Integrated photodetector waveguide structure with alignment tolerance
An encapsulated integrated photodetector waveguide structures with alignment tolerance and methods of manufacture are disclosed. The method includes forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s). The method further includes forming a photodetector fully landed on the waveguide structure.
1. A sensor structure, comprising:
a waveguide structure bounded by one or more shallow trench isolation (STI) structures; and
a photodetector fully landed on the waveguide structure, adjacent to the one or more STI structures wherein the photodetector has a bottom and lateral sides, and the sensor structure further comprising an encapsulating material encapsulating the bottom and lateral sides of the photodetector, at least a portion of the encapsulating material encapsulating the lateral sides of the photodetector landing on the waveguide structure, the photodetector contacting the waveguide structure through a hole in the encapsulating material.
2. The sensor structure of claim 1 , wherein the waveguide structure is tapered.
3. The sensor structure of claim 1 , wherein the waveguide structure is continuously tapered.
4. The sensor structure of claim 3 , wherein the photodetector is continuously tapered.
5. The sensor structure of claim 4 , wherein the continuously tapered photodetector is fully landed on a planar surface of the continuously tapered waveguide structure.
6. The sensor structure of claim 4 , wherein the continuously tapered photodetector is formed as a double tapered photodetector.
7. The sensor structure of claim 6 , wherein the double tapered photodetector includes a taper at its input end portion.
8. The sensor structure of claim 6 , wherein the continuously tapered waveguide structure is formed from silicon material or silicon on insulator material.