IP Library › Patent Application 14833406
Patent Application
App. No. 14/833,406

Hybrid Silicon Lasers on Bulk Silicon Substrates

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Quick Facts
Patent No.
US None
App. No.
14/833,406
Abstract

Hybrid silicon lasers are provided including a bulk silicon substrate, a localized insulating layer that extends on at least a portion of the bulk silicon substrate, an optical waveguide structure on an upper surface of the localized insulating layer. The optical waveguide structure includes an optical waveguide including a silicon layer. A lasing structure is provided on the optical waveguide structure.

Claims (49)

1 . A hybrid silicon laser comprising:

a bulk silicon substrate;

a localized insulating layer extending on at least a portion of a surface of the bulk silicon substrate;

an optical waveguide structure on a surface of the localized insulating layer and including an optical waveguide as a silicon layer; and

a lasing structure on the optical waveguide structure.

2 . The hybrid silicon laser of claim 1 , wherein the localized insulating layer comprises a buried insulating layer buried in a bulk trench in the bulk silicon substrate.

3 . The hybrid silicon laser of claim 1 , wherein the silicon layer comprises a crystallized silicon layer.

4 . The hybrid silicon laser of claim 1 , wherein a center point of the optical waveguide is deviated from a center point of the localized insulating layer.

5 . The hybrid silicon laser of claim 1 , wherein the lasing structure comprises a Group III-V semiconductor gain layer coupled to the optical waveguide structure.

6 . (canceled)

7 . The hybrid silicon laser of claim 1 , wherein the lasing structure comprises one of a mesa type structure and a ridge type structure.

8 . The hybrid silicon laser of claim 1 , wherein the lasing structure comprises a light-emitting composite layer and a clad layer that is formed on the light-emitting composite layer.

9 . The hybrid silicon laser of claim 1 , wherein a buffer layer for crystal growth I provided on the optical waveguide structure.

10 . The hybrid silicon laser of claim 1 , wherein a combining medium layer for combining the lasing structure and the optical waveguide structure is provided between the lasing structure and the optical waveguide structure.

11 . A hybrid silicon laser comprising:

a bulk silicon substrate;

a localized insulating layer that extends on at least a portion of a surface of the bulk silicon substrate;

an optical waveguide structure on the bulk silicon substrate and the localized insulating layer; and

a lasing structure on the optical waveguide structure.

12 . The hybrid silicon laser of claim 11 , wherein the optical waveguide structure comprises:

a silicon layer on the bulk silicon substrate and the localized insulating layer;

an optical waveguide layer in the silicon layer; and

an optical waveguide defined by the optical waveguide layer.

13 . The hybrid silicon laser of claim 12 , wherein the optical wave guide layer is in a trench at opposite sides of the optical waveguide in the silicon layer and includes a material layer having a refractive index lower than a refractive index of the silicon layer.

14 . (canceled)

15 . The hybrid silicon laser of claim 11 , wherein the lasing structure comprises a light-emitting composite layer on the optical waveguide structure and a clad layer on the light-emitting composite layer.

16 . The hybrid silicon laser of claim 15 , wherein the light-emitting composite layer comprises:

a light-emitting layer configured to emit light;

a first separate confinement heterostructure layer between the optical waveguide structure and the light-emitting layer; and

a second separate confinement heterostructure layer on the light-emitting layer.

17 . The hybrid silicon laser of claim 15 , wherein an electric connection layer is on the optical waveguide structure and between the light-emitting composite layer and the optical waveguide structure.

18 . The hybrid silicon laser of claim 17 , wherein a buffer layer for crystal growth is provided between the optical waveguide structure and the electric connection layer.

19 .- 21 . (canceled)

22 . A hybrid silicon laser comprising:

a bulk silicon substrate;

a localized insulating layer that extends on at least a portion of the bulk silicon substrate;

an optical waveguide structure comprising:

a silicon layer on the bulk silicon substrate and the localized insulating layer;

an optical waveguide layer in the silicon layer; and

an optical waveguide defined by the optical waveguide layer; and

a lasing structure comprising:

a first electric connection layer on the optical waveguide structure;

a light-emitting composite layer on the first electric connection layer; and

a clad layer on the light-emitting composite layer.

23 . The hybrid silicon laser of claim 22 , wherein the optical waveguide layer comprises a gas layer in a trench in the silicon layer with respect to the optical waveguide.

24 .- 25 . (canceled)

26 . The hybrid silicon laser of claim 22 , wherein a second electric connection layer is provided on the clad layer.

27 . The hybrid silicon laser of claim 26 , wherein a first electric terminal and a second electric terminal are provided on each of the first electric connection layer and the second electric connection layer, respectively.

28 .- 33 . (canceled)

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2015
From: SHIN, DONG-JAE; KIM, DONG-HYUN; KIM, SEONG-GU; JOE, IN-SUNG; HA, KYOUNG-HO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 036400/0889 →