Optical component and its method of manufacture, and light emitting device and its method of manufacture
An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face and an outer peripheral side surface, and an outer peripheral side surface, a fused first light-transmissive member formed between an inner wall of the through-hole and the outer peripheral side surface of the second light-transmissive member.
1. An optical component comprising;
a support member having a through-hole,
a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face and an outer peripheral side surface,
a fused first light-transmissive member formed between an inner wall of the through-hole and the outer peripheral side surface of the second light-transmissive member.
2. The optical component according to claim 1 , wherein
the second light-transmissive member has a higher melting point than that of the first light-transmissive member.
3. The optical component according to claim 1 , wherein
the second light-transmissive member includes a phosphor.
4. The optical component according to claim 1 , wherein
the first light-transmissive member is made of an inorganic material.
5. The optical component according to claim 1 , wherein
the first light-transmissive member is made of a glass.
6. The optical component according to claim 1 , wherein
the inner of the through-hole wall expands from a light incidence face side toward a light emission face side.
7. The optical component according to claim 1 , wherein
the second light-transmissive member has a shape that widens from the light incidence face toward the light emission face.
8. The optical component according to claim 1 , further comprising;
a third light-transmissive member that covers the light emission face of the second light-transmissive member.
9. The optical component according to claim 8 , wherein
the third light-transmissive member is made of a material that has a melting point lower than that of the second light-transmissive member.
10. The optical component according to claim 8 , wherein
the third light-transmissive member includes a phosphor.
11. The optical component according to claim 8 , wherein
the third light-transmissive member includes a filler.
12. The optical component according to claim 1 , wherein
the second light-transmissive member is made of an ceramics.
13. The optical component according to claim 1 , wherein
the support member is made of a light reflective material.
14. A light emitting device comprising;
the optical component of claim 1 , and
a semiconductor laser element.
15. A method for manufacturing an optical member comprising;
forming a first light-transmissive member on an inner wall of a through-hole of a support member which has an incidence opening and an emission opening, and
fixing an outer peripheral side surface of a second light-transmissive member includes a light incidence face and a light emission face to the inner wall of the through-hole by fusion of the first light-transmissive member.
16. The method for manufacturing an optical member according to claim 15 further comprising;
forming a third light-transmissive member covering the emission face of the second light-transmissive member.
17. The method for manufacturing an optical member according to claim 16 further comprising;
polishing the third light-transmissive member from a side of the emission opening of the support member after forming the third light-transmissive member.
18. The method for manufacturing an optical member according to claim 15 , wherein
the second light-transmissive member is composed of ceramics including phosphors,
the second light-transmissive member is fixed to the inner wall of the through-hole by heating at a temperature above the melting point of the first light-transmissive member, and below the melting point of the second light-transmissive member.
19. A method for manufacturing a light emitting device comprising;
connecting the optical component of claim 15 to a semiconductor laser element.