IP Library › Granted Patent US 10,301,711
Granted Patent B2
US 10,301,711 · App. 14/867,232 · Granted May 28, 2019

Nickel based superalloy with high volume fraction of precipitate phase

Inventors: Dilip M Shah (Glastonbury, CT); Alan D Cetel (West Hartford, CT); Venkatarama K Seetharaman (Rocky Hill, CT)
Assignee: United Technologies Corporation
C22F1/10C22C19/056
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Quick Facts
Patent No.
US 10,301,711
App. No.
14/867,232
Granted
May 28, 2019
Kind
B2
Abstract

A process includes solution heat treating a nickel based superalloy with greater than about 40% by volume of gamma prime precipitate to dissolve the gamma prime precipitate in the nickel based superalloy; cooling the nickel based superalloy to about 85% of a solution temperature measured on an absolute scale to coarsen the gamma prime precipitate such that a precipitate structure is greater than about 0.7 micron size; and wrought processing the nickel based superalloy at a temperature below a recrystallization temperature of the nickel based superalloy. A material includes a nickel based superalloy with greater than about 40% by volume of gamma prime precipitate in which the precipitate structure is greater than about 0.7 micron size.

Claims (17)

1. A process, comprising:

solution heat treating a nickel based superalloy with greater than about 40% by volume of gamma prime precipitate to dissolve the gamma prime precipitate in the nickel based superalloy;

cooling the nickel based superalloy to about 85% of a solution temperature measured on an absolute scale to coarsen the gamma prime precipitate such that a precipitate structure is greater than about 0.7 micron size; and

wrought processing the nickel based superalloy at a temperature below a recrystallization temperature of the nickel based superalloy.

2. The process as recited in claim 1 , wherein the nickel based superalloy includes at least 50% by volume of gamma prime precipitate.

3. The process as recited in claim 1 , wherein the cooling is performed at a rate slower than about 10° F./minute.

4. The process as recited in claim 1 , wherein the cooling is a rapid cooling, then the temperature held for a period of time until the precipitate structure is greater than about 0.7 micron size.

5. The process as recited in claim 1 , wherein the wrought processing includes at least one of swaging, rolling, ring-rolling, forging, extruding, and shape forming operations.

6. The process as recited in claim 1 , further comprising annealing intermittently at temperatures no higher than the recrystallization temperature subsequent to the wrought processing to partially recover dislocation structure.

7. The process as recited in claim 6 , wherein the recrystallization temperature has an upper limit of about 90% of a solution temperature measured on an absolute scale.

8. The process as recited in claim 1 , further comprising heat treating at temperatures no higher than the recrystallization temperature subsequent to the wrought processing.

9. The process as recited in claim 8 , wherein the recrystallization temperature has an upper limit of about 90% of a solution temperature measured on an absolute scale.

10. The process as recited in claim 1 , wherein no additional precipitation is performed to the nickel based superalloy subsequent to the wrought processing.

11. The process as recited in claim 1 , wherein no additional heat treating is performed to the nickel based superalloy subsequent to the wrought processing.

12. The process as recited in claim 1 , wherein the nickel based superalloy is subjected to a solution heat treatment and slow cooled.

13. The process as recited in claim 1 , wherein the nickel based superalloy is subjected to a sub-solution temperature annealing cycle.

14. The process as recited in claim 1 , wherein the nickel based superalloy is subjected to isothermal over-aging.

Assignments (4)
CHANGE OF NAME Recorded Jul 27, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RTX CORPORATION
Reel/Frame 064714/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE AND REMOVE PATENT APPLICATION NUMBER 11886281 AND ADD PATENT APPLICATION NUMBER 14846874. TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 054062 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF ADDRESS. Recorded Mar 4, 2021
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 055659/0001 →
CHANGE OF NAME Recorded Sep 4, 2020
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 054062/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2015
From: SHAH, DILIP M; CETEL, ALAN D; SEETHARAMAN, VENKATARAMA K
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 036667/0983 →
Continuity (1)
Related Publication 20170088926A1 · Mar 30, 2017