IP Library Granted Patent US 9,746,898
Granted Patent B2
US 9,746,898 · App. 14/836,618 · Granted Aug 29, 2017

Systems and methods for controlling processing device power consumption

Inventors: Philip J. Grossmann (Austin, TX); Joseph A. Olmsted (Cedar Park, TX)
Assignee: Dell Products LP
G06F1/3206G06F1/206G06F1/3296
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,746,898
App. No.
14/836,618
Filed
Aug 26, 2015
Granted
Aug 29, 2017
Kind
B2
Art Unit
2115
USPC
713/320
Abstract

Systems and methods that may be implemented to decrease power consumption levels of a first processing device (e.g., such as a CPU) based on monitored operating temperature of a second and different processing device (e.g., such as a discrete GPU) in a shared multiple-processor cooling resource environment of an information handling system architecture. The first processing device power consumption levels may be so controlled such that the operating temperature of the second processing device does not reach a temperature at which the second processing device is throttled.

Claims (67)

1. A method of controlling processing device power consumption in an information handling system having multiple processing devices, the method comprising:

simultaneously operating at least one first processing device and at least one second processing device of the information handling system while simultaneously cooling the first and second processing devices together using shared cooling resources of the information handling system, and with the first processing device being operated in an overclocked mode at a maximum allowable power limit value and with the second processing device being operated in a non-throttled state;

then using at least one processing device of the information handling system to decrease the maximum allowable power limit value of the first processing device to limit overclocking of the first processing device if a monitored real time operating temperature of the second processing device is greater than or equal to a predefined upper temperature value that is a maximum non-throttled operating temperature for the second processing device; and

then operating the first processing device in a non-overclocked mode at the decreased maximum allowable power limit value while continuing to operate the second processing device in a non-throttled condition state at a temperature that is below the maximum non-throttled operating temperature for the second processing device.

2. The method of claim 1 , further comprising then using at least one processing device of the information handling system to then increase the maximum allowable power limit value of the first processing device to allow overclocking of the first processing device if a monitored real time operating temperature of the second processing device is less than or equal to a predefined lower temperature value that is lower than the predefined upper temperature value; and then operating the first processing device in an overclocked mode at the increased maximum allowable power limit value while continuing to operate the second processing device in a non-throttled state at a temperature that is below the maximum non-throttled operating temperature for the second processing device.

3. The method of claim 1 , further comprising:

(a) simultaneously operating the first processing device and the second processing device of the information handling system within a chassis enclosure of the information handling system while simultaneously cooling the first and second processing devices together using shared cooling resources within the chassis enclosure, and with the first processing device being operated at a first maximum allowable power limit value;

(b) using at least one processing device of the information handling system to monitor the real time operating temperature of the second processing device while operating and cooling the second processing device together with the first processing device while the first processing device is operating at the first maximum allowable power limit value;

(c) then using at least one processing device of the information handling system to decrease the maximum allowable power limit value for the first processing device by a predefined power value increment to a second maximum allowable power limit value that is lower than the first power limit value if the monitored real time operating temperature of the second processing device is greater than or equal to the predefined upper temperature value; and

(d) then simultaneously operating the first processing device and the second processing device while simultaneously cooling the first and second processing devices together using shared cooling resources of the information handling system, and with the first processing device being operated at the second maximum allowable power limit value.

4. The method of claim 3 , further comprising:

(e) using at least one processing device of the information handling system to monitor the real time operating temperature of the second processing device while operating and cooling the second processing device together with the first processing device while the first processing device is operating at the second maximum allowable power limit value; and

(f) then using at least one processing device of the information handling system to increase the maximum allowable power limit value for the first processing device by a predefined power value increment to a third maximum allowable power limit value that is greater than the second power limit value if the monitored real time operating temperature of the second processing device is less than or equal to a predefined lower temperature value; and

where the method further comprises empirically determining the predefined lower temperature value by laboratory testing the same system configuration of the information handling system under use conditions.

5. The method of claim 1 , further comprising:

(a) simultaneously operating the first processing device and the second processing device of the information handling system within a chassis enclosure of the information handling system while simultaneously cooling the first and second processing devices together using shared cooling resources within the chassis enclosure, and with the first processing device being operated at a current maximum allowable power limit value;

(b) using at least one processing device of the information handling system to monitor the real time operating temperature of the second processing device while operating and cooling the second processing device together with the first processing device while the first processing device is operating at the current maximum allowable power limit value;

(c) then using at least one processing device of the information handling system to perform each of the following steps to determine a new current maximum allowable power limit value that may or may not be the same as the previous maximum allowable power limit value:

decreasing the previous current maximum allowable power limit value for the first processing device by a predefined power value increment to determine a new and different current maximum allowable power limit value that is lower than the previous current power limit value if the monitored real time operating temperature of the second processing device is greater than or equal to the predefined upper temperature value; and

increasing the previous current maximum allowable power limit value for the first processing device by a predefined power value increment to determine a new and different current maximum allowable power limit value that is greater than the previous current power limit value if the monitored real time operating temperature of the second processing device is less than or equal to a predefined lower temperature value; and

leaving the previous current maximum allowable power limit value for the first processing device unchanged to determine a new current maximum allowable power limit that is the same as the previous current maximum allowable power limit if the monitored real time operating temperature of the second processing device is less than the predefined upper temperature value and greater than the predefined lower temperature value; and

(d) then iteratively repeating steps (a) through (c).

