IP Library Granted Patent US 11,117,311
Granted Patent B2
US 11,117,311 · App. 14/874,963 · Granted Sep 14, 2021

Amorphous polyaryletherketone and blends thereof for use in additive manufacturing

Inventors: Hemant Bheda (Saratoga, CA); Riley Reese (Sunnyvale, CA)
Assignee: Arevo, Inc.
B29C64/118B33Y10/00B33Y70/00C08L71/00C08L71/10C09D161/16G03G15/00G03G15/224G03G15/225B29K2071/00B29K2105/16B29K2105/162B29K2995/004B29K2995/0039
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Quick Facts
Patent No.
US 11,117,311
App. No.
14/874,963
Granted
Sep 14, 2021
Kind
B2
Abstract

A material for use in a fused filament fabrication (FFF) printer comprises a polyaryletherketone (PAEK) having an amorphous morphology. In some embodiments, the material also includes a PAEK having a semi-crystalline morphology.

Claims (20)

1. A method for forming a filament of a blended material for use as a deposition material in a fused-filament-fabrication (FFF) printer, the method comprising:

(a) providing (i) a first compound comprising a first polyaryletherketone (PAEK) having an amorphous morphology and (ii) a second compound having a semi-crystalline morphology, wherein a weight ratio of the first compound to the second compound is at least 1:1 and a degree of crystallinity of the second compound is about 80%;

(b) forming a mixed material by physically mixing the first compound in a powder form and the second compound in a powder form in a mixing device;

(c) subsequent to (b), feeding the mixed material into a hopper of an extruder, wherein said hopper is different device than the mixing device, and forming the blended material by heating the mixed material to a temperature that is the greater of:

(1) a glass transition temperature of the first compound, and

(2) a melting point of the second compound; and

(d) extruding the blended material through a die of the extruder to form the filament for use in the FFF printer.

2. The method of claim 1 , wherein forming the mixed material further comprises adding a filler material whose melting temperature is higher than the glass transition temperature of the first compound and the melting point of the second compound.

3. The method of claim 2 , wherein the filler material is selected from the group consisting of chopped carbon fibers, chopped glass fibers, chopped aramid fibers, continuous carbon fiber, continuous glass fiber, continuous polyethylene fiber, milled carbon, milled glass, graphite, graphene, carbon nanotubes, and graphene nanoplatelets.

4. The method of claim 1 , wherein the second compound comprises a second PAEK.

5. The method of claim 4 , wherein the first PAEK and the second PAEK have the same chemical composition as one another.

6. The method of claim 4 , wherein the second PAEK has a different chemical composition than the first PAEK.

7. The method of claim 1 , wherein the second compound does not include a PAEK.

8. The method of claim 1 , wherein the first compound in (a) further comprises an additional PAEK different than the first PAEK, and wherein in (b) the mixed material includes the additional PAEK.

9. The method of claim 1 , wherein the first compound comprises polyetheretherketone.

10. The method of claim 1 , further comprising winding the filament into a roll.

11. The method of claim 1 , wherein (a) further comprises providing a third compound comprising a second PAEK having an amorphous morphology and having a differing degree of crystallinity than the first PAEK.

12. The method of claim 4 , wherein the first PAEK and the second PAEK are independently selected from the group consisting of polyetherketone (PEK), polyetheretherketone (PEEK), and polyetherketoneketone (PEKK).

13. The method of claim 7 , wherein the second compound is selected from the group consisting of polyetherimide (PEI), polyethersulphone (PES), polysulfone (PSU), polyphenylsulfone (PPSU), polylactic acid (PLA), polyglucolic acid (PGA), polyamide-imide (PAI), polystyrene (PS), polyamide (PA), poly(p-phenylene sulfide (PPS), polyethersulfone (PESU), and polycarbonate (PC).

14. The method of claim 1 , further comprising, prior to (b), drying the first compound and the second compound to remove moisture from the first compound and the second compound.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Sep 20, 2023
From: MCGEARY CUKOR LLC
To: AREVO INC
Reel/Frame 064959/0783 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2023
From: AREVO, INC.
To: STRATASYS, INC.
Reel/Frame 064942/0384 →
SECURITY INTEREST Recorded Aug 31, 2023
From: AREVO, INC
To: MCGEARY CUKOR LLC
Reel/Frame 064789/0954 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2015
From: BHEDA, HEMANT; REESE, RILEY
To: AREVO, INC.
Reel/Frame 036728/0121 →
Continuity (1)
Related Publication 20170096576A1 · Apr 6, 2017
Cited By (1)
US 12,624,166