Electrothermal transducer, and temperature controlling device
The present invention relates to an electrothermal converter, which has at least one cold side and one warm side. Provision is made that all the components of the converter cope with the thermal loads appearing when the converter is operated and/or in particular maintains its mechanical stability.
1. A temperature controller comprising:
A) two or more heat exchangers, each having at least one inward bend and at least one outward bend;
B) an electrothermal converter which has a cold side and a warm side, the electrothermal converter having,
(i) two or more electrical semiconductor components at least partially joined to and connected by at least one bridge element;
(ii) one or more distributor plates between at least two of the two or more heat exchangers and at least two of the two or more electrical semiconductor components;
wherein at least two of the two or more heat exchangers are on a same side of at least one of the one or more distributor plates and are situated at intervals next to each other, and
wherein the at least one of the one or more distributor plates is flexible in one direction and is inflexible in another direction.
2. A temperature controller according to claim 1 , wherein the at least two of the two or more heat exchangers situated at intervals next to each other have mobility relative to each other and exert no forces on each other.
3. A temperature controller according to claim 1 , wherein the two or more heat exchangers are located on the cold side of the electrothermal converter.
4. A temperature controller according to claim 3 , wherein at least one of the at least one bridge elements is connected with at least one of the one or more distributor plates.
5. A temperature controller according to claim 4 , wherein the at least one of the at least one bridge elements is connected to the at least one of the one or more distributor plates on the warm side; and
wherein there are no bridge elements located on the cold side.
6. A temperature controller according to claim 2 , wherein at least one of the one or more distributor plates insulates at least two of the two or more electrical semiconductor components from at least two of the two or more heat exchangers.
7. A temperature controller according to claim 6 , wherein at least one of the one or more distributor plates is located on the cold side of the electrothermal converter and is in contact with and bridges at least two of the two or more electrical semiconductor components.
8. A temperature controller according to claim 1 , wherein the at least two of the two or more electrical semiconductor components are glued pointwise or over a full surface with at least one of the at least one bridge elements.
9. A temperature controller comprising:
A) two or more heat exchangers;
B) an electrothermal converter with a cold side and a warm side, the electrothermal converter having:
(i) one or more pairs of electrical semiconductor components at least partially joined to and connected by at least one bridge element;
(ii) one or more distributor plates between at least one of the two or more heat exchangers and at least one pair of the one or more pairs of electrical semiconductor components;
wherein at least one of the one or more distributor plates is flexible in one direction and is inflexible in another direction; and
wherein at least two of the two or more heat exchangers are on a same surface of at least one of the one or more distributor plates and situated at intervals next to each other so that the at least two of the two or more heat exchangers have relative mobility relative to each other and exert no forces on each other.
10. A temperature controller according to claim 9 , wherein the at least two of the two or more heat exchangers on the same surface of the at least one of the one or more distributor plates have a corrugated-sheet structure, a rib structure, u-shape profile bends, or a combination thereof.
11. A temperature controller according to claim 10 , wherein at least one of the at least one bridge elements is connected with at least one of the one or more distributor plates.
12. A temperature controller according to claim 11 , wherein the two or more heat exchangers are located only on the cold side of the electrothermal converter.
13. A temperature controller according to claim 12 , wherein at least one of the one or more distributor plates is a cold side distributor plate located between the two or more heat exchangers and at least one of the one or more pairs of electrical semiconductor components.
14. A temperature controller according to claim 13 , wherein the cold side distributor plate insulates and bridges at least one pair of the one or more pairs of electrical semiconductor components from the two or more heat exchangers.
15. A temperature controller according to claim 14 , wherein at least one of the one or more distributor plates is a warm side distributor plate located opposite of the cold side distributor plate.
16. A temperature controller according to claim 15 , wherein the at least one of the at least one bridge elements is attached to the warm side distributor plate.
17. A temperature controller according to claim 16 , wherein at least one of the at least one bridge element is connected to at least one pair of the one or more pairs of electrical semiconductor components by a bonding zone which is elastic and/or capable of creep.
18. A temperature controller according to claim 9 , wherein at least one of the one or more distributor plates is a cold side distributor plate and at least one of the one or more distributor plates is a warm side distributor plate; and
wherein the warm side distributor plate is more elastic than the cold side distributor plate.
19. A temperature controller comprising:
A) two or more cold side heat exchangers having a corrugated-sheet structure, ribs, u-shape profile bends, or a combination thereof;
B) an electrothermal converter with a cold side and a warm side, the electrothermal converter having:
(i) one or more pairs of electrical semiconductor components;
(ii) at least one cold side distributor plate between at least one of the two or more cold side heat exchangers and the one or more pairs of electrical semiconductor components;
(iii) at least one warm side distributor plate; and
(iv) at least one bridge element between the one or more pairs of electrical semiconductor components and the warm side distributor plate;
wherein at least two of the two or more cold side heat exchangers are situated at intervals next to each other so that the at least two of the two or more cold side heat exchangers have relative mobility relative to each other and exert no forces on each other; and
wherein at least one of either the warm side distributor plate or the cold side distributor plate is flexible in one direction and is inflexible in another direction.