IP Library Granted Patent US 9,490,606
Granted Patent B2
US 9,490,606 · App. 14/868,809 · Granted Nov 8, 2016

Optical component and its method of manufacture, and light emitting device and its method of manufacture

Inventor: Takeshi Okada (Tokushima, JP)
Assignee: NICHIA CORPORATION
H01S5/022C09K11/00H01S5/02296H01S5/02212H01S5/02469H01S5/32341
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Quick Facts
Patent No.
US 9,490,606
App. No.
14/868,809
Granted
Nov 8, 2016
Kind
B2
Abstract

An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face and an outer peripheral side surface, and an outer peripheral side surface, a fused first light-transmissive member formed between an inner wall of the through-hole and the outer peripheral side surface of the second light-transmissive member.

Claims (43)

1. An optical component comprising;

a support member having a through-hole,

a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face and an outer peripheral side surface,

a fused first light-transmissive member formed between an inner wall of the through-hole and the outer peripheral side surface of the second light-transmissive member.

2. The optical component according to claim 1 , wherein

the second light-transmissive member has a higher melting point than that of the first light-transmissive member.

3. The optical component according to claim 1 , wherein

the second light-transmissive member includes a phosphor.

4. The optical component according to claim 1 , wherein

the first light-transmissive member is made of an inorganic material.

5. The optical component according to claim 1 , wherein

the first light-transmissive member is made of a glass.

6. The optical component according to claim 1 , wherein

the inner of the through-hole wall expands from a light incidence face side toward a light emission face side.

7. The optical component according to claim 1 , wherein

the second light-transmissive member has a shape that widens from the light incidence face toward the light emission face.

8. The optical component according to claim 1 , further comprising;

a third light-transmissive member that covers the light emission face of the second light-transmissive member.

9. The optical component according to claim 8 , wherein

the third light-transmissive member is made of a material that has a melting point lower than that of the second light-transmissive member.

10. The optical component according to claim 8 , wherein

the third light-transmissive member includes a phosphor.

11. The optical component according to claim 8 , wherein

the third light-transmissive member includes a filler.

12. The optical component according to claim 1 , wherein

the second light-transmissive member is made of an ceramics.

13. The optical component according to claim 1 , wherein

the support member is made of a light reflective material.

14. A light emitting device comprising;

the optical component of claim 1 , and

a semiconductor laser element.

15. A method for manufacturing an optical member comprising;

forming a first light-transmissive member on an inner wall of a through-hole of a support member which has an incidence opening and an emission opening, and

fixing an outer peripheral side surface of a second light-transmissive member includes a light incidence face and a light emission face to the inner wall of the through-hole by fusion of the first light-transmissive member.

16. The method for manufacturing an optical member according to claim 15 further comprising;

forming a third light-transmissive member covering the emission face of the second light-transmissive member.

17. The method for manufacturing an optical member according to claim 16 further comprising;

polishing the third light-transmissive member from a side of the emission opening of the support member after forming the third light-transmissive member.

18. The method for manufacturing an optical member according to claim 15 , wherein

the second light-transmissive member is composed of ceramics including phosphors,

the second light-transmissive member is fixed to the inner wall of the through-hole by heating at a temperature above the melting point of the first light-transmissive member, and below the melting point of the second light-transmissive member.

19. A method for manufacturing a light emitting device comprising;

connecting the optical component of claim 15 to a semiconductor laser element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2015
From: OKADA, TAKESHI
To: NICHIA CORPORATION
Reel/Frame 036680/0396 →
Priority Claims (1)
JP 2014-202178 · Sep 30, 2014 · national
Continuity (1)
Related Publication 20160091171A1 · Mar 31, 2016