Method of manufacturing semiconductor device
An insulating film including characteristics such as low permittivity, a low etching rate and a high insulation property is formed. Supplying a gas containing an element, a carbon-containing gas and a nitrogen-containing gas to a heated substrate in a processing vessel to form a carbonitride layer including the element, and supplying the gas containing the element and an oxygen-containing gas to the heated substrate in the processing vessel to form an oxide layer including the element are alternately repeated to form on the substrate an oxycarbonitride film having the carbonitride layer and the oxide layer alternately stacked therein.
1. A method of manufacturing a semiconductor device, comprising:
(a) forming a carbonitride layer including an element and having a thickness of several atomic layers by performing a first set of steps a predetermined number of times, the first set of steps including:
(a-1) supplying a gas containing the element to a substrate to form an element-containing layer including the element;
(a-2) supplying a carbon-containing gas to the substrate to form a carbon-containing layer on the element-containing layer to form a layer including the element and carbon, and
(a-3) supplying a nitrogen-containing gas to the substrate to nitride the layer including the element and carbon;
(b) forming a boron nitride layer having a thickness of less than one atomic layer by performing a second set of steps a predetermined number of times, the second set of steps including:
(b-1) supplying a boron-containing gas to the substrate to form a boron-containing layer; and
(b-2) supplying a nitrogen-containing gas to the substrate to nitride the boron-containing layer a predetermined number of times to form a boron nitride layer; and
(c) alternately repeating (a) and (b) to form on the substrate a boron carbonitride film having the carbonitride layer and the boron nitride layer alternately stacked therein.
2. The method according to claim 1 , wherein the element-containing layer comprises at least one layer selected from a group consisting of a continuous deposition layer of the element, a discontinuous deposition layer of the element, a continuous chemisorption layer of the gas containing the element, and a discontinuous chemisorption layer of the gas containing the element.
3. The method according to claim 1 , wherein the carbon-containing layer comprises a discontinuous chemisorption layer of the carbon-containing gas.
4. The method according to claim 1 , wherein the carbon-containing layer comprises a chemisorption layer of the carbon-containing gas, an adsorption state of the chemisorption layer being unsaturated state.
5. The method according to claim 1 , wherein the boron-containing layer comprises a discontinuous chemisorption layer of the boron-containing gas.
6. The method according to claim 1 , wherein the boron-containing layer comprises a chemisorption layer of the boron-containing gas, an adsorption state of the chemisorption layer being unsaturated state.
7. The method according to claim 1 , wherein (a-3) comprises thermally nitriding the layer including the element and carbon under a condition where a nitridation reaction by the nitrogen-containing gas in the layer including the element and carbon is unsaturated.
8. The method according to claim 1 , wherein (b-2) comprises thermally nitriding the boron-containing layer under a condition where a nitridation reaction by the nitrogen-containing gas in the boron-containing layer is unsaturated.
9. The method according to claim 1 , wherein the element-containing layer comprises supplying the gas containing the element to the substrate under a condition where a CVD reaction occurs.
10. The method according to claim 1 , wherein the element comprises a semiconductor element or a metal element.
11. The method according to claim 1 , wherein the element comprises silicon.
12. The method according to claim 1 , wherein the boron carbonitride film comprises SiBCN film, the carbonitride layer comprises SiCN layer, and the boron nitride layer comprises BN layer.
13. A method of manufacturing a semiconductor device, comprising:
(a) forming a carbonitride layer including an element and having a thickness of less than one atomic layer by performing a first set of steps a predetermined number of times, the first set of steps including:
(a-1) supplying a gas containing the element to a substrate to form an element-containing layer including the element;
(a-2) supplying a carbon-containing gas to the substrate to form a carbon-containing layer on the element-containing layer to form a layer including the element and carbon; and
(a-3) supplying a nitrogen-containing gas to the substrate to nitride the layer including the element and carbon;
(b) forming a boron nitride layer having a thickness of several atomic layers by performing a second set of steps a predetermined number of times, the second set of steps including:
(b-1) supplying a boron-containing gas to the substrate to form a boron-containing layer; and
(b-2) supplying a nitrogen-containing gas to the substrate to nitride the boron-containing layer to form a boron nitride layer; and
(c) alternately repeating (a) and (b) to form on the substrate a boron carbonitride film having the carbonitride layer and the boron nitride layer alternately stacked therein.
14. The method according to claim 13 , wherein the element-containing layer comprises at least one layer selected from a group consisting of a continuous deposition layer of the element, a discontinuous deposition layer of the element, a continuous chemisorption layer of the gas containing the element, and a discontinuous chemisorption layer of the gas containing the element.
15. The method according to claim 13 , wherein the carbon-containing layer comprises a discontinuous chemisorption layer of the carbon-containing gas.
16. The method according to claim 13 , wherein the carbon-containing layer comprises a chemisorption layer of the carbon-containing gas, an adsorption state of the chemisorption layer being unsaturated state.
17. The method according to claim 13 , wherein the boron-containing layer comprises a discontinuous chemisorption layer of the boron-containing gas.
18. The method according to claim 13 , wherein the boron-containing layer comprises a chemisorption layer of the boron-containing gas, an adsorption state of the chemisorption layer being unsaturated state.
19. The method according to claim 13 , wherein (a-3) comprises thermally nitriding the layer including the element and carbon under a condition where a nitridation reaction by the nitrogen-containing gas in the layer including the element and carbon is unsaturated.
20. The method according to claim 13 , wherein (b-2) comprises thermally nitriding the boron-containing layer under a condition where a nitridation reaction by the nitrogen-containing gas in the boron-containing layer is unsaturated.
21. The method according to claim 13 , wherein the element-containing layer comprises supplying the gas containing the element to the substrate under a condition where a CVD reaction occurs.
22. The method according to claim 13 , wherein the element comprises a semiconductor element or a metal element.
23. The method according to claim 13 , wherein the element comprises silicon.
24. The method according to claim 13 , wherein the boron carbonitride film comprises SiBCN film, the carbonitride layer comprises SiCN layer, and the boron nitride layer comprises BN layer.