Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes: (a) supplying a halogen-based source gas containing a first element to a substrate; (b) supplying a reaction gas containing a second element to react with the first element to the substrate; (c) forming a first layer containing the first element and the second element by time-dividing and performing (a) and (b) a predetermined number of times; (d) supplying an organic source gas containing the first element to the substrate; (e) supplying the reaction gas to the substrate; (f) forming a second layer containing the first element and the second element by time-dividing and performing (d) and (e) a predetermined number of times; and (g) forming a thin film containing the first element and the second element on the substrate by time-dividing and performing (c) and (f) a predetermined number of times.
1. A method of manufacturing a semiconductor device comprising:
(a) supplying a halogen-based source gas containing a first element to a substrate;
(b) supplying a reaction gas containing a second element to react with the first element to the substrate;
(c) forming a first layer containing the first element and the second element by time-dividing and performing (a) and (b) a predetermined number of times;
(d) supplying an organic source gas containing the first element to the substrate;
(e) supplying the reaction gas to the substrate;
(f) forming a second layer containing the first element and the second element by time-dividing and performing (d) and (e) a predetermined number of times; and
(g) forming a thin film containing the first element and the second element on the substrate by time-dividing and performing (c) and (f) a predetermined number of times.
2. The method according to claim 1 , wherein the first element is a metal element, and the work function of the thin film is controlled by controlling the number of times the first layer forming is performed and the number of times the second layer forming is performed.
3. The method according to claim 2 , wherein the first element is titanium.
4. The method according to claim 1 , wherein the concentration of at least one of carbon, nitrogen, and chlorine contained in the thin film is controlled by controlling the number of times the first layer forming is performed and the number of times the second layer forming is performed.
5. The method according to claim 4 , wherein the reaction gas is a nitrogen-containing gas.
6. The method according to claim 5 , wherein the concentration of at least one of carbon, nitrogen, and chlorine contained in the thin film is controlled by controlling the number of times the first layer forming is performed and the number of times the second layer forming is performed.
7. The method according to claim 1 , wherein the first element is a metal element, and the crystallinity of the thin film is controlled by controlling the number of times the first layer forming is performed and the number of times the second layer forming is performed.
8. The method according to claim 1 , wherein the first element is a metal element, and the work function of the thin film is controlled by controlling the number of times the first layer forming is performed and the number of times the second layer forming is performed.
9. A method of manufacturing a semiconductor device comprising:
(a) supplying an organic source gas containing a first element to a substrate;
(b) supplying a halogen-based source gas containing the first element to the substrate;
(c) supplying a reaction gas containing a second element to react with the first element to the substrate;
(d) forming a first layer containing the first element and the second element by time-dividing and performing (a), (b), and (c) a predetermined number of times;
(e) supplying the halogen-based source gas to the substrate;
(f) supplying the reaction gas to the substrate;
(g) forming a second layer containing the first element and the second element by time-dividing and performing (e) and (f) a predetermined number of times; and
(h) forming a thin film containing the first element and the second element on the substrate by time-dividing and performing (d) and (g) a predetermined number of times.
10. The method according to claim 9 , wherein the concentration of at least one of carbon, nitrogen, and chlorine contained in the thin film is controlled by controlling the number of times the first layer forming is performed and the number of times the second layer forming is performed.
11. A method of manufacturing a semiconductor device and a substrate processing method that include:
(a) supplying an organic source gas containing a first element to a substrate;
(b) supplying a halogen-based source gas containing the first element to the substrate;
(c) forming a first layer containing the first element by time-dividing and performing (a) and (b) a predetermined number of times;
(d) forming a second layer containing the first element and a second element by supplying a reaction gas containing the second element to react with the first element to the substrate a predetermined number of times;
and (e) forming a thin film containing the first element and the second element on the substrate by time-dividing and performing (c) and (d) a predetermined number of times.