Multiple bond via arrays of different wire heights on a same substrate

1. An apparatus, comprising:

a substrate;

first wire bond wires (“first wires”) in a first region, the first wires extending from a surface of the substrate;

second wire bond wires (“second wires”) in a second region, the second wires extending from the surface of the substrate;

wherein the first wires and the second wires are external to the substrate;

wherein the first region is disposed at least partially within the second region;

wherein the first wires are of a first height; and

wherein the second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires.

2. The apparatus according to claim 1 , wherein:

the at least one electronic component includes a discrete passive component;

the discrete passive component is coupled to first ends of the first wires;

a die is coupled to second ends of the second wires; and

the die is disposed over the discrete passive component.

3. The apparatus according to claim 2 , wherein the discrete passive component and the die are mechanically and electrically coupled to one another.

4. The apparatus according to claim 2 , wherein the discrete passive component is coupled to an interposer disposed at least partially within the second region.

5. The apparatus according to claim 2 , wherein the discrete passive component is coupled to a redistribution layer disposed at least partially within the second region.

6. The apparatus according to claim 1 , wherein:

the at least one electronic component includes a discrete electromechanical component;

the discrete electromechanical component is coupled to first ends of the first wires;

a die is coupled to second ends of the second wires; and

the die is disposed over the discrete electromechanical component.

7. An apparatus, comprising:

a substrate;

first wire bond wires (“first wires”) in a first region, the first wires extending from a surface of the substrate;

second wire bond wires (“second wires”) in a second region, the second wires extending from the surface of the substrate;

wherein the first wires and the second wires are external to the substrate;

wherein the first region is disposed at least partially within the second region;

wherein the first wires are of a first height;

wherein the second wires are of a second height greater than the first height for coupling of:

at least one electronic component to the second wires disposed above the first wires; and

at least one die to the first wires at least partially disposed within the second region.

8. The apparatus according to claim 7 , wherein:

the at least one electronic component is a discrete passive component;

the discrete passive component is coupled to first ends of the second wires;

the die is coupled to second ends of the first wires; and

the die is disposed below the discrete passive component.

9. The apparatus according to claim 8 , wherein the discrete passive component and the die are mechanically and electrically coupled to one another.

10. The apparatus according to claim 8 , wherein the discrete passive component is coupled to an interposer, the interposer being coupled to the second wires and disposed over the first wires.

11. The apparatus according to claim 8 , wherein the discrete passive component is coupled to a redistribution layer, the redistribution layer being coupled to the second wires and disposed over the first wires.

12. The apparatus according to claim 7 , wherein:

the at least one electronic component is a discrete electromechanical component;

the discrete electromechanical component is coupled to first ends of the second wires;

the die is coupled to second ends of the first wires; and

the die is disposed below the discrete electromechanical component.

13. An apparatus, comprising:

a substrate;

first wire bond wires (“first wires”) in a first region, the first wires extending away from a surface of the substrate;

second wire bond wires (“second wires”) in a second region, the second wires extending away from the surface of the substrate;

wherein the first wires and the second wires are external to the substrate;

wherein the first wires are of a first height; and

wherein the second wires are of a second height greater than the first height.

14. The apparatus according to claim 13 , wherein:

one active or passive first electronic component is coupled to first ends of the second wires; and

one active or passive second electronic component is coupled to second ends of the first wires.

15. The apparatus according to claim 13 , wherein at least one set of the first wires or the second wires are unevenly spaced apart from one another.

16. The apparatus according to claim 13 , wherein at least one set of the first wires or the second wires have different cross-sectional dimensions from one another.

17. An apparatus, comprising:

a first die and a second die;

first wire bond wires of a first height extending from a surface of the first die;

second wire bond wires of a second height greater than the first height extending from a surface of the second die;

the first wire bond wires and the second wire bond wires external to the first die and the second die, respectively; and

the first wire bond wires disposed at least partially within a first region defined by the second wire bond wires for a package-on-package configuration.

18. The apparatus according to claim 17 , further comprising:

a redistribution layer;

third wire bond wires of a third height greater than the second height external to the redistribution layer, the third wire bond wires extending from a surface of the redistribution layer; and

the first wire bond wires and the second wire bond wires disposed at least partially within a second region defined by the third wire bond wires for the package-on-package configuration.

19. The apparatus according to claim 17 , wherein the second die is a passive device.

20. The apparatus according to claim 19 , wherein the passive device includes a redistribution layer.