Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers
Integrated circuits (ICs 110 ) are attached to a wafer ( 120 W). A stabilization layer ( 404 ) is formed over the wafer to strengthen the structure for further processing. Unlike a conventional mold compound, the stabilization layer is separated from at least some wafer areas around the ICs by one or more gap regions ( 450 ) to reduce the thermo-mechanical stress on the wafer and hence the wafer warpage. Alternatively or in addition, the stabilization layer can be a porous material having a low horizontal elastic modulus to reduce the wafer warpage, but having a high flexural modulus to reduce warpage and otherwise strengthen the structure for further processing. Other features and advantages are also provided.
1. A fabrication process comprising:
(1) obtaining an assembly comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and then
(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and comprising an organic polymeric layer strengthening the assembly, the organic polymeric layer overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the organic polymeric layer being separated from the one or more areas by one or more gap regions underlying the first layer;
wherein forming the first layer comprises:
laminating a film comprising organic material over the first structure, the film being separated from the one or more areas and covering a top of each first module;
curing the film to form the organic polymeric layer; and
before or after completion of said curing, thinning the film to expose the top of at least one first module.
2. The fabrication process of claim 1 wherein the one or more gap regions form a continuous gap region surrounding each first module.
3. The fabrication process of claim 1 wherein the one or more first modules are a plurality of first modules.
4. The fabrication process of claim 3 wherein each first module has a sidewall surface exposed in the one or more gap regions.
5. The fabrication process of claim 1 wherein each first module comprises a semiconductor integrated circuit.
6. A fabrication process comprising:
(1) obtaining an assembly comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; then
(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;
wherein the first layer adheres to a sidewall of at least one first module but does not cover the entire sidewall of the at least one first module; and
wherein forming the first layer comprises:
forming the first layer to cover a top of at least one first module; and then
thinning the first layer to expose the top of said at least one first module.
7. A fabrication process comprising:
(1) obtaining an assembly comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and then
(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;
wherein at least one first module has a sidewall having a first part exposed in the one or more gap regions and having a second part overlying the first part, the second part adhering to the first layer; and
wherein forming the first layer comprises:
forming the first layer to cover a top of at least one first module; and then
thinning the first layer to expose the top of said at least one first module.
8. A fabrication process comprising:
(1) obtaining an assembly comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and then
(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;
removing a bottom portion of the first structure while the first layer adheres to one or more first modules.
9. A fabrication process comprising:
(1) obtaining an assembly comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and then
(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and comprising an organic polymeric layer strengthening the assembly, the organic polymeric layer overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the organic polymeric layer being separated from the one or more areas by one or more gap regions underlying the first layer;
wherein forming the first layer comprises:
laminating a film comprising organic material over the first structure, the film being separated from the one or more areas; and
after laminating the film, curing the film to form the organic polymeric layer;
(3) after forming the first layer, dicing the first structure and the first layer to form a plurality of pieces each of which comprises at least one first module, a diced portion of the first structure, and a diced portion of the first layer.
10. The fabrication process of claim 9 further comprising attaching at least one said piece to a wiring substrate.
11. A structure comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and
a first layer over the first structure, the first layer being an organic polymeric layer strengthening the structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;
wherein the first layer does not cover a top of at least one first module.
12. The structure of claim 11 wherein the one or more gap regions form a continuous gap region surrounding each first module.
13. The structure of claim 11 wherein the one or more first modules are a plurality of first modules.
14. The structure of claim 13 wherein each first module has a sidewall surface exposed in the one or more gap regions.
15. The structure of claim 11 wherein each first module comprises a semiconductor integrated circuit.
16. A structure comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and
a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;
wherein the first layer adheres to a sidewall of at least one first module but does not cover the entire sidewall of the at least one first module;
wherein the first layer does not cover a top of at least one first module.
17. A structure comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and
a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;
wherein at least one first module has a sidewall having a first part exposed in the one or more gap regions and having a second part overlying the first part, the second part adhering to the first layer;
wherein the first layer has a polished top surface and does not cover a top of at least one first module.
18. A fabrication process comprising:
(1) obtaining an assembly comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more first modules are attached to the top side of the first structure, wherein the one or more contact pads of the one or more first modules being attached to the one or more contact pads of the first structure; and then
(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules, the first layer being porous and extending substantially along a first plane, the first layer having a lower elastic modulus along the first plane than a flexural modulus in a direction perpendicular to the first plane;
wherein the first layer consists essentially of a polyimide aerogel.
19. A structure comprising:
one or more first modules each of which comprises circuitry comprising one or more contact pads;
a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
wherein the one or more first modules are attached to the top side of the first structure, the one or more contact pads of the one or more first modules being attached to the one or more contact pads of the first structure; and
a first layer over the first structure, the first layer adhering to the one or more first modules, the first layer being porous and extending substantially along a first plane, the first layer having a lower elastic modulus along the first plane than a flexural modulus in a direction perpendicular to the first plane;
wherein the first layer consists essentially of a polyimide aerogel.