Manufacturing device, manufacturing management system, and manufacturing control program
Provided is a manufacturing apparatus that manufactures a high-quality manufacturing object by using component information per unit of individual electronic component or per unit of package in a plurality of electronic components that have been packaged. The manufacturing apparatus is a manufacturing apparatus that manufactures a product by taking out each electronic component from packaged components in which a plurality of electronic components are packaged. The manufacturing apparatus is provided with: a component information reading unit that reads component information per unit of electronic component or per unit of package in the packaged components; a manufacturing control unit that controls, using the read component information, the manufacturing treatment of product into which electronic components indicated in the component information are incorporated; and an incorporation information generating unit that generates incorporation information regarding a state of incorporation of each electronic component in the product.
1. A mounter that takes out each individual electronic component from packaged components in which a plurality of electronic components have been packaged and mounts the taken-out each individual electronic component on a board, the mounter having a memory, a CPU, and an interface and comprising:
a design information reading unit incorporated in the CPU that reads design information;
a component information reading unit incorporated in the CPU that reads individual component information from a component information storage unit in which component information on characteristics of individual electronic components in the packaged components, including information to be used at least when the mounter incorporates said each individual electronic component from the packaged components, is stored, the characteristics of the individual electronic components comprising detailed information containing an error of an electronic component per unit of package even if the individual electronic components are the same in type, the component information; and
a manufacturing control unit incorporated in the CPU that controls, using the read individual component information and the read design information received from the component information reading unit and the design information reading unit incorporated in the CPU, a manufacturing treatment of a manufacturing object into which the individual electronic components indicated in the read component information are incorporated.
2. The mounter according to claim 1 , further comprising:
an incorporation information generating unit incorporated in the CPU that generates incorporation information regarding a state of incorporation of said each individual electronic component in the manufacturing object that has been manufactured by the manufacturing control unit and that outputs the generated incorporation information.
3. The mounter according to claim 1 , wherein the component information further includes characteristics per unit of package in the packaged components, the characteristics per unit of package comprising detailed information containing an error per unit of individual package even if the packages are the same.
4. A manufacturing management system comprising:
a mounter that takes out each individual electronic component from packaged components in which a plurality of electronic components have been packaged and mounts the taken-out each individual electronic component on a board, wherein the mounter has a memory, a CPU, and an interface and comprises:
a design information reading unit incorporated in the CPU that reads design information;
a component information reading unit incorporated in the CPU that reads individual component information from a component information storage unit in which component information on characteristics of individual electronic components in the packaged components, including information to be used at least when the mounter incorporates said each individual electronic component from the packaged components, is stored, the characteristics of the individual electronic components comprising detailed information containing an error of an electronic component per unit of package even if the individual electronic components are the same in type, the component information;
a manufacturing control unit incorporated in the CPU that controls, using the read individual component information and the read design information received from the component information reading unit and the design information reading unit incorporated in the CPU, a manufacturing treatment of a manufacturing object into which the individual electronic components indicated in the read component information are incorporated, and
an incorporation information generating unit incorporated in the CPU that generates incorporation information regarding a state of incorporation of said each individual electronic component in the manufacturing object that has been manufactured by the manufacturing control unit and that outputs the generated incorporation information; and
a verification apparatus that verifies the manufacturing object using the incorporation information outputted from the mounter.
5. The manufacturing management system of claim 4 , wherein the verification apparatus has a verification apparatus CPU and comprises:
an incorporation information reading unit of the verification apparatus CPU that reads the incorporation information;
an operation control unit of the verification apparatus CPU that controls an operation of the manufacturing object;
a test unit of the verification apparatus CPU that tests whether the operation of the manufacturing object is proper or not, based on the read incorporation information; and
a test result outputting unit of the verification apparatus CPU that outputs a result of the test as a test result.
6. The manufacturing management system according to claim 5 , wherein:
the mounter is a chip mounter that arranges the individual electronic components on a board, and the verification apparatus is a tester; and
the test unit of the verification apparatus CPU not only tests whether the operation of the manufacturing object is proper or not but also tests by determining which is a cause of a defect among the mounter, the individual electronic components, and the board.
7. The manufacturing management system of claim 4 , wherein the verification apparatus has a verification apparatus CPU and comprises:
an incorporation information reading unit of the verification apparatus CPU that reads the incorporation information;
a design information reading unit of the verification apparatus CPU that reads, from a design information storage unit that stores design information of the manufacturing object, the design information; and
an adjustment unit of the verification apparatus CPU that performs an adjustment by correcting an operation of the manufacturing object based on the read incorporation information and the read design information.
8. The manufacturing management system according to claim 4 , wherein the component information further includes characteristics per unit of package in the packaged components, the characteristics per unit of package comprising detailed information containing an error per unit of individual package even if the packages are the same.