Systems and methods for sustainable self-cooling of central processing unit thermal hot spots using thermoelectric materials
View Patent ↗Embodiments of a sustainable self-cooling framework for processors using thermoelectric generators that power an arrangement of thermoelectric coolers to reduce the temperature of thermal hot spots generated by a processor are disclosed.
1. A sustainable self-cooling framework comprising:
a processor of a microelectronic circuit, wherein the processor produces localized areas of high temperature on a surface of the processor that generate waste heat; and
a sustainable self-cooling architecture for cooling one or more of the localized areas of high temperature of the processor, the sustainable self-cooling architecture comprising:
one or more thermoelectric generators located proximate a first portion of the surface of the processor,
one or more thermoelectric coolers located proximate a second portion of the surface of the processor,
wherein the waste heat is converted by the one or more thermoelectric generators to power, the power used to activate the one or more thermoelectric coolers such that each of the one or more thermoelectric coolers generates a cooling effect to the second portion of the surface of the processor, and
an intermediate circuit operatively connecting the or more thermoelectric generators to the one or more thermoelectric coolers to transfer the power generated from the one or more thermoelectric generators to the one or more thermoelectric coolers.
2. The sustainable self-cooling framework of claim 1 wherein the first portion of the surface of the processor coincides with a first set of functional units of the processor that operate at a lower temperature than a high temperature of the one or more of the localized areas of high temperature.
3. The sustainable self-cooling framework of claim 2 , wherein the second portion of the surface of the processor coincides with a second set of functional units of the processor that produce the high temperature of the one or more of the localized areas of high temperature.
4. The sustainable self-cooling framework of claim 3 , wherein the sustainable self-cooling architecture further comprises:
one or more heat sinks located proximate a third portion of the surface of the processor, wherein the third portion of the surface of the processor coincides with a third set of functional units of the processor.
5. The sustainable self-cooling framework of claim 4 , wherein each of the functional units of the processor is included in the first set of functional units, the second set of functional units, or the third set of functional units.
6. The sustainable self-cooling framework of claim 1 wherein the one or more thermoelectric generators comprise a plurality of thermoelectric generators and the intermediate circuit operatively connects a first subset of the plurality of thermoelectric generators in a first series arrangement and a second subset of the plurality of thermoelectric generators in a second series arrangement.
7. The sustainable self-cooling framework of claim 6 , wherein the intermediate circuit further connects the first subset of the plurality of thermoelectric generators and the second subset of the plurality of thermoelectric generators in a parallel arrangement.
8. The sustainable self-cooling framework of claim 1 , wherein a load characteristic of the one or more thermoelectric coolers is matched to a resistive value of the one or more thermoelectric generators.
9. The sustainable self-cooling framework of claim 1 , wherein the intermediate circuit further comprises a voltage regulator.
10. The sustainable self-cooling framework of claim 1 , wherein the sustainable self-cooling architecture further comprises:
a heat spreader interposed between the sustainable self-cooling architecture and the processor.
11. A method for cooling a processor, comprising:
utilizing one or more thermoelectric generators to generate power from waste heat associated with a first portion of a surface of a processor that produces localized areas of high temperature along the processor;
providing the power to one or more thermoelectric coolers located proximate to a second portion of the surface of the processor using an intermediate circuit electrically connecting the one or more thermoelectric generators to the one or more thermoelectric coolers; and
cooling the second portion of the surface of the processor with the one or more thermoelectric coolers located proximate the second portion of the surface of the processor, the one or more thermoelectric coolers generating a cooling effect to the second portion of the surface of the processor.
12. The method of claim 11 , wherein the one or more thermoelectric generators are located proximate to the first portion of the surface of the processor and wherein the first portion of the surface of the processor coincides with a first set of functional units of the processor that operate at a lower temperature than a high temperature of the localized areas of high temperature.
13. The method of claim 12 , wherein the second portion of the surface of the processor coincides with a second set of functional units of the processor that produce the high temperature of the localized areas of high temperature.
14. The method of claim 11 , wherein the one or more thermoelectric generators comprise a plurality of thermoelectric generators and the intermediate circuit operatively connects a first subset of the plurality of thermoelectric generators in a first series arrangement and a second subset of the plurality of thermoelectric generators in a second series arrangement.
15. The method of claim 14 , wherein the intermediate circuit further connects the first subset of the plurality of thermoelectric generators and the second subset of the plurality of thermoelectric generators in a parallel arrangement.
16. The method of claim 11 , further comprising:
matching a load characteristic of the one or more thermoelectric coolers to a resistive value of the one or more thermoelectric generators.
17. A processor comprising:
a surface defining a first portion and a second portion of the surface, the processor producing localized areas of high temperature along the first portion of the surface of the processor that generate waste heat; and
a sustainable self-cooling architecture for cooling one or more localized areas of high temperature of the surface, the sustainable self-cooling architecture comprising:
one or more thermoelectric generators located proximate the first portion of the surface and configured to generate power from the waste heat;
one or more thermoelectric coolers located proximate the second portion of the surface and configured to access the power generated from the one or more thermoelectric generators to produce a cooling effect to the second portion of the surface of the processor; and
an intermediate circuit operatively connecting the one or more thermoelectric generators to the one or more thermoelectric coolers.
18. The central processing unit of claim 17 , wherein the one or more thermoelectric generators comprise a plurality of thermoelectric generators and the intermediate circuit operatively connects a first subset of the plurality of thermoelectric generators in series and a second subset of the plurality of thermoelectric generators in a series arrangement.
19. The central processing unit of claim 18 wherein the intermediate circuit further connects the first subset of the plurality of thermoelectric generators and the second subset of the plurality of thermoelectric generators in a parallel arrangement.
20. The central processing unit of claim 17 wherein a load characteristic of the one or more thermoelectric coolers is matched to a resistive value of the one or more thermoelectric generators.