6. The method of claim 1 , further comprising:

alternately operating the first processing device in a sustained (PL1) power consumption mode and a burst (PL2) higher power consumption mode;

using the maximum allowable power limit value to limit power consumption of the first processing device only while the first processing device is operating in the sustained (PL1) power consumption mode; and

not using the maximum allowable power limit value to limit power consumption of the first processing device while the first processing device is operating in the burst (PL2) higher power consumption mode.

7. The method of claim 6 , where the shared cooling resources of the information handling system comprise:

at least one common heat sink that is thermally and mechanically coupled to each of the first processing device and the second processing device; and

at least one cooling fan that circulates air in contact with the heat sink to transfer heat from the heat sink to the circulated cooling air.

8. The method of claim 1 , where the first processing device comprises a CPU; where the information handling system further comprises a system embedded controller communicatively coupled to the CPU and to the second processing device; and where the method further comprises:

simultaneously operating the CPU and the at least one second processing device of the information handling system while simultaneously cooling the first and second processing devices together using shared cooling resources of the information handling system, and with the first processing device being operated at a maximum allowable power limit value; and

then using the system embedded controller to decrease the maximum allowable power limit value of the CPU if a monitored real time operating temperature of the second processing device is greater than or equal to a predefined upper temperature value.

9. The method of claim 1 , further comprising using at least one processing device of the information handling system to allow a user to select an initial value of maximum allowable power limit value before performing the step of using at least one processing device of the information handling system to decrease the maximum allowable power limit value of the first processing device if a monitored real time operating temperature of the second processing device is greater than or equal to a predefined upper temperature value.

10. The method of claim 1 , where the information handling system is a notebook computer having a chassis enclosure that surrounds the first processing device, second processing device, and shared cooling resources; where the first processing device is a central processing unit (CPU) and the second processing device is an internal discrete graphics processing unit (GPU); and where the sum of the cooling requirements of the first processing device operating at maximum processing capacity and the second processing device operating at maximum capacity is greater than the cooling capacity of the shared cooling resources of the information handling system.

11. An information handling system, comprising:

at least one first processing device and at least one second processing device, the first processing device being configured to operate in an overclocked mode at a maximum allowable power limit value while the second processing device being operated in a non-throttled state;

shared cooling resources configured to simultaneously cool the first and second processing devices together; and

at least one processing device communicatively coupled to the first and second processing devices, and configured to:

monitor real time operating temperature of the second processing device, and

decrease the maximum allowable power limit value of the first processing device to limit overclocking of the first processing device if a monitored real time operating temperature of the second processing device is greater than or equal to a predefined upper temperature value that is a maximum non-throttled operating temperature for the second processing device so as to allow the second processing device to continue to operate in a non-throttled condition state and at a temperature that is below the maximum non-throttled operating temperature for the second processing device.

12. The system of claim 11 , where at least one processing device of the information handling system is further configured to then increase the maximum allowable power limit value of the first processing device to allow overclocking of the first processing device if a monitored real time operating temperature of the second processing device is less than or equal to a predefined lower temperature value that is lower than the predefined upper temperature value while the second processing device operates in a non-throttled state at a temperature that is below the maximum non-throttled operating temperature for the second processing device.

13. The system of claim 11 , further comprising a chassis enclosure that contains the first and second processing devices and the shared cooling resources; and where at least one processing device of the information handling system is further configured to:

(a) monitor the real time operating temperature of the second processing device while the second processing device is operating together with the first processing device operating at a first maximum allowable power limit value, and while the first and second processing devices are being simultaneously cooled together using the shared cooling resources within the chassis enclosure; and

(b) then decrease the maximum allowable power limit value for the first processing device by a predefined power value increment to a second maximum allowable power limit value that is lower than the first power limit value if the monitored real time operating temperature of the second processing device is greater than or equal to the predefined upper temperature value such that the first processing device and the second processing device simultaneously operate together while being simultaneously cooled together by the shared cooling resources of the information handling system, and with the first processing device operating at the second maximum allowable power limit value.

