. A nitride semiconductor template, comprising:

a substrate;

a buffer layer disposed on the substrate; and

a chlorine-containing nitride semiconductor layer; and

an undoped GaN layer disposed on the buffer layer,

wherein the chlorine-containing nitride semiconductor layer contains an Fe concentration of not higher than 9.0×10 15 cm −3 , a Cr concentration of not higher than 8.0×10 14 cm −3 , and a Ni concentration of not higher than 4.0×10 15 cm −3 .

6. The nitride semiconductor template according to claim 5 , wherein the chlorine-containing nitride semiconductor layer is disposed on the undoped GaN layer.

7. The nitride semiconductor template according to claim 6 , wherein the chlorine-containing nitride semiconductor layer comprises a Si-doped GaN layer.

8. The nitride semiconductor template according to claim 2 , wherein the chlorine-containing nitride semiconductor layer comprises a Si-doped GaN layer.

9. The nitride semiconductor template according to claim 2 , wherein the Fe concentration of the chlorine-containing nitride semiconductor layer is in a range from 7.0×10 14 cm −3 to 9.0×10 15 cm −3 .

10. A nitride semiconductor template, comprising:

a substrate;

a chlorine-containing nitride semiconductor layer; and

an undoped GaN layer disposed below the chlorine-containing nitride semiconductor layer,

wherein the chlorine-containing nitride semiconductor layer contains an Fe concentration of not higher than 9.0×10 15 cm −3 , a Cr concentration of not higher than 8.0×10 14 cm −3 , and a Ni concentration of not higher than 4.0×10 15 cm −3 , and

wherein an Fe concentration of the undoped GaN layer is in a range from 7.0×10 14 cm −3 to 9.0×10 15 cm −3 .

11. The nitride semiconductor template according to claim 10 , wherein the Cr concentration of the chlorine-containing nitride semiconductor layer is in a range from 6.0×10 13 cm −3 to 8.0×10 14 cm −3 .

12. The nitride semiconductor template according to claim 11 , wherein the Cr concentration of the undoped GaN layer is in a range from 6.0×10 13 cm −3 to 8.0×10 14 cm −3 .

13. The nitride semiconductor template according to claim 2 , wherein the Cr concentration of the chlorine-containing nitride semiconductor layer is in a range from 6.0×10 13 cm −3 to 8.0×10 14 cm −3 .

14. The nitride semiconductor template according to claim 2 , wherein the sapphire substrate comprises a Patterned Sapphire Substrate (PSS) in which an uneven surface is formed on the sapphire substrate.

15. The nitride semiconductor template according to claim 2 , wherein the chlorine-containing nitride semiconductor layer comprises an n-type GaN layer.

16. The nitride semiconductor template according to claim 15 , wherein the n-type GaN layer has a thickness of 3.5 μm to 8 μm on the sapphire substrate.

17. The nitride semiconductor template according to claim 15 , wherein the n-type GaN layer is doped with Si.

18. The nitride semiconductor template according to claim 15 , wherein a two-layer structure including is disposed on the n-type GaN layer.

19. The nitride semiconductor template according to claim 18 , wherein a Schottky electrode including a two-layer structure of Ni/Au is further disposed on the n-type GaN layer.

20. The nitride semiconductor template according to claim 10 , further comprising:

a buffer layer disposed on the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037730/0397 →
Priority Claims (1)
JP 2011-178413 · Aug 17, 2011 · national
Continuity (2)
Division 13569983 · Aug 8, 2012
Related Publication 20150357416A1 · Dec 10, 2015