Modification processing device, modification monitoring device and modification processing method
There is provided a technique for easily inspecting the modification state of a film in a semiconductor substrate. A modification processing device modifies a film by irradiating a semiconductor substrate with pulsed light emitted from a light irradiation part. The modification processing device includes an electromagnetic wave detection part for detecting an electromagnetic wave pulse including a millimeter wave or a terahertz wave radiated from the semiconductor substrate in response to the irradiation with the pulsed light. The modification processing device further includes a modification determination part for determining the modification state, based on the intensity of the electromagnetic wave pulse.
1. A modification processing device for modifying a film by irradiating a semiconductor substrate with light, comprising:
a light irradiation part for irradiating a semiconductor substrate with light for modifying said film;
an electromagnetic wave detection part for detecting the intensity of an electromagnetic wave including a millimeter wave or a terahertz wave radiated from said semiconductor substrate in response to the irradiation with light for modifying said film;
a modification determination part for determining the modification state of said film of said semiconductor substrate, based on changes generated due to modification of said film proceeded by the irradiation with said light in the intensity of said electromagnetic wave detected by said electromagnetic wave detection part; and
an irradiation control part for controlling the irradiation with light for modifying said film of said semiconductor substrate, based on a result of determination of said modification determination part.
2. The modification processing device according to claim 1 , further comprising
a PL light detection part for detecting photoluminescent light radiated from a surface of said semiconductor substrate by the irradiation with light from said light irradiation part,
wherein said modification determination part determines the modification of said semiconductor substrate, based on the intensity of the electromagnetic wave detected by said electromagnetic wave detection part and said photoluminescent light detected by said PL light detection part.
3. The modification processing device according to claim 1 , wherein
the light emitted from said light irradiation part is pulsed light which modifies the film of said semiconductor substrate and which generates an electromagnetic wave in said semiconductor substrate.
4. The modification processing device according to claim 1 , wherein
when said modification determination part determines that the modification of said film of a region irradiated with said light is completed, said light irradiation part stops the irradiation with said light.
5. A modification processing method of modifying a film by irradiating a semiconductor substrate with light, comprising the steps of:
(a) irradiating a semiconductor substrate with light for modifying a film;
(b) detecting the intensity of an electromagnetic wave including a millimeter wave or a terahertz wave radiated from said semiconductor substrate in response to the irradiation with light for modifying said film in said step (a);
(c) determining the modification state of said film of said semiconductor substrate, based on changes generated due to modification of said film proceeded by the irradiation with said light in the intensity of said electromagnetic wave detected in said step (b); and
(d) controlling the irradiation with light for modifying said film of said semiconductor substrate, based on a result of determination in said step (c).
6. The modification processing method according to claim 5 , wherein
when said step (c) determines that the modification of said film of a region irradiated with said light is completed, the irradiation with said light in said step (a) is stopped.
7. A non-transitory, computer-readable medium encoded with executable instructions that, when executed by one or more processors, cause a modification processing device to perform operations comprising:
irradiating, for a first period of time, a first area of a film of a semiconductor substrate with light for modifying the film of the semiconductor substrate;
detecting a first intensity of an electromagnetic wave at a first time within the first period of time and a second intensity of the electromagnetic wave at a second time within the first period of time, wherein the electromagnetic wave is generated from radiation of the light from the first area of the film of the semiconductor substrate during the first period of time;
determining a modification state of the film of the semiconductor substrate based on changes between the first intensity and the second intensity of the detected electromagnetic wave during the first period of time; and
adjusting the irradiation with the light for modifying the film of the semiconductor substrate according to a result of the determination of the modification state of the film of the semiconductor substrate.