Integrated temperature sensor in microphone package
Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
1. A device, comprising:
a microphone sensor coupled to a first side of a substrate;
an acoustic port in the substrate that exposes a portion of the microphone sensor; and
a temperature sensor mounted on a second side of the substrate that overlays a portion of the port.
2. The device of claim 1 , wherein the substrate is a laminate lid over the microphone sensor.
3. The device of claim 2 , wherein the temperature sensor extends over the acoustic port in the laminate lid.
4. The device of claim 1 , wherein the temperature sensor is a resistance thermometer.
5. The device of claim 1 , wherein the temperature sensor is a thermocouple.
6. The device of claim 1 , wherein the microphone sensor is a microelectromechanical systems sensor.
7. The device of claim 1 , wherein the temperature sensor is integrated onto an application specific integrated circuit that is embedded into the substrate.
8. The device of claim 7 , wherein a portion of the application specific integrated circuit comprising the temperature sensor extends into the acoustic port.
9. The device of claim 1 , wherein the temperature sensor is integrated onto an application specific integrated circuit, wherein the application specific integrated circuit is disposed between the substrate and the microphone sensor.
10. The device of claim 9 , wherein the microphone sensor and the application specific integrated circuit sensor form an integrated die.
11. The device of claim 10 , wherein a connection between the integrated die and the substrate is a flip chip connection.
12. The device of claim 1 , wherein a width of the temperature sensor is between 75 and 100 microns.
13. A device, comprising:
a microphone sensor coupled to a substrate;
an acoustic port in the substrate that exposes a portion of the microphone sensor;
an application specific integrated circuit that is embedded into the substrate and wherein a portion of the application specific integrated circuit extends into the acoustic port; and
a temperature sensor that is integrated into a portion of the application specific integrated circuit that extends into the acoustic port.
14. The device of claim 13 , wherein the temperature sensor is a resistance thermometer.
15. The device of claim 13 , wherein the temperature sensor is a thermocouple.
16. The device of claim 13 , wherein the microphone sensor is a microelectromechanical systems sensor.
17. The device of claim 13 , wherein the application specific integrated circuit is less thermally conductive than the substrate.
18. A device, comprising:
a microphone sensor mounted to a first side of the application specific integrated circuit, wherein the application specific integrated circuit has an aperture that exposes a portion of the microphone sensor;
a substrate that is coupled to a second side of the application specific integrated circuit, that has an acoustic port formed that exposes the aperture; and
a temperature sensor that is integrated into the application specific integrated circuit, wherein the temperature sensor overlays a portion of the acoustic port.
19. The device of claim 18 , wherein the microphone sensor and the application specific integrated circuit sensor form an integrated die.
20. The device of claim 19 , wherein a connection between the integrated die and the substrate is a flip chip connection.
21. The device of claim 18 , wherein the application specific integrated circuit is less thermally conductive than the substrate.