IP Library Granted Patent US 9,583,314
Granted Patent B2
US 9,583,314 · App. 14/846,739 · Granted Feb 28, 2017

Plasma processing apparatus

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,583,314
App. No.
14/846,739
Granted
Feb 28, 2017
Kind
B2
Abstract

Provided is a plasma processing apparatus including: a circular waveguide connected with a vacuum vessel, and through which a circularly polarized wave of an electric field for plasma formation propagates; a processing chamber which is arranged below the circular waveguide, and in which plasma is formed; a circularly polarized wave generator, which is arranged in the waveguide; a circularly polarized wave adjuster which is connected with the circular waveguide below the circularly polarized wave generator; a circularly polarized wave detector which is below the circularly polarized wave adjuster; and a controller which adjusts an operation of the circularly polarized wave adjuster according to an output from the circularly polarized wave detector, in which the circularly polarized wave adjuster adjusts a length of a protrusion of a dielectric stub into the circular waveguide based on a signal from the controller.

Claims (31)

1. A plasma processing apparatus comprising:

a waveguide which is connected with a vacuum vessel, and through which an electric field for plasma generation propagates;

a generator of the electric field which is connected to the waveguide;

a circular waveguide which configures the waveguide and is arranged between the generator of the electric field and the vacuum vessel, which has a circular cross-section, and through which a circularly polarized wave of the electric field propagates;

a processing chamber which is arranged in the vacuum vessel below the circular waveguide, and inside of which the electric field is supplied and the plasma is generated;

a circularly polarized wave generator which is arranged in the waveguide;

a circularly polarized wave corrector which is arranged to be connected to the circular waveguide below the circularly polarized wave generator, and which is configured to adjust distribution of the circularly polarized wave in the circular waveguide;

a circularly polarized wave detector which is configured to detect the distribution of the circularly polarized wave in the circular waveguide below the circularly polarized wave corrector, wherein the circularly polarized wave corrector comprises a plurality of the dielectric stubs inserted in a direction perpendicular to an axis of the circular waveguide; and

a controller which is configured to adjust an operation of the circularly polarized wave corrector according to an output from the circularly polarized wave detector, and based on a signal from which the circularly polarized wave corrector is configured to adjust a length of each of said dielectric stubs to protrude into the circular waveguide.

2. The plasma processing apparatus according to claim 1 , further comprising:

a matching unit which is arranged between the circularly polarized wave corrector on the waveguide and the generator of the electric field.

3. The plasma processing apparatus according to claim 2 ,

wherein the waveguide comprises a horizontal waveguide which is arranged above the circular waveguide, at a first end portion in an axial direction extending in a horizontal direction of which the generator of the electric field is connected, and at a second end portion of which the circular waveguide is connected, and

wherein the circularly polarized wave generator is located below a connection portion of the horizontal waveguide and the circular waveguide, and between the connection portion and the circularly polarized wave corrector.

4. The plasma processing apparatus according to claim 1 ,

wherein the waveguide comprises a horizontal waveguide which is arranged above the circular waveguide, at a first end portion in an axial direction extending in a horizontal direction of which the generator of the electric field is connected, and at a second end portion of which the circular waveguide is connected, and

wherein the circularly polarized wave generator is located below a connection portion of the horizontal waveguide and the circular waveguide, and between the connection portion and the circularly polarized wave corrector.

5. A plasma processing apparatus comprising:

a waveguide which is connected with a vacuum vessel, and through which an electric field for plasma generation propagates;

a generator of the electric field which is connected to the waveguide;

a circular waveguide which configures the waveguide and is arranged between the generator of the electric field and the vacuum vessel, which has a circular cross-section, and through which a circularly polarized wave of the electric field propagates;

a processing chamber which is arranged in the vacuum vessel below the circular waveguide, and inside of which the electric field is supplied and the plasma is generated;

a circularly polarized wave generator which is arranged in the waveguide;

a circularly polarized wave corrector which is arranged to be connected to the circular waveguide below the circularly polarized wave generator, and which is configured to adjust distribution of the circularly polarized wave in the circular waveguide;

a circularly polarized wave detector which is configured to detect the distribution of the circularly polarized wave in the circular waveguide below the circularly polarized wave corrector,

wherein the circularly polarized wave generator is located below a connection portion of the horizontal waveguide and the circular waveguide, and between the connection portion and the circularly polarized wave corrector; and

a controller which adjusts an operation of the circularly polarized wave corrector according to an output from the circularly polarized wave detector, and based on a signal from which the circularly polarized wave corrector is configured to adjust a length of each of a plurality of dielectric stubs to protrude into the circular waveguide.

6. The plasma processing apparatus according to claim 5 , further comprising:

a matching unit which is arranged between the circularly polarized wave corrector on the circular waveguide and the generator of the electric field.

7. The plasma processing apparatus according to claim 6 , wherein the circularly polarized wave corrector comprises a plurality of the dielectric stubs inserted in a direction perpendicular to an axis of the circular waveguide.

8. The plasma processing apparatus according to claim 5 , wherein the circularly polarized wave corrector comprises a plurality of the dielectric stubs inserted in a direction perpendicular to an axis of the circular waveguide.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →