Antenna device and manufacturing method thereof
An example antenna device may includes a base member, an antenna that is attached to the base member, and a cover member that is attached to surround at least a part of the base member and at least a part of the antenna. A first part of the base member that is attached to the cover member has a melting temperature equal to or lower than that of the cover member. A second part of the base member to which the antenna is attached has a higher melting temperature than the cover member.
1. An antenna device comprising:
a base member;
an antenna that is attached to the base member; and
a cover member that is attached to surround at least a part of the base member and at least a part of the antenna,
wherein a first part of the base member that is attached to the cover member has a melting temperature equal to or lower than that of the cover member, and
a second part of the base member to which the antenna is attached has a higher melting temperature than the cover member.
2. The antenna device of claim 1 , wherein the second part is molded to be coupled to the first part after the first part is molded.
3. The antenna device of claim 1 , wherein the first and second parts are molded using double injection molding.
4. The antenna device of claim 1 , wherein the cover member is molded to be attached to the antenna and the base member, which are integrated with each other, using insert molding.
5. The antenna device of claim 1 , wherein the cover member comprises at least a part of a housing that forms an external appearance of an electronic device.
6. A method of manufacturing an antenna device, comprising:
molding a base member;
attaching an antenna to the base member; and
molding a cover member that is attached to surround at least a part of the base member and at least a part of the antenna,
wherein a first part of the base member that is attached to the cover member has a melting temperature equal to or lower than that of the cover member, and
a second part of the base member to which the antenna is attached has a higher melting temperature than the cover member.
7. The method of claim 6 , wherein the second part which is coupled to the first part is molded after the first part is molded.
8. The method of claim 6 , wherein the base member is molded using double injection molding.
9. The method of claim 6 , wherein the antenna is attached to the second part using one of laser direct structuring (LDS), stenciling, printing, and attaching.
10. The method of claim 6 , wherein the cover member is molded to be attached to the antenna and the base member, which are integrated with each other, using insert molding.