Manufacturing method of printing circuit board with micro-radiators
A method of manufacturing a printed circuit board includes providing a substrate having at least one resin plate and a semi-cured sheet. A through hole is formed in the substrate to accommodate a radiator having an electrically conductive layer and an electrically insulated layer. The substrate and radiator are heat pressed to fully cure the epoxy and couple the substrate and radiator together. The excess resin is removed and electrically conductive layers are plated on the board. Surface circuits and a heat dissipating pattern are then etched into the conductive layer. An LED is attached to the printed circuit board. In some embodiments, a flexible segment is formed by removing a portion of the substrate. The radiator can have an electrically insulated layer extending at least partially across a surface of an electrically insulated and thermally conductive core.
1. An object comprising a printed circuit board having a top surface and a bottom surface, the printed circuit board comprising:
a radiator having an electrically insulated core and first electrically conductive layers formed on the top and bottom surfaces of the electrically insulated core;
a substrate having second electrically conductive layers formed on the top and bottom surfaces thereof, the second electrically conductive layer being separated from the first electrically conductive layer, wherein the first electrically conductive layer formed on the top surface of the electrically insulated core includes at least two portions separated from one another, and wherein the second electrically conductive layer formed on the top surface of the substrate includes at least two portions separated from one another;
a plurality of electrode bonding pads on the top surface of the printed circuit board; wherein the electrode bonding pads comprises:
one third electrically conductive layer directly contacting a surface of one portion of the second electrically conductive layer on the top surface of the substrate and extending from the contacted surface of the one portion of the second electrically conductive layer to a surface of one portion of the first electrically conductive layer on the top surface of the electrically insulated core; and
another separate third electrically conductive layer directly contacting a surface of another portion of the second electrically conductive layer on the top surface of the substrate and extending from the contacted surface of the other portion of the second electrically conductive layer to a surface of another portion of the first electrically conductive layer on the top surface of the electrically insulated core; and
a fourth electrically conductive layer on the bottom surface of the printed circuit board, wherein the fourth electrically conductive layer extends from a surface of the second electrically conductive layer on the bottom surface of the substrate to a surface of the first electrically conductive layer on the bottom surface of the electrically insulated core.
2. The object of claim 1 , further comprising:
a second printed circuit board having a top surface and a bottom surface, a radiator, a substrate, a plurality of electrode bonding pads on the top surface, a plurality of terminals on the bottom surface each electrically connected to at least one of the plurality of electrode bonding pads, and a heat dissipater on the bottom surface coupled to the radiator and the substrate; and
a flexible member between the top and bottom surfaces of each of the printed circuit boards, the flexible member linking the printed circuit boards.
3. The object of claim 2 , wherein the printed circuit boards are separated from each other by a distance and linked by the flexible member.
4. The object of claim 1 , wherein the substrate comprises a semi-cured sheet between a plurality of resin plates.
5. The object of claim 1 , further comprising an LED coupled to the plurality of electrode bonding pads.
6. The object of claim 1 , comprising a plurality of terminals on the bottom surface, each electrically connected to at least one of the plurality of electrode bonding pads.
7. The object of claim 1 , comprising a heat dissipater on the bottom surface coupled to the radiator and the substrate.
8. A method of manufacturing a printed circuit board comprising:
forming first electrically conductive layers on the top and bottom surfaces of an electrically insulated core;
cutting the electrically insulated core, thereby creating a radiator;
providing a substrate having a through hole and second electrically conductive layers formed on the top and bottom surfaces thereof;
inserting the radiator into the through hole;
heat pressing the radiator and substrate;
forming a plurality of third electrically conductive layers on the top surface of the printed circuit board and a fourth electrically conductive layer on the bottom surface of the printed circuit board, wherein the plurality of third electrically conductive layers comprises:
one third electrically conductive layer directly contacting a surface of one portion of the second electrically conductive layer on the top surface of the substrate and extending from the contacted surface of the one portion of the second electrically conductive layer to a surface of one portion of the first electrically conductive layer on the top surface of the electrically insulated core, and
another separate third electrically conductive layer directly contacting a surface of another portion of the second electrically conductive layer on the top surface of the substrate and extending from the contacted surface of the other portion of the second electrically conductive layer to a surface of another portion of the first electrically conductive layer on the top surface of the electrically insulated core; and
wherein the fourth electrically conductive layer extends from a surface of the second electrically conductive layer on the bottom surface of the substrate to a surface of the first electrically conductive layer on the bottom surface of the electrically insulated core; and
creating a plurality of electrode bonding pads on the top surface of the printed circuit board.
9. The method of claim 8 , wherein etching a region of the first electrically conductive layer and exposing the electrically insulated core before cutting the electrically insulated core along the etched portion, and a portion of the surface of the electrically insulated core remains exposed after cutting the core.
10. The method of claim 8 , further comprising creating a heat conducting bonding pad on the top surface of the printed circuit board.
11. The method of claim 8 , further comprising coupling an LED to the plurality of electrode bonding pads.
12. The method of claim 8 , further comprising creating a plurality of terminals on the bottom surface of the printed circuit board.
13. The method of claim 8 , further comprising forming a heat dissipating pattern on the bottom surface of the printed circuit board.
14. The method of claim 8 , wherein the substrate comprises a semi-cured sheet and a resin plate having a fifth conductive layer, the fifth conductive layer having a circuit pattern and providing the substrate comprises:
coupling the fifth conductive layer to the semi-cured sheet such that the circuit pattern is internally contained within the substrate.