14. The system of claim 13 , where at least one processing device of the information handling system is further configured to:

(c) monitor the real time operating temperature of the second processing device while the second processing device is being cooled together with the first processing device and while the first processing device is operating at the decreased second maximum allowable power limit value; and

(d) then increase the maximum allowable power limit value for the first processing device by a predefined power value increment to a third maximum allowable power limit value that is greater than the second power limit value if the monitored real time operating temperature of the second processing device is less than or equal to a predefined lower temperature value after the maximum allowable power limit value for the first processing device is decreased by a predefined power value increment to a second maximum allowable power limit value;

where the predefined lower temperature value is empirically determined by laboratory testing the same system configuration of the information handling system under use conditions.

15. The system of claim 11 , further comprising a chassis enclosure that contains the first and second processing devices and the shared cooling resources; and where at least one processing device of the information handling system is further configured to:

(a) monitor the real time operating temperature of the second processing device while the second processing device is operating together with the first processing device operating at a current maximum allowable power limit value, and while the first and second processing devices are being simultaneously cooled together using the shared cooling resources within the chassis enclosure; and

(b) monitor the real time operating temperature of the second processing device while the second processing device is being simultaneously cooled together by the shared cooling resources of the information handling system and while the first processing device is operating at the current maximum allowable power limit value;

(c) then perform each of the following steps to determine a new current maximum allowable power limit value that may or may not be the same as the previous maximum allowable power limit value:

decreasing the previous current maximum allowable power limit value for the first processing device by a predefined power value increment to determine a new and different current maximum allowable power limit value that is lower than the previous current power limit value if the monitored real time operating temperature of the second processing device is greater than or equal to the predefined upper temperature value; and

increasing the previous current maximum allowable power limit value for the first processing device by a predefined power value increment to determine a new and different current maximum allowable power limit value that is greater than the previous current power limit value if the monitored real time operating temperature of the second processing device is less than or equal to a predefined lower temperature value; and

leaving the previous current maximum allowable power limit value for the first processing device unchanged to determine a new current maximum allowable power limit that is the same as the previous current maximum allowable power limit if the monitored real time operating temperature of the second processing device is less than the predefined upper temperature value and greater than the predefined lower temperature value; and

(d) then iteratively repeating steps (a) through (c).

16. The system of claim 11 , where the first processing device is configured to alternately operate in a sustained (PL1) power consumption mode and a burst (PL2) higher power consumption mode; and where the at least one processing device communicatively coupled to the first and second processing devices is configured to:

use the maximum allowable power limit value to limit power consumption of the first processing device only while the first processing device is operating in the sustained (PL1) power consumption mode; and

not use the maximum allowable power limit value to limit power consumption of the first processing device while the first processing device is operating in the burst (PL2) higher power consumption mode.

17. The system of claim 16 , where the shared cooling resources of the information handling system comprise:

at least one common heat sink that is thermally and mechanically coupled to each of the first processing device and the second processing device; and

at least one cooling fan that circulates air in contact with the heat sink to transfer heat from the heat sink to the circulated cooling air.

18. The system of claim 11 , where the first processing device comprises a CPU; where the information handling system further comprises a system embedded controller communicatively coupled to the CPU and to the second processing device; and where the embedded controller is further configured to:

simultaneously operating the CPU and the at least one second processing device of the information handling system while simultaneously cooling the first and second processing devices together using shared cooling resources of the information handling system, and with the first processing device being operated at a maximum allowable power limit value; and

decrease the maximum allowable power limit value of the CPU if a monitored real time operating temperature of the second processing device is greater than or equal to a predefined upper temperature value while the CPU and the at least one second processing device of the information handling system are simultaneously operating together and being simultaneously cooled together using shared cooling resources of the information handling system while the first processing device is operating at a maximum allowable power limit value.

19. The system of claim 11 , where the at least one processing device of the information handling system is configured to allow a user to select an initial value of maximum allowable power limit value before performing the step of decreasing the maximum allowable power limit value of the first processing device if a monitored real time operating temperature of the second processing device is greater than or equal to a predefined upper temperature value.

20. The system of claim 11 , where the information handling system is a notebook computer having a chassis enclosure that surrounds the first processing device, second processing device, and shared cooling resources; where the first processing device is a central processing unit (CPU) and the second processing device is an internal discrete graphics processing unit (GPU); and where the sum of the cooling requirements of the first processing device operating at maximum processing capacity and the second processing device operating at maximum capacity is greater than the cooling capacity of the shared cooling resources of the information handling system.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF REEL 037160 FRAME 0142 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040027/0812 →
RELEASE OF REEL 037160 FRAME 0239 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040028/0115 →
RELEASE OF REEL 037160 FRAME 0171 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040017/0253 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT - NOTES Recorded Nov 25, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; BOOMI, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 037160/0142 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT - TERM LOAN Recorded Nov 25, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; BOOMI, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037160/0239 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT - ABL Recorded Nov 25, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; BOOMI, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037160/0171 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2015
From: GROSSMANN, PHILIP J.; OLMSTED, JOSEPH A.
To: DELL PRODUCTS L.P.
Reel/Frame 036829/0276 →
Continuity (1)
Related Publication 20170060220A1 · Mar 2, 2017