Laser processing apparatus
A laser processing apparatus is provided wherein a laser beam of a wavelength which passes through a wafer having a surface on which a plurality of devices are disposed is irradiated along a schedule division line to separate the adjacent devices from each other to form a modification layer which continuously extends in a given length in the inside of the wafer. A mark portion is displayed in an overlapping relationship with a picked up image obtained by image pickup of a wafer on a display unit. If the mark portion is moved to a desired position of the picked up image displayed on the display unit, then coordinates which correspond to the desired position of the picked up image are stored as a start point or an end portion of a scheduled division line, along which the modification layer is to be formed, into a storage unit.
1. A laser processing apparatus wherein a laser beam of a wavelength which passes through a wafer having a surface on which a plurality of devices are disposed is irradiated along a schedule division line to separate the adjacent devices from each other to form a modification layer which continuously extends in a given length in the inside of the wafer, comprising:
a chuck table configured to hold a wafer thereon;
laser beam irradiation means for irradiating the laser beam on the wafer held on the chuck table;
moving means for moving the chuck table and the laser beam irradiation means relative to each other in a processing feeding direction and an indexing feeding direction;
display means for displaying a picked up image obtained by image pickup of the wafer held on the chuck table;
inputting means for inputting a processing condition for processing of the wafer; and
a storage device that stores the processing condition inputted by the inputting means;
a mark portion being displayed in an overlapping relationship with the picked up image on the display means;
coordinates which correspond to a desired position of the picked up image displayed on the display means when the mark portion is moved to the desired position of the picked up image being stored as a start point or an end portion of a scheduled division line, along which the modification layer is to be formed, into the storage device.