IP Library Granted Patent US 10,010,997
Granted Patent B2
US 10,010,997 · App. 14/847,535 · Granted Jul 3, 2018

Abrasive cloth and polishing method

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Quick Facts
Patent No.
US 10,010,997
App. No.
14/847,535
Granted
Jul 3, 2018
Kind
B2
Abstract

In accordance with an embodiment, a polishing method includes supplying slurry to a surface of a polishing layer including a polymer, and bringing a polishing object into contact with the polishing layer to polish the polishing object. The polishing layer has a fibrous first substance mixed therein or contains a second substance. The second substance is higher in specific heat and higher in thermal conductivity than the polymer in such a manner that the second substance is surrounded by the polymer.

Claims (39)

1. An abrasive cloth comprising:

a polishing layer comprising a polymer in which a fibrous substance is mixed,

wherein the thermal diffusivity of the polishing layer is 0.05 mm 2 /s or less.

2. The abrasive cloth of claim 1 ,

wherein the thermal conductivity of the fibrous substance is 0.15 J/(m·s·K) or more.

3. The abrasive cloth of claim 1 ,

wherein the fibrous substance is a wood fiber.

4. The abrasive cloth of claim 1 ,

wherein the polymer comprises at least one of polyurethane, polyurea, polyethylene, polypropylene, polyester, polyamide, polyvinyl chloride, an epoxy resin, an ABS resin, an AS resin, butadiene rubber, styrene butadiene rubber, ethylene propylene rubber, silicone rubber, and fluoro rubber.

5. An abrasive cloth comprising:

a polishing layer comprising a polymer,

wherein a substance which is higher in specific heat and higher in thermal conductivity than the polymer is contained so as to be surrounded by the polymer, and

the thermal diffusivity of the polishing layer is 0.05 mm 2 /s or less.

6. The abrasive cloth of claim 5 ,

wherein the polymer comprises at least one of polyurethane, polyurea, polyethylene, polypropylene, polyester, polyamide, polyvinyl chloride, an epoxy resin, an ABS resin, an AS resin, butadiene rubber, styrene butadiene rubber, ethylene propylene rubber, silicone rubber, and fluoro rubber.

7. The abrasive cloth of claim 5 ,

wherein the polymer comprises polyurethane, and

the specific heat of the substance is 1900 J/(kg·K) or more, and the thermal conductivity of the substance is 0.15 J/(m·s·K) or more.

8. The abrasive cloth of claim 7 ,

wherein the substance is water (H 2 O).

9. A polishing method comprising:

supplying slurry to a surface of a polishing layer comprising a polymer, and bringing a polishing object into contact with the polishing layer to polish the polishing object,

wherein the polishing layer comprises a fibrous first substance mixed therein or contains a second substance which is higher in specific heat and higher in thermal conductivity than the polymer in such a manner that the second substance is surrounded by the polymer, wherein the thermal diffusivity of the polishing layer is 0.05 mm 2 /s or less, and

the polishing object is polished while the surface of the polishing layer is cooled by a cooling part.

10. The method of claim 9 ,

wherein the thermal conductivity of the fibrous substance is 0.15 J/(m·s·K) or more.

11. The method of claim 9 ,

wherein the fibrous first substance is a wood fiber.

12. The method of claim 9 ,

wherein the polymer comprises polyurethane, and

the specific heat of the second substance is 1900 J/(kg·K) or more, and the thermal conductivity of the second substance is 0.15 J/(m·s·K) or more.

13. The method of claim 9 ,

wherein the second substance is water (H 2 O).

14. The method of claim 9 ,

wherein the polymer comprises at least one of polyurethane, polyurea, polyethylene, polypropylene, polyester, polyamide, polyvinyl chloride, an epoxy resin, an ABS resin, an AS resin, butadiene rubber, styrene butadiene rubber, ethylene propylene rubber, silicone rubber, and fluoro rubber.

15. The method of claim 9 ,

wherein the cooling part includes a heat exchanger which contacts to the surface of the polishing layer.

16. The method of claim 9 ,

wherein the cooling part includes a non-contact mechanism which supplies a gas to the surface of the polishing layer.

Assignments (6)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE POSTAL CODE PREVIOUSLY RECORDED ON REEL 043027 FRAME 0072. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Sep 1, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043747/0273 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043027/0072 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2015
From: GAWASE, AKIFUMI; MATSUI, YUKITERU; KAWASAKI, TAKAHIKO; OTSUKA, YOSUKE; EDA, HAJIME
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 036807/0085